RoHS Compliant Multi Layer Ceramic Capacitor AIDE CAPACITOR 1210X5R107M160NT for LCD Backlight Unit Power Supplies
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Delivery Time:
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Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications including coupling, wave filtering, and resonant functions. It is suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance in demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description/Specification | Testing Method | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | |||||||||||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | |||||||||||
| Testing Conditions | |||||||||||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | ||||||||||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||||||||
| Part Number Description Example: 1812 X7R 684 M 251 N T | |||||||||||
| 1. Dimension Code | 0201 (0.02*0.01 inch / 0.50*0.25 mm), 0402 (0.04*0.02 inch / 1.00*0.50 mm), 0603 (0.06*0.03 inch / 1.60*0.80 mm), 0805 (0.08*0.05 inch / 2.00*1.25 mm), 1206 (0.12*0.06 inch / 3.20*1.60 mm), 1210 (0.12*0.10 inch / 3.20*2.50 mm), 1808 (0.18*0.08 inch / 4.50*2.00 mm), 1812 (0.18*0.12 inch / 4.50*3.20 mm), 1825 (0.18*0.25 inch / 4.50*6.30 mm), 2211 (0.22*0.11 inch / 5.70*2.8 mm), 2225 (0.22*0.25 inch / 5.70*6.30 mm) | ||||||||||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||||||||
| 3. Nominal Electrostatic Capacity | 8R0 (8.0 pF), 100 (10 pF), 101 (100 pF) | ||||||||||
| 4. Tolerance of Electrostatic Capacity | B (0.1pF), C (0.25pF), D (0.5pF), F (1%), G (2%), J (5%), K (10%), M (20%), Z (+80%/-20%) | ||||||||||
| 5. Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | ||||||||||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||||||||||
| 7. Packing | T (Tape/Reel), P (Bag packing) | ||||||||||
| Construction and Dimension | |||||||||||
| Construction Items | Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer | ||||||||||
| Dimension (mm) | Part Number 0201 (0603) 0402 (1005) 0603 (1608) 0805 (2012) 1206 (3216) 1210 (3225) 1808 (4520) 1812 (4532) 1825 (4563) 2220 (5750) 2225 (5763) | L 0.600.10 1.000.15 1.600.20 2.000.20 3.200.30 3.200.30 4.500.40 4.500.40 4.500.40 5.700.50 5.700.50 | W 0.300.05 0.500.15 0.800.15 1.250.20 1.600.30 2.500.30 2.000.20 3.200.30 6.300.50 5.000.50 6.300.50 | T 0.300.05 0.500.10 0.800.15 0.800.20 1.000.20 0.800.30 0.800.30 0.800.30 0.800.30 1.000.40 1.000.40 | WB 0.100.05 0.200.10 0.300.10 0.500.20 0.600.30 0.800.30 0.800.30 0.800.30 0.800.30 1.000.40 1.000.40 | ||||||
| Specification and Testing Method | |||||||||||
| Temperature | -55~+125 | ||||||||||
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |||||||||
| Static Capacity | NPO characteristic: 1000pF: 1MHz10%, 1.00.2Vrms 1000pF: 1KHz10%, 1.00.2Vrms X7R/X7T/X7P characteristic: 10uF: 1KHz10%, 1.00.2Vrms 10uF: 120Hz24, 0.50.1Vrms | ||||||||||
| Dissipation Factor (DF) | NPO Characteristic: DF0.56, Cr5 pF DF1.5[(150/Cr)+7]10-4 (5pFCr50pF) DF0.15%, (50pFCr) Cr1000pF, 110%MHz, 1V0.2rms Cr1000pF, 110%KHz, 1V0.2rms X7R/X7T/X7P characteristic: Cr10uF, 110%KHz, 1V0.1rms. Cr10uF, 12024Hz, 0.5V0.1rms. | ||||||||||
| IR Insulation Resistance | NPO Characteristic: IR50000M, C10nF IR*Cr500S, C10nF Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA X7R/X7T/X7P Characteristic: IR10000M, C25nF IR*Cr100S, C25nF | ||||||||||
| Hi-pot (DC) | No dielectric breakdown or damage Ur=100V, ... 2.5 x rated voltage Ur=200V/250V, .... 2.0 x rated voltage Ur=450/500/630V, 1.5 x rated voltage 1KVUr2KV, ....... 1.2 x rated voltage 2KVUr, ............... 1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time: 2S | ||||||||||
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s | |||||||||
| Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |||||||||
| Electrostatic Capacity Change Rate | NPO Characteristic: C/C0.5% or 0.5pF (larger reading) X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | ||||||||||
| Flexural Strength | No damage Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | |||||||||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |||||||||
| Thermal Shock | NPO Characteristic: C/C2.5% or 0.25pF (larger reading) X7R/X7P characteristic: C/C0.5% X7T characteristic: C/C10% | Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. | |||||||||
| Temperature Moisture Exposure | NPO characteristic: C/C2% or 1pF (larger reading) X7R/X7T/X7P characteristic: C/C10% DF 2 times initial standard NPO characteristic: IR2500M or IR*Cr25S (Lower reading) X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | Temperature 402, Humidity 90~95%RH, time 500+24 hours. Test it after place 242 hours normal temp & humidity. | |||||||||
| High Temperature Exposure | NPO: C/C2% or 1pF (larger reading) X7R/X7T/X7P: C/C20% DF 2 X initial standard NPO: IR4000M or IR*Cr40S (Lower reading) X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test it after place 48 hours under normal pressure & temperature. | |||||||||
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB, Then pressing direction base on the photo. | |||||||||
| Embossed Plastic Taping Dimensions (mm) | Code 0805 1206 1210 1808 1812 | A 1.55 0.20 1.95 0.20 2.70 0.10 2.20 0.10 3.66 0.10 | B 2.35 0.20 3.60 0.20 3.42 0.10 4.95 0.10 4.95 0.10 | C 8.00 0.20 8.00 0.20 8.00 0.10 12.00 0.10 12.00 0.10 | D 3.50 0.05 3.50 0.05 3.50 0.05 5.50 0.05 5.50 0.05 | E 1.75 0.10 1.75 0.10 1.75 0.10 1.75 0.10 1.75 0.10 | F 4.00 0.10 4.00 0.10 4.00 0.10 4.00 0.10 8.00 0.10 | G 2.00 0.10 2.00 0.10 2.00 0.05 2.00 0.05 2.00 0.05 | H 4.00 0.10 4.00 0.10 4.00 0.10 4.00 0.10 4.00 0.10 | J 1.50 -0/+0.10 1.50 -0/+0.10 1.55 -0/+0.10 1.50 -0/+0.10 1.55 -0/+0.10 | T 1.50 Max 1.85 Max 3.2 Max 3.0 Max 4.0 Max |
| Paper Tape Reel Packing Dimensions (mm) | Code 1005 0201 0402 | W1 0.240.02 0.370.10 0.650.10 | L1 0.450.02 0.670.10 1.150.10 | D 8.000.10 8.000.10 8.000.10 | C 3.500.05 3.500.05 3.500.05 | B 1.750.10 1.750.10 1.750.10 | P1 2.000.05 2.000.05 2.000.05 | P2 2.000.05 2.000.05 2.000.05 | P0 4.000.10 4.000.10 4.000.10 | d 1.50 -0/+0.10 1.50 -0/+0.10 1.50 -0/+0.10 | t Below 0.30 Below 0.80 Below 0.80 |
| Paper Tape Reel Packing Dimensions (mm) | Code 0603 0805 1206 | A 1.10 0.10 1.45 0.15 1.80 0.20 | B 1.90 0.10 2.30 0.15 3.40 0.20 | C 8.00 0.10 8.0 0.15 8.00 0.20 | D 3.50 0.05 3.50 0.05 3.50 0.05 | E 1.75 0.10 1.75 0.10 1.75 0.10 | F 4.00 0.10 4.00 0.10 4.00 0.10 | G 2.00 0.10 2.00 0.10 2.00 0.10 | H 4.00 0.10 4.00 0.10 4.00 0.10 | J 1.50 -0/+0.10 1.50 -0/+0.10 1.50 -0/+0.10 | T 1.10 Max 1.10 Max 1.10 Max |
| Reel Dimensions (mm) | 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | ||||||||||
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | Standard | |||||||||
| Packing Quantity | Paper T/R (Pcs): 0603: 4000, 0805: 4000, 1206: 4000 Plastic T/R (Pcs): 0805: 3000, 1206: 3000 (T1.35mm), 1210: 2000 (T1.60mm), 1808: 3000 (T>1.60mm), 1812: 2000, 1812: 1000 (T1.85mm), 800 (T>1.85mm), 500 | ||||||||||
| Precautions For Use | |||||||||||
| Soldering Profile | To avoid the crack problem by sudden temperature change, follow the temperature profile in the adjacent graph. | ||||||||||
| Manual Soldering | Caution required to avoid thermal cracks. Ensure careful handling of soldering iron tip and temperature contact. | ||||||||||
| Recommended Soldering Method | Size 1005: NPO/R, X7R/X5R/X7S/X6S/R 0201: NPO/R, X7R/X5R/X7S/X6S/R, Y5V/R 0402: NPO/R, X7R/X5R/X7S/X6S/R, Y5V/R 0603: NPO/R/W, X7R/X5R/X7S/X6S (C1uf R, C1uf R/W), Y5V (C1uf R, C1uf R/W) 0805: NPO/R/W, X7R/X5R/X7S/X6S (C4.7uf R, C4.7uf R/W), Y5V (C1uf R, C1uf R/W) 1206: NPO/R/W, X7R/X5R/X7S/X6S (C10uf R, C10uf R/W), Y5V (C10uf R, C10uf R/W) 1210: NPO/R, X7R/X5R/X7S/X6S/R, Y5V/R Soldering method: RReflow Soldering, WWave Soldering | ||||||||||
| Soldering Temperature Profile | Keep the temperature difference between soldering temperature and surface temperature of chips as T150 during preheating. | ||||||||||
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina