Ceramic Capacitor AIDE CAPACITOR 0603X5R475K350NT Ideal for Energy Saving Lamp Ballasts Applications
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. The MLCCs are available in various standard sizes and temperature characteristics, offering reliable performance in demanding electrical environments.
Product Attributes
- Certifications: RoHS compliant, REACH compliant
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- Material: Ceramic dielectric, Inner electrode, Outer electrode
Technical Specifications
| Item | Description/Specification | Testing Method | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | ||||||||||
| Coupling, wave filtering, resonant in high voltage circuits | ||||||||||
| Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | ||||||||||
| Testing Conditions | ||||||||||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||||||||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||||||||
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||||||||||
| Item 1: Dimension Code | 0201 (0.02*0.01 inch / 0.50*0.25 mm) to 2225 (0.22*0.25 inch / 5.70*6.30 mm) | |||||||||
| Item 2: Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |||||||||
| Item 3: Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF | |||||||||
| Item 4: Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |||||||||
| Item 5: Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | |||||||||
| Item 6: Terminal Composition | Au/Ag-Ni-Sn | |||||||||
| Item 7: Packing | T: Tape/Reel, P: Bag packing (PE) | |||||||||
| Construction | ||||||||||
| 1 | Ceramic dielectric | |||||||||
| 2 | Inner electrode | |||||||||
| 3 | Outer electrode | |||||||||
| 4 | Nickel layer | |||||||||
| 5 | Tin layer | |||||||||
| Dimension (mm) | ||||||||||
| Part Number Code | L | W | T | WB | ||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | ||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | ||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | ||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | ||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | ||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | ||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | ||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | ||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | ||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | ||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | ||||||
| Specification and Testing Method | ||||||||||
| Temperature | -55~+125 | |||||||||
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||||||||
| Static Capacity | Meet standard specification and tolerance | |||||||||
| Dissipation Factor (DF) | See details in source document | |||||||||
| IR Insulation Resistance | NPO: 50000M (C10nF), IR*Cr500S (C>10nF) X7R/X7T/X7P: 10000M (C25nF), IR*Cr100S (C>25nF) | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||||||||
| Hi-pot (DC) | No dielectric breakdown or damage | Voltage Raising time: 110S, Voltage maintaining time: 2S | ||||||||
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s | ||||||||
| Resistance to the heat of soldering | No damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||||||
| Electrostatic Capacity Change Rate | NPO: 0.5% or 0.5pF X7R: 15% X7T: -33% C/C 22% X7P: 10% | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. | ||||||||
| Flexural Strength | No damage | Base board: Al2O3 /PCB, PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. | ||||||||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | ||||||||
| Thermal Shock | NPO: 2.5% or 0.25pF X7R/X7P: 0.5% X7T: 10% | Run 5 cycles. Test after 242 hours normal temp & humidity. | ||||||||
| Temperature Moisture Exposure | Visual: No visual damage Capacity Change Rate: NPO: 2% or 1pF, X7R/X7T/X7P: 10% DF: 2 times initial standard IR: NPO: 2500M or IR*Cr25S, X7R/X7T/X7P: 1000M or IR*Cr25S | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after 242 hours normal temp & humidity. | ||||||||
| High Temperature Exposure | Visual: No visual damage Capacity Change Rate: NPO: 2% or 1pF, X7R/X7T/X7P: 20% DF: 2 X initial standard IR: NPO: 4000M or IR*Cr40S, X7R/X7T/X7P: 2000M or IR*Cr50S | Temperature 1253, Time 100048 hours. Test after 48 hours under normal pressure & temperature. | ||||||||
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB, then pressing direction based on diagram. | ||||||||
| Embossed Plastic Taping Dimensions (mm) | ||||||||||
| Code | Tape size A | B | C | D | E | F | G | H | J | T |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max |
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max |
| Paper Tape Reel Packing Dimensions (mm) | ||||||||||
| Code | Paper size W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below |
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below |
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| Reel Dimensions (unit: mm) | ||||||||||
| Unit | A | B | C | D | E | F | G | |||
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| Packing Quantity | ||||||||||
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) | ||||||||
| 0603 | 4000 | |||||||||
| 0805 | 4000 | 3000 (T1.35mm) | ||||||||
| 1206 | 3000 (T>1.35mm) | |||||||||
| 1210 | 2000 (T1.60mm) | |||||||||
| 1808 | 3000 (T>1.60mm) | |||||||||
| 1812 | 2000 | |||||||||
| 1812 above | 1000 (T1.85mm) | |||||||||
| 1000 (T>1.85mm) | ||||||||||
| 800 | ||||||||||
| 500 | ||||||||||
| Precautions For Use | ||||||||||
| Soldering Profile | To avoid crack problem by sudden temperature change, follow the temperature profile in the adjacent graph. | |||||||||
| Manual Soldering | Risk of thermal cracks. Handle soldering iron carefully, pay attention to tip selection and temperature contact. | |||||||||
| Optimum Solder Amount for Reflow Soldering | Recommended | |||||||||
| Recommended Soldering Method | RReflow Soldering, WWave Soldering | |||||||||
| Soldering Temperature Profile | Keep temperature difference between soldering temperature and surface temperature of chips as T150 during preheating. | |||||||||
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina