Ceramic capacitor AIDE CAPACITOR 1210X5R476K160NT designed for energy saving lamps and LCD backlight power supplies
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions within various high-voltage circuits. Key applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification | |||
|---|---|---|---|---|---|
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| Nominal Electrostatic Capacity | 8R08.0pF, 10010pF, 101100pF | ||||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| Rated Voltage (DC) | 25025V, 251250V, 2522500V | ||||
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||||
| Packing | T (Tape/Reel), P (Bag packing) | ||||
| Construction and Dimension | Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | |||
| Dimension (mm) | Part Number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Specification and Testing Method | Temperature | -55~+125 | N/A | ||
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital caliper | |||
| Static Capacity | Meet standard specification and tolerance | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | |||
| Dissipation Factor (DF) | NPO Characteristic: DF0.56 (Cr5pF); DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15% (50pFCr) X7R/X7T/X7P Characteristic: See Note 1 | NPO: 1MHz10%, 1V0.2rms (Cr1000pF); 1KHz10%, 1V0.2rms (Cr>1000pF) X7R/X7T/X7P: 1KHz10%, 1V0.1rms (Cr10uF); 120Hz24, 0.5V0.1rms (Cr>10uF) | |||
| IR Insulation Resistance | NPO: IR50000M (C10nF); IR*Cr500S (C>10nF) X7R/X7T/X7P: IR10000M (C25nF); IR*Cr100S (C>25nF) | Rated voltage, Time: 605s, Humidity: 75%RH, Temperature: 255, Current: 50mA | |||
| Hi-pot (DC) | Dielectric breakdown or damage | Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | |||
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |||
| Resistance to the heat of soldering | No visual damage, soldering area90% | Pre-heating temperature 100-200, time 102s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |||
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | Pre-heating 150 1 hour, then 48 hours under normal pressure & temperature. | |||
| Flexural Strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. Electro static capacity change rate C/C10%. Flexural depth 452. | |||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |||
| Thermal Shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | Pre-condition (X7R characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after 242 hours normal temp & humidity. | |||
| Temperature Moisture Exposure | Visual: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after 242 hours normal temp & humidity. | |||
| High Temperature Exposure | Visual: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after 48 hours under normal pressure & temperature. | |||
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB, then pressing direction based on the photo. SIZE A B C: 0805(2012) 1.2 4 1.65; 1206(3216) 2.2 5 2; 1210(3225) 2.2 5 2.9; 1812(4532) 3.5 7 3.7; 2220(5750) 4.5 8 5.6. | |||
| Embossed Plastic Taping | Taping Reel Packing (Pcs) | 0805: 3000; 1206: 3000 (T1.35mm), 2000 (T>1.35mm); 1210: 2000 (T1.60mm), 3000 (T>1.60mm); 1808: 2000; 1812: 1000 (T1.85mm), 800 (T>1.85mm); 1812 and above: 500 | Dimensions: A, B, C, D, E, F, G, H, J, T (detailed in document) | ||
| Reel Dimensions (unit: mm) | 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max; 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | N/A | |||
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N | Standard: No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | |||
| Packing Quantity | Paper T/R (Pcs) | 0201: 4000; 0402: 4000; 0603: 4000; 0805: 4000; 1005: 4000; 1206: 4000 | N/A | ||
| Plastic T/R (Pcs) | 0805: 3000; 1206: 3000 (T1.35mm), 2000 (T>1.35mm); 1210: 2000 (T1.60mm), 3000 (T>1.60mm); 1808: 2000; 1812: 1000 (T1.85mm), 800 (T>1.85mm); 1812: 500 | N/A | |||
| Soldering Method | RReflow Soldering, WWave Soldering | Recommended for various sizes and temperature characteristics (detailed in document) | |||
| Soldering Temperature Profile | Preheating temperature difference (soldering temperature and surface temperature of chips): T150 | N/A |
Precautions for Use
Multi-layer Ceramic Capacitors (MLCCs) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings and conditions. This can result in burn out, flaming, or glowing. Adhere to safety precautions and application notes. Contact the engineering section or factory for handling precautions.
Soldering Profile: Follow the temperature profile in the adjacent graph to avoid cracks from sudden temperature changes.
Manual Soldering: Manual soldering carries a high risk of creating thermal cracks. Handle soldering irons carefully, paying attention to tip selection and temperature contact to avoid direct contact with the ceramic body.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina