Multi Layer Ceramic Capacitor AIDE CAPACITOR 1812X7R105K251NT designed for coupling wave filtering and resonant functions
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in a range of sizes and temperature characteristics, offering reliable performance under specified conditions.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn
- Certifications: RoHS/REACH compliant
Technical Specifications
| Item | Description | Specification | |||
|---|---|---|---|---|---|
| Dimension Code & Size | 0201 (0.50x0.25 mm) | L*W (inch): 0.02*0.01 | |||
| 0402 (1.00x0.50 mm) | L*W (inch): 0.04*0.02 | ||||
| 0603 (1.60x0.80 mm) | L*W (inch): 0.06*0.03 | ||||
| 0805 (2.00x1.25 mm) | L*W (inch): 0.08*0.05 | ||||
| 1206 (3.20x1.60 mm) | L*W (inch): 0.12*0.06 | ||||
| 1210 (3.20x2.50 mm) | L*W (inch): 0.12*0.10 | ||||
| 1808 (4.50x2.00 mm) | L*W (inch): 0.18*0.08 | ||||
| 1812 (4.50x3.20 mm) | L*W (inch): 0.18*0.12 | ||||
| 1825 (4.50x6.30 mm) | L*W (inch): 0.18*0.25 | ||||
| 2211 (5.70x2.8 mm) | L*W (inch): 0.22*0.11 | ||||
| 2225 (5.70x6.30 mm) | L*W (inch): 0.22*0.25 | ||||
| Temperature Characteristic | C0G | 0 30 PPM/ | |||
| X7R | 15% | ||||
| X5R | 15% | ||||
| Nominal Electrostatic Capacity | 8R0 | 8.0 pF | |||
| 101 | 100 pF | ||||
| Tolerance of Electrostatic Capacity | B | 0.1 pF | |||
| C | 0.25 pF | ||||
| D | 0.5 pF | ||||
| F | 1% | ||||
| G | 2% | ||||
| J | 5% | ||||
| K | 10% | ||||
| M | 20% | ||||
| Z | +80%/-20% | ||||
| Rated Voltage (DC) | 251 | 250 V | |||
| 252 | 2500 V | ||||
| Dimensions (mm) | Part Number | L (mm) | W (mm) | T (mm) | WB (mm) |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Temperature Range | -55~+125 | ||||
| Testing Condition: Normal Condition (15~35, 45~75%RH, 86~106kPa) | |||||
| Static Capacity | Meet standard specification and tolerance | ||||
| Testing Method: Refer to Specification and testing method section | |||||
| Dissipation Factor (DF) | Refer to NO#4 in Specification and testing method | ||||
| Note 1 provides DF exceptions for various types and ratings. | |||||
| Insulation Resistance (IR) | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF | ||||
| X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF | |||||
| Hi-pot (DC) | No dielectric breakdown or damage | ||||
| Testing Voltage: 1.1x to 2.5x rated voltage depending on Ur | |||||
| Solderability | Soldering area 90% | ||||
| Testing Method: Pre-heating 80-120 (10-30s), Soldering temp 2455 (20.5s) | |||||
| Resistance to the heat of soldering | Visual-No damage, soldering area90% | ||||
| Testing Method: Pre-heating 100-200 (102s), Soldering temp 2655 (51s) | |||||
| Flexural Strength | No damage | ||||
| Testing Method: Flexural depth 1mm, Bend speed 0.5mm/sec | |||||
| Terminal Bonding Strength | No visual damage | ||||
| Applied Force: 5N, Duration: 101S | |||||
| Thermal Shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | ||||
| Testing Method: 5 cycles thermal shock, test after 242 hours at normal temp & humidity | |||||
| Temperature Moisture Exposure | NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10% | ||||
| Testing Method: 402, 90~95%RH for 50024 hours | |||||
| High Temperature Exposure | NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20% | ||||
| Testing Method: 1253 for 100048 hours at specified voltage | |||||
| PCB Flexural Strength | No crack and other defect | ||||
| Testing Method: IR measurement after soldering on PCB and applying force | |||||
| Packing Quantity | Refer to Page 11 for details on Paper T/R and Plastic T/R quantities by size. | ||||
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina