Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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AIDE CAPACITOR 0603C0G102J500NT high voltage MLCC designed for LCD backlight units and power charger circuits

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Product Description

Product Overview

This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and lighting circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance under specified conditions.

Product Attributes

  • Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
  • Certifications: ROHS/REACH compliant

Technical Specifications

Item Description Specification
Application Field Coupling, wave filtering, resonant in high voltage circuits
Switch power supplier
AC-DC power charger
DC-DC power charger
Networking/Communication interface
LCD backlight unit power supplier
Amperite of energy saving lamps
(Medium and High voltage MLCC)
Testing Conditions Normal Condition: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa
Relative Condition: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa
Initial Testing Pre-condition: Pre-heating 150 for 1 hour, then 48 hours under normal pressure & temperature.
Part Number Description Dimension Code: 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225
Temperature Characteristic: C0G (030 PPM/), X7R (15%), X5R (15%)
Nominal Electrostatic Capacity: 8R08.0, 10010, 101100 (pF)
Tolerance of Electrostatic Capacity: B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
Rated Voltage (DC): 250 25V, 251 250V, 252 2500V
Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
Packing: T Tape/Reel, P Bag packing (PE)
Construction and Dimension Construction: 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickle layer, 5. Tin layer
Dimension (mm) - British System: 0201 (0.02*0.01), 0402 (0.04*0.02), 0603 (0.06*0.03), 0805 (0.08*0.05), 1206 (0.12*0.06), 1210 (0.12*0.10), 1808 (0.18*0.08), 1812 (0.18*0.12), 1825 (0.18*0.25), 2211 (0.22*0.11), 2225 (0.22*0.25)
Dimension (mm) - Metric System: 0201 (0.50*0.25), 0402 (1.00*0.50), 0603 (1.60*0.80), 0805 (2.00*1.25), 1206 (3.20*1.60), 1210 (3.20*2.50), 1808 (4.50*2.00), 1812 (4.50*3.20), 1825 (4.50*6.30), 2211 (5.70*2.8), 2225 (5.70*6.30)
Dimensions (mm) with Tolerances:
Part NumberDimension (mm) LWTWB
0201 (0603)0.600.100.300.050.300.050.100.05
0402 (1005)1.000.150.500.150.500.100.200.10
0603 (1608)1.600.200.800.150.800.150.300.10
0805 (2012)2.000.201.250.200.800.201.000.20
1206 (3216)3.200.301.600.301.000.201.250.20
1210 (3225)3.200.302.500.302.700.800.30
1808 (4520)4.500.402.000.202.700.800.30
1812 (4532)4.500.403.200.303.500.800.30
1825 (4563)4.500.406.300.503.500.800.30
2220 (5750)5.700.505.000.503.501.000.40
2225 (5763)5.700.506.300.506.201.000.40
Temperature Characteristic:
CharacteristicTolerance
C0G030 PPM/
X7R15%
X5R15%
Specification and Testing Method:
NoItemSpecification/RequirementTesting method
1Temperature-55~+125-
2Visual/Dimension1, No Damage 2, Dimension meet SpecNaked eye (Visual inspection), Digital calliper
3Static CapacityMeet standard specification and toleranceNPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF). X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF)
4Dissipation Factor (DF)NPO: DF0.56 (Cr5pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr). X7R/X7T/X7P: See Note 1.NPO: 1MHz10%, 1V0.2rms (Cr1000pF); 1KHz10%, 1V0.2rms (Cr1000pF). X7R/X7T/X7P: 1KHz10%, 1V0.1rms (Cr10uF); 120Hz24, 0.5V0.1rms (Cr10uF).
5IR Insulation ResistanceNPO: IR50000M (C10nF), IR*Cr500S (C10nF). X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C25nF).Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA
6Hi-pot (DC)No dielectric breakdown or damage. Ur=100V,...2.5x rated voltage; Ur=200V/250V,...2.0x rated voltage; Ur=450/500/630V,...1.5x rated voltage; 1KVUr2KV,...1.2x rated voltage; 2KVUr,...1.1x rated voltage.Voltage Raising time: 110S, Voltage maintaining time: 2S
7SolderabilitySoldering area90%Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s.
8Resistance to the heat of solderingVisual-No damage, soldering area90%Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.
9Flexural strengthNo damageBase board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status.
10Terminal bonding strengthNo visual damageApplied Force: 5N, Duration: 101S
11Thermal shockNPO: C/C2.5% or 0.25pF. X7R/X7P: C/C0.5%. X7T: C/C10%.Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after placing 242 hours at normal temp & humidity.
12Temperature moisture exposureVisual: No visual damage. Capacitance change rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S. X7R/X7T/X7P: IR1000M or IR*Cr25S.Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after placing 242 hours at normal temp & humidity.
13High temperature exposureVisual: No visual damage. Capacitance change rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S. X7R/X7T/X7P: IR2000M or IR*Cr50S.Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after placing 48 hours under normal pressure & temperature.
14PCB flexural strengthNo crack and other defect. IRSoldering the MLCC on the PCB, then pressing direction based on the photo. Sizes: 0805(2012), 1206(3216), 1210(3225), 1812(4532), 2220(5750).
Taping Specification Embossed Plastic Taping: For 0805(2012) to 1812(4532) types. Includes dimensions for tape size, pocket dimensions, and reel dimensions.
Paper Tape Reel Packing: For 1005(0402), 0201, 0402 types and 0603, 0805, 1206 types. Includes dimensions for paper size, pocket dimensions, and reel dimensions.
Reel Dimensions: 7' REEL (1782.0), 13' REEL (3302.0)
Top Tape Peeling Strength: Paper Taping: 0.1N
Packing Quantity
SizePaper T/R (Pcs)Plastic T/R (Pcs)
06034000-
080540003000 (T1.35mm), 3000 (T1.35mm)
1206-2000 (T1.60mm), 3000 (T1.60mm)
1210-2000
1808-1000 (T1.85mm)
1812-1000 (T1.85mm)
1812 above800500
Soldering Method Recommendation:
SizeTemperature CharacteristicsRated VoltageCapacitanceSoldering Method
1005NPO//R
X7R/X5R/X7S/X6S//R
0201NPO//R
X7R/X5R/X7S/X6S//R
Y5V//R
0402NPO//R
X7R/X5R/X7S/X6S//R
Y5V//R
0603NPO//R/W
X7R/X5R/X7S/X6S/C1ufR
/C1ufR/W
Y5V/C1ufR
/C1ufR/W
0805NPO//R/W
X7R/X5R/X7S/X6S/C4.7ufR
/C4.7ufR/W
Y5V/C1ufR
/C1ufR/W
1206NPO//R/W
X7R/X5R/X7S/X6S/C10ufR
/C10ufR/W
Y5V/C10ufR
/C10ufR/W
1210NPO//R
X7R/X5R/X7S/X6S//R
Y5V//R

Soldering method: RReflow Soldering, WWave Soldering

Soldering Temperature Profile: Preheating: Keep temperature difference between soldering temperature and surface temperature of chips T150.

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Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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