High voltage MLCC AIDE CAPACITOR 1206X5R476M160NT suitable for AC DC DC DC power chargers and LCD backlight power units
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. The MLCCs are available in a range of dimensions and temperature characteristics, with options for different capacitance tolerances, rated voltages, and terminal compositions. They are offered in tape/reel and bag packing options.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description | Specification | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | High voltage circuits | |||||||||||
| Function | Coupling, wave filtering, resonant | |||||||||||
| Applications | Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | |||||||||||
| Type | Medium and High voltage MLCC | |||||||||||
| Testing Conditions (Normal) | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||||||||||
| Testing Conditions (Relative) | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||||||||||
| Part Number Description | 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | ||||||||||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |||||||||||
| 3. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |||||||||||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |||||||||||
| 5. Rated Voltage (DC) | 25025, 251250, 2522500 (V) | |||||||||||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |||||||||||
| 7. Packing | T Tape/Reel, P Bag packing(PE) | |||||||||||
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickle layer, 5. Tin layer | |||||||||||
| Dimension (mm) | See table below | |||||||||||
| Temperature Range | -55~+125 | |||||||||||
| Dimensions (mm) | Part Number | L | W | T | WB | |||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | ||||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | ||||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | ||||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | ||||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | ||||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | ||||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | ||||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | ||||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | ||||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | ||||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | ||||||||
| Specifications & Testing Method | Item | Specification/Requirement | Testing Method | |||||||||
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||||||||||
| Static Capacity | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | Refer to detailed specification | ||||||||||
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr) X7R/X7T/X7P: See Note 1 | Refer to detailed specification | ||||||||||
| IR Insulation Resistance | NPO: IR50000M (C10nF), IR*Cr500S (C>10nF) X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C>25nF) | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||||||||||
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | ||||||||||
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s | ||||||||||
| Resistance to the heat of soldering | No visual damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||||||||
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | Refer to detailed specification | ||||||||||
| Flexural Strength | No damage. Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB, PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. | ||||||||||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | ||||||||||
| Thermal Shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after 242 hours normal temp & humidity. | ||||||||||
| Temperature Moisture Exposure | Visual: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after 242 hours normal temp & humidity. | ||||||||||
| High Temperature Exposure | Visual: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after 48 hours under normal pressure & temperature. | ||||||||||
| PCB Flexural Strength | No crack and other defect | Refer to diagram and table on Page 7. | ||||||||||
| Embossed Plastic Taping | Code | Tape size (mm) | A | B | C | D | E | F | G | H | J | T |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max | ||
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max | ||
| Paper Tape Reel Packing | Code | Paper size (mm) | W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below | ||
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | ||
| Reel Dimensions (mm) | Unit: mm | A | B | C | D | E | F | G | H | J | T | |
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||||
| Packing Quantity | Size | Paper T/R (Pcs) | Plastic T/R (Pcs) | |||||||||
| 0603 | 4000 | - | ||||||||||
| 0805 | 4000 | 3000 (T1.35mm) | ||||||||||
| 1206 | - | 3000 (T>1.35mm) | ||||||||||
| 1210 | - | 2000 (T1.60mm) | ||||||||||
| 1808 | - | 3000 (T>1.60mm) | ||||||||||
| 1812 | - | 2000 (T1.85mm) | ||||||||||
| 1812 | - | 1000 (T>1.85mm) | ||||||||||
Precautions For Use:
- MLCCs may fail in a short circuit mode when subjected to severe conditions beyond specified ratings, potentially causing burn out, flaming, or glowing. Follow safety precautions and application notes.
- Soldering Profile: To avoid cracks due to sudden temperature changes, follow the recommended temperature profile.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure careful handling of the soldering iron and proper tip selection/temperature.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering Method: RReflow Soldering, WWave Soldering. Specific recommendations vary by size, temperature characteristic, rated voltage, and capacitance.
- Soldering Temperature Profile: Keep the temperature difference between soldering temperature and surface temperature of chips 150 during preheating.
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina