High voltage MLCC capacitor AIDE CAPACITOR 1206X7R272K202NT designed for switch power supplies AC DC and DC DC power chargers
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MOQ:
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Delivery Time:
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Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Key application areas include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance under specified conditions.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description/Specification | Details |
|---|---|---|
| Application Field | High voltage circuits | |
| Function | Coupling, wave filtering, resonant | |
| Applications | Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | |
| Type | Medium and High voltage MLCC | |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| Terminal Composition | Au/Ag-Ni-Sn | |
| Packing Options | Tape/Reel (T), Bag packing (P) | |
| Dimensions (British System / Metric System) | 0201 / 0603 | L*W (inch): 0.02*0.01, L*W (mm): 0.50*0.25 |
| 0402 / 1005 | L*W (inch): 0.04*0.02, L*W (mm): 1.00*0.50 | |
| 0603 / 1608 | L*W (inch): 0.06*0.03, L*W (mm): 1.60*0.80 | |
| 0805 / 2012 | L*W (inch): 0.08*0.05, L*W (mm): 2.00*1.25 | |
| 1206 / 3216 | L*W (inch): 0.12*0.06, L*W (mm): 3.20*1.60 | |
| 1210 / 3225 | L*W (inch): 0.12*0.10, L*W (mm): 3.20*2.50 | |
| 1808 / 4520 | L*W (inch): 0.18*0.08, L*W (mm): 4.50*2.00 | |
| 1812 / 4532 | L*W (inch): 0.18*0.12, L*W (mm): 4.50*3.20 | |
| 1825 / 4563 | L*W (inch): 0.18*0.25, L*W (mm): 4.50*6.30 | |
| 2211 / 5728 | L*W (inch): 0.22*0.11, L*W (mm): 5.70*2.8 | |
| 2220 / 5750 | L*W (inch): 0.22*0.20, L*W (mm): 5.70*5.00 | |
| 2225 / 5763 | L*W (inch): 0.22*0.25, L*W (mm): 5.70*6.30 | |
| Testing Conditions | Normal | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa |
| Relative | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Specifications & Testing Methods | Temperature Range | -55~+125 |
| Visual/Dimension | No Damage, Dimension meet Spec | |
| Static Capacity | Meets standard specification and tolerance (NPO, X7R/X7T/X7P characteristics) | |
| Dissipation Factor (DF) | Refer to specification for NPO and X7R/X7T/X7P characteristics | |
| Insulation Resistance (IR) | NPO: IR50000M, C10nF; IR*Cr500S, C>10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C>25nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |
| Hi-pot (DC) | No dielectric breakdown or damage. Test voltage varies based on rated voltage (Ur). | |
| Solderability | Soldering area 90%. Pre-heating: 80-120 (10-30s), Solder temp: 2455 (20.5s) | |
| Resistance to the heat of soldering | No damage, soldering area 90%. Pre-heating: 100-200 (102s), Solder temp: 2655 (51s). Cleaning and testing after 242 hours at room temperature. | |
| Electrostatic Capacity Change Rate | Varies by characteristic (NPO, X7R, X7T, X7P). | |
| Flexural Strength | No damage. Electrostatic capacity change rate 10%. | |
| Terminal Bonding Strength | No visual damage. Applied Force: 5N (101S). | |
| Thermal Shock | Capacity change rate and DF/IR values within specified limits based on characteristic (NPO, X7R/X7P, X7T). 5 cycles. | |
| Temperature Moisture Exposure | No visual damage. Capacity change rate, DF, and IR within specified limits based on characteristic. Tested at 402, 90~95%RH for 50024 hours. | |
| High Temperature Exposure | No visual damage. Capacity change rate, DF, and IR within specified limits based on characteristic. Tested at 1253 for 100048 hours with specified voltage. | |
| PCB Flexural Strength | No crack and other defect. | |
| Embossed Plastic Taping Dimensions | Details provided for 0805 to 1812 types (Tape size, A, B, C, D, E, F, G, H, J, T). | |
| Paper Tape Reel Packing Dimensions | Details provided for 1005, 0201, 0402, 0603, 0805, 1206 types (Paper size, W1, L1, D, C, B, P1, P2, P0, d, t). | |
| Reel Dimensions | 7' REEL (1782.0), 13' REEL (3302.0). | |
| Top Tape Peeling Strength | Paper Taping: Standard values. Embossed Taping: 0.1N | |
| Packing Quantity | Varies by size and tape type (Paper T/R, Plastic T/R). | |
| Soldering Method Recommendations | RReflow Soldering, WWave Soldering. Recommended based on size, characteristics, rated voltage, and capacitance. | |
| Soldering Temperature Profile | Preheating temperature difference T 150. | |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina