Multilayer ceramic capacitor AIDE CAPACITOR 0603X7S225K100NT designed for AC DC converter and network
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
This document specifies 0603(X7S) surface-mount ceramic capacitors designed for high-voltage electronic circuits. These capacitors are suitable for coupling, filtering, and resonant applications, including switch mode power supplies (SMPS), AC-DC and DC-DC converters, network/communication interfaces, LCD module backlight power supplies, and energy-saving lamp ballasts. They are classified as high-voltage multilayer ceramic capacitors (MLCCs).
Product Attributes
- Temperature Characteristic: X7S (22%)
- Terminal Material: Copper/Silver-Nickel-Tin (from inside to outside)
- Packaging Options: Tape & Reel (T), Bulk (P - PE bag, can be omitted)
- Environmental Compliance: RoHS Directive, REACH Regulation (SVHC)
Technical Specifications
| Item | Specification | Test Method |
|---|---|---|
| Application Range | High-voltage electronic circuits (coupling, filtering, resonance) | - |
| Standard Conditions |
| - |
| Relative Standard Conditions |
| - |
| Product Code Structure |
| - |
| Product Structure |
| - |
| Product Dimensions (0603) |
| - |
| Operating Temperature Range | -55~+125 | Visual inspection, vernier caliper measurement |
| Capacitance Tolerance | Within specified tolerance |
|
| Dissipation Factor (DF Value) | Refer to Note 1 for X7R/X5R/X6S/X7S/Y5V characteristics |
|
| Insulation Resistance (IR) |
| Test Voltage: 500V (if Rated Voltage 500V), Rated Voltage (if Rated Voltage <500V); Test Time: 605 sec; Humidity: 75%; Temp: 255; Charge/discharge current: 50mA |
| Dielectric Strength (DC) | No dielectric breakdown or damage |
|
| Solderability | Soldering rate > 90%; No visible damage | Preheat: 80-120 (10-30 sec); Solder Temp: 2455; Soldering Time: 20.5 sec |
| Soldering Heat Resistance | No visible damage, Soldering rate 90% | Preheat: 100-200 (102 sec); Immersion Temp: 2605; Immersion Time: 51 sec. Post-cleaning. Rest for 242 hours at room temp. |
| Bending Strength | No visible damage | Test substrate: Al2O3 or PCB; PCB dimensions: 1.6mm thickness, 100mm length, 40mm width; Bending depth: 1mm; Pressing speed: 0.5mm/sec. Measurement during bending. |
| Terminal Bond Strength | No visible damage | - |
| Temperature Cycling |
| 5 cycles: Lower temp (303 min), Room temp (2-3 min), Upper temp (303 min), Room temp (2-3 min). Post-conditioning: 242 hours at room temp/humidity. |
| Moisture Resistance |
| Temp: 402; Humidity: 90~95%RH; Time: 50024 hours. Post-conditioning: 24 hours at room temp/humidity. |
| High Temperature Load Test |
| Temp: 853; Time: 100048 hours. Voltage: 2x Rated Voltage (100VV250V), 1.5x Rated Voltage (250V<V<1KV), 1.2x Rated Voltage (1KVV). Post-conditioning: 484 hours at room temp/humidity. |
| PCB Bending Performance | No cracks or defects | - |
| Packaging Dimensions (Tape & Reel) | Refer to page 8 for detailed dimensions (0805 to 1812) | - |
| Packaging Dimensions (Paper Tape) | Refer to page 9 for detailed dimensions (0201 to 1206) | - |
| Packaging Quantity (Pieces per reel) |
| - |
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