multi layer ceramic capacitor AIDE CAPACITOR 1812X7R222K302NT for energy saving lamps and power supplies
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
High-performance Multi-Layer Ceramic Capacitors (MLCCs) designed for demanding applications in high voltage circuits. These capacitors are ideal for coupling, wave filtering, and resonant functions within switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. They offer reliable performance across a range of operating conditions and are available in various sizes and specifications to meet diverse industrial needs.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn
- Certifications: ROHS/REACH compliance
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits (Medium and High voltage MLCC) | ||
| Applications: Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. | |||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | (No special requirements) |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | For data not matching testing specification | |
| Initial Capacitance Testing | Pre-heating 150 for 1 hour, then place 48 hours under normal pressure & temperature | ||
| Part Number Description | Example: 1812 X7R 684 M 251 N T | ||
| Dimension Code | (Inch/mm) | 0201 (0.02*0.01 / 0.50*0.25), 0402 (0.04*0.02 / 1.00*0.50), 0603 (0.06*0.03 / 1.60*0.80), 0805 (0.08*0.05 / 2.00*1.25), 1206 (0.12*0.06 / 3.20*1.60), 1210 (0.12*0.10 / 3.20*2.50), 1808 (0.18*0.08 / 4.50*2.00), 1812 (0.18*0.12 / 4.50*3.20), 1825 (0.18*0.25 / 4.50*6.30), 2211 (0.22*0.11 / 5.70*2.8), 2225 (0.22*0.25 / 5.70*6.30) | |
| Temperature Characteristic | Code | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| Nominal Electrostatic Capacity | Format | 8R08.0, 10010, 101100 (pF) | |
| Tolerance of Electrostatic Capacity | Code | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| Rated Voltage (DC) | Code | 25025V, 251250V, 2522500V | |
| Packing | Code | T (Tape/Reel), P (Bag packing) | |
| Construction | Item | Description | |
| 1 | Ceramic dielectric | ||
| 2 | Inner electrode | ||
| 3 | Outer electrode | ||
| 4 | Nickle layer | ||
| 5 | Tin layer | ||
| Dimension (mm) | Part Number | L W T WB | British System / Metric System |
| 0201 (0603) | 0.600.10 0.300.05 0.300.05 0.100.05 | ||
| 0402 (1005) | 1.000.15 0.500.15 0.500.10 0.200.10 | ||
| 0603 (1608) | 1.600.20 0.800.15 0.800.15 0.300.10 | ||
| 0805 (2012) | 2.000.20 1.250.20 0.800.20 1.000.20 | ||
| 1206 (3216) | 3.200.30 1.600.30 1.000.20 1.250.20 | ||
| 1210 (3225) | 3.200.30 2.500.30 2.70 0.800.30 | ||
| 1808 (4520) | 4.500.40 2.000.20 2.70 0.800.30 | ||
| 1812 (4532) | 4.500.40 3.200.30 3.50 0.800.30 | ||
| 1825 (4563) | 4.500.40 6.300.50 3.50 0.800.30 | ||
| 2220 (5750) | 5.700.50 5.000.50 3.50 1.000.40 | ||
| 2225 (5763) | 5.700.50 6.300.50 6.20 1.000.40 | ||
| Temperature | -55~+125 | ||
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |
| Static Capacity | Meet standard specification and tolerance |
| |
| Dissipation Factor (DF) |
| See Note 1 | |
| IR Insulation Resistance |
| Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | |
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |
| Resistance to the heat of soldering | No visual damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time :242 hours. | |
| Electrostatic Capacity Change Rate |
| ||
| Flexural Strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Tested under flexural status. | |
| Electro Static Capacity Change Rate (Flexural) | |C/C| 10% | Flexural depth: 452 | |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |
| Thermal Shock |
| Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after placing 242 hours at normal temp & humidity. | |
| Temperature Moisture Exposure |
| Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after placing 242 hours at normal temp & humidity. | |
| High Temperature Exposure |
| Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage); 250VV1KV (1.5x rated voltage); 1KVV (1.2x rated voltage). Test after placing 48 hours under normal pressure & temperature. | |
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB. Pressing direction based on photos. Sizes: 0805(2012) to 2220(5750) with specific A, B, C dimensions. | |
| Embossed Plastic Taping Dimensions (mm) | Code | Tape size A B C D E F G H J T | |
| 0805 | 1.550.20 2.350.20 8.000.20 3.500.05 1.750.10 4.000.10 2.000.10 4.000.10 1.50 -0/+0.10 1.50 Max | ||
| 1206 | 1.950.20 3.600.20 8.000.20 3.500.05 1.750.10 4.000.10 2.000.10 4.000.1 1.50 -0/+0.10 1.85 Max | ||
| 1210 | 2.700.10 3.420.10 8.000.10 3.500.05 1.750.10 4.000.10 2.000.05 4.000.10 1.55 -0/+0.10 3.2 Max | ||
| 1808 | 2.200.10 4.950.10 12.000.10 5.500.05 1.750.10 4.000.10 2.000.05 4.000.10 1.50 -0/+0.10 3.0 Max | ||
| 1812 | 3.660.10 4.950.10 12.000.10 5.500.05 1.750.10 8.000.10 2.000.05 4.000.10 1.55 -0/+0.10 4.0 Max | ||
| Paper Tape Reel Packing Dimensions (mm) | Code | Paper size W1 L1 D C B P1 P2 P0 d t | |
| 1005 | 0.240.02 0.450.02 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 0.30 Below | ||
| 0201 | 0.370.10 0.670.10 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 0.80 Below | ||
| 0402 | 0.650.10 1.150.10 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 0.80 Below | ||
| 0603 | 1.100.10 1.900.10 8.000.10 3.500.05 1.750.10 4.000.10 2.000.10 4.000.10 1.50 -0/+0.10 1.10 Max | ||
| 0805 | 1.450.15 2.300.15 8.00.15 3.500.05 1.750.10 4.000.10 2.000.10 4.000.10 1.50 -0/+0.10 1.10 Max | ||
| 1206 | 1.800.20 3.400.20 8.000.20 3.500.05 1.750.10 4.000.10 2.000.10 4.000.10 1.50 -0/+0.10 1.10 Max | ||
| Reel Dimensions (mm) | Unit: mm | A B C D E F G | 7REEL 1782.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max; 13REEL 3302.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max |
| Top Tape Peeling Strength | Standard | 0.1N < peeling strength < 0.7N | No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. |
| Packing Quantity | Size | Paper T/R (Pcs) | Plastic T/R (Pcs) |
| 0603 | 4000 | ||
| 0805 | 4000 | 3000 (T1.35mm) | |
| 1206 | 3000 (T>1.35mm) | ||
| 1210 | 2000 (T1.60mm) | ||
| 1808 | 3000 (T>1.60mm) | ||
| 1812 | 2000 (T1.85mm) | ||
| 1812 & above | 1000 (T>1.85mm) | ||
| 1005, 0201, 0402 | (Specific quantity not listed, refer to T/R packing) | (Specific quantity not listed, refer to T/R packing) | |
| Soldering Method | Size | Capacitance | Method |
| 1005 | NPO | / | R |
| X7R/X5R/X7S/X6S | / | R | |
| 0201 | NPO | / | R |
| X7R/X5R/X7S/X6S | / | R | |
| Y5V | / | R | |
| 0402 | NPO | / | R |
| X7R/X5R/X7S/X6S | / | R | |
| Y5V | / | R | |
| 0603 | NPO | / | R/W |
| X7R/X5R/X7S/X6S | C1uf | R | |
| C1uf | R/W | ||
| Y5V | C1uf | R | |
| C1uf | R/W | ||
| 0805 | NPO | / | R/W |
| X7R/X5R/X7S/X6S | C4.7uf | R | |
| C4.7uf | R/W | ||
| Y5V | C1uf | R | |
| C1uf | R/W | ||
| 1206 | NPO | / | R/W |
| X7R/X5R/X7S/X6S | C10uf | R | |
| C10uf | R/W | ||
| Y5V | C10uf | R | |
| C10uf | R/W | ||
| 1210 | NPO | / | R |
| X7R/X5R/X7S/X6S | / | R | |
| Y5V | / | R | |
| Soldering Profile | Refer to adjacent graph (enclosure page) | ||
| Soldering Temperature Difference | T150 | Keep temperature difference between soldering temperature and surface temperature of chips. | |
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina