ceramic capacitor for LCD backlight power supplies AIDE CAPACITOR 0402X7R104K250NT energy saving lamp applications
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Delivery Time:
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Product Description
Product Overview
High-reliability Multi-Layer Ceramic Capacitors (MLCCs) designed for demanding applications in high-voltage circuits. These capacitors are suitable for coupling, wave filtering, and resonant functions within switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. They offer robust performance and are available in various sizes and dielectric characteristics to meet specific circuit requirements.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminals)
- Certifications: RoHS/REACH compliant
Technical Specifications
| Item | Description | Specification | |||
|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | ||||
| Switch power supplier | |||||
| AC-DC power charger | |||||
| DC-DC power charger | |||||
| Networking/Communication interface | |||||
| LCD backlight unit power supplier | |||||
| Amperite of energy saving lamps | |||||
| (Medium and High voltage MLCC) | |||||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | ||||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| Rated Voltage (DC) | 250 25V, 251 250V, 252 2500V | ||||
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||||
| Packing | T Tape/Reel, P Bag packing (PE) | ||||
| Construction and Dimension | Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | |||
| Dimension (mm) | Part Number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Specification and Testing Method | Temperature | -55~+125 | N/A | ||
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital caliper | |||
| Static Capacity | Meet standard specification and tolerance | Refer to specification for NPO and X7R/X7T/X7P characteristics | |||
| Dissipation Factor (DF) | Refer to specification for NPO and X7R/X7T/X7P characteristics | Refer to specification for testing frequencies and voltages | |||
| IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |||
| Hi-pot (DC) | No dielectric breakdown or damage | Based on rated voltage (Ur): 1.1x to 2.5x Ur. Voltage Raising time: 110S, Voltage maintaining time: 2S | |||
| Solderability | Soldering area 90% | Pre-heating: 80-120 (10-30s), Solder: Lead-free, Flux. Temp: 2455, Time: 20.5s | |||
| Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating: 100-200 (102s), Soldering Temp: 2655 (51s). Cleaning, Room temp. (242 hours) | |||
| Electrostatic Capacity Change Rate | NPO: 0.5% or 0.5pF. X7R: 15%. X7T: -33% to 22%. X7P: 10%. | Refer to specification for testing conditions. | |||
| Flexural Strength | No damage. Electrostatic capacity change rate 10% | Base board: Al2O3/PCB. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | |||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |||
| Thermal Shock | NPO: 2.5% or 0.25pF. X7R/X7P: 0.5%. X7T: 10%. | 5 cycles. Test after 242 hours at normal temp & humidity. | |||
| Temperature Moisture Exposure | Visual: No visual damage. Capacity change rate: NPO 2% or 1pF. X7R/X7T/X7P 10%. DF 2 times initial standard. IR: NPO 2500M or IR*Cr 25S. X7R/X7T/X7P 1000M or IR*Cr 25S. | Temp: 402, Humidity: 90~95%RH, Time: 50024 hours. Test after 242 hours at normal temp & humidity. | |||
| High Temperature Exposure | Visual: No visual damage. Capacity change rate: NPO 2% or 1pF. X7R/X7T/X7P 20%. DF 2 X initial standard. IR: NPO 4000M or IR*Cr 40S. X7R/X7T/X7P 2000M or IR*Cr 50S. | Temp: 1253, Time: 100048 hours. Voltage: 100V-1KV (1.2x to 2x Rated voltage). Test after 48 hours at normal pressure & temperature. | |||
| PCB Flexural Strength | No crack and other defect | Soldering MLCC on PCB, then pressing. Specific dimensions (A, B, C) provided for different sizes (0805 to 2220). | |||
| Embossed Plastic Taping | Taping Specification | Dimensions (A, B, C, D, E, F, G, H, J, T) provided for sizes 0805 to 1812. | Refer to table for detailed dimensions. | ||
| Reel Dimensions | 7' REEL (1782.0), 13' REEL (3302.0) | Specific dimensions for A, B, C, D, E, F, G. | |||
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N | No paper dirty remains on the scotch when peeling. | |||
| Paper Tape Reel Packing | Paper Tape Reel Packing for 1005, 0201, 0402 types | Dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) provided. | Refer to table for detailed dimensions. | ||
| Paper Tape Reel Packing for 0603, 0805, 1206 types | Dimensions (A, B, C, D, E, F, G, H, J, T) provided. | Refer to table for detailed dimensions. | |||
| Packing Quantity | Paper T/R (Pcs) | 4000 (0603, 0805), 3000 (1206) | Specific quantities for different sizes and tape types. | ||
| Plastic T/R (Pcs) | 3000 (0805, 1210), 2000 (1808, 1812), 1000 (1812+), 800 (2220), 500 (2225) | Specific quantities for different sizes and tape types. | |||
| Recommended Soldering Method | RReflow Soldering, WWave Soldering | Details provided for each size and capacitance range. | Refer to table for specific recommendations. | ||
| Soldering Temperature Profile | T150 temperature difference between soldering temperature and surface temperature of chips during preheating. | Refer to adjacent graph (enclosure page). | |||
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina