Ceramic capacitor AIDE CAPACITOR 0805X7R104K251NT designed for in switch power supplies networking and LCD backlight units
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in a range of sizes and temperature characteristics, offering reliable performance under specified conditions.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description/Specification | Testing Method/Conditions |
|---|---|---|
| Application Field | ||
| Coupling, wave filtering, resonant in high voltage circuits | Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | |
| Testing Conditions | ||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | (No special requirements) |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | For data not matching testing specification |
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | (See Page 1 for L*W in inch and mm) |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| 3. Nominal Electrostatic Capacity | 8R0=8.0, 100=10, 101=100 (pF) | |
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| 5. Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | |
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |
| 7. Packing | T Tape/Reel, P Bag packing (PE) | |
| Construction and Dimension | ||
| Construction | 1 Ceramic dielectric, 2 Inner electrode, 3 Outer electrode, 4 Nickel layer, 5 Tin layer | |
| Dimension (mm) | (See Page 2 for detailed L, W, T, WB for each size code) | British system, Metric system |
| Specification and Testing Method | ||
| Temperature | -55~+125 | |
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital caliper |
| Static Capacity | Meet standard specification and tolerance | (See Page 3 for NPO and X7R/X7T/X7P characteristics, frequency, and voltage) |
| Dissipation Factor (DF) | (See Page 3 for NPO and X7R/X7T/X7P characteristics) | |
| IR Insulation Resistance | (See Page 3 for NPO and X7R/X7T/X7P characteristics) | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| Hi-pot (DC) | No dielectric breakdown or damage | (See Page 3 for voltage multiplier based on Ur) Voltage Raising time: 110S, Voltage maintaining time: 2S |
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s |
| Resistance to the heat of soldering | No damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| Electrostatic capacity change rate | (See Page 5 for NPO, X7R, X7T, X7P characteristics) | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. |
| Flexural strength | No damage, Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB, PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm, Bend speed: 0.5mm/sec. |
| Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal shock | (See Page 6 for NPO, X7R/X7P, X7T characteristics) | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. |
| Temperature moisture exposure | Visual: No visual damage. Electrostatic capacitance change rate: (See Page 6). DF 2 times initial standard. IR: (See Page 6). | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity. |
| High temperature exposure | Visual: No visual damage. Electrostatic capacitance change rate: (See Page 7). DF 2 X initial standard. IR: (See Page 7). | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test it after place 48 hours under normal pressure & temperature. |
| PCB flexural strength | No crack and other defect | Soldering the MLCC on the PCB, then pressing direction base on the photo. (See Page 8 for SIZE A, B, C values) |
| Embossed Plastic Taping | ||
| Taping Dimensions | (See Page 8 for A, B, C, D, E, F, G, H, J, T for 0805 to 1812 types) | |
| Paper Tape Reel Packing | ||
| Taping Dimensions | (See Page 9 for W1, L1, D, C, B, P1, P2, P0, d, t for 1005, 0201, 0402, 0603, 0805, 1206 types) | |
| Reel Dimensions | ||
| Dimensions | (See Page 10 for A, B, C, D, E, F, G, H, J, T for 7' and 13' Reels) | Unit: mm |
| Taping Specification | ||
| Top tape peeling strength | 0.1N | (a) Paper Taping, (b) Embossed Taping. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. |
| Packing Quantity | ||
| Quantity per Reel | (See Page 11 for Paper T/R and Plastic T/R quantities for various sizes) | |
| Precautions For Use | ||
| Soldering Profile | Avoid crack problem by sudden temperature change. | Follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page). |
| Manual Soldering | Risk of creating thermal cracks. | Handle soldering iron carefully, pay attention to tip selection and temperature contact. |
| Recommended Soldering Method | ||
| Method | RReflow Soldering, WWave Soldering | (See Page 13 for recommended methods based on Size, Temperature Characteristics, Rated Voltage, and Capacitance) |
| Soldering Temperature Profile | ||
| Temperature Difference | T 150 | Keep the temperature difference between soldering temperature and surface temperature of chips during preheating. |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina