Multi layer ceramic capacitor AIDE CAPACITOR 0805C0G181J500NT designed for AC DC DC DC power chargers and energy saving lamps
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Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is utilized for coupling, wave filtering, and resonance in various high-voltage circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in a range of sizes and temperature characteristics, ensuring reliable performance across different operating conditions.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn
- RoHS/REACH Compliance: Meets standard
Technical Specifications
| Item | Description/Specification | Testing Method |
|---|---|---|
| Application Field | ||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps (Medium and High voltage MLCC) | ||
| Testing Conditions | ||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||
| 1. Dimension Code | 0201 (0.02*0.01 inch / 0.50*0.25 mm), 0402 (0.04*0.02 inch / 1.00*0.50 mm), 0603 (0.06*0.03 inch / 1.60*0.80 mm), 0805 (0.08*0.05 inch / 2.00*1.25 mm), 1206 (0.12*0.06 inch / 3.20*1.60 mm), 1210 (0.12*0.10 inch / 3.20*2.50 mm), 1808 (0.18*0.08 inch / 4.50*2.00 mm), 1812 (0.18*0.12 inch / 4.50*3.20 mm), 1825 (0.18*0.25 inch / 4.50*6.30 mm), 2211 (0.22*0.11 inch / 5.70*2.8 mm), 2225 (0.22*0.25 inch / 5.70*6.30 mm) | |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| 3. Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF | |
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| 5. Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | |
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |
| 7. Packing | T: Tape/Reel, P: Bag packing (PE) | |
| Construction and Dimension | ||
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | |
| Dimension (mm) | Part Number | L | W | T | WB 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 1.000.20 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 1.250.20 1210 (3225) | 3.200.30 | 2.500.30 (2.70) | 0.800.30 | 1.250.20 1808 (4520) | 4.500.40 | 2.000.20 (2.70) | 0.800.30 | 1.250.20 1812 (4532) | 4.500.40 | 3.200.30 (3.50) | 0.800.30 | 1.250.20 1825 (4563) | 4.500.40 | 6.300.50 (3.50) | 0.800.30 | 1.250.20 2220 (5750) | 5.700.50 | 5.000.50 (3.50) | 1.000.40 | 1.250.20 2225 (5763) | 5.700.50 | 6.300.50 (6.20) | 1.000.40 | 1.250.20 | Digital caliper |
| Specification and Testing Method | ||
| 1. Temperature | -55~+125 | |
| 2. Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection) |
| 3. Static Capacity | Meet standard specification and tolerance | NPO: 1000pF @ 1MHz10%, 1.00.2Vrms; >1000pF @ 1KHz10%, 1.00.2Vrms X7R/X7T/X7P: 10uF @ 1KHz10%, 1.00.2Vrms; >10uF @ 120Hz24, 0.50.1Vrms |
| 4. Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) X7R/X7T/X7P: See Note 1 | NPO: Cr1000pF, 110%MHz, 1V0.2rms; Cr1000pF, 110%KHz, 1V0.2rms X7R/X7T/X7P: Cr10uF, 110%KHz, 1V0.1rms; Cr10uF, 12024Hz, 0.5V0.1rms |
| 5. IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| 6. Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S |
| 7. Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. |
| 8. Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| 9. Flexural Strength | No damage. Electro static capacity change rate: C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. |
| 10. Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| 11. Thermal Shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. |
| 12. Temperature Moisture Exposure | Visual: No visual damage. Capacitance Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity. |
| 13. High Temperature Exposure | Visual: No visual damage. Capacitance Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Charging and discharging current 50mA Max. Test it after place 48 hours under normal pressure & temperature. |
| 14. PCB Flexural Strength | No crack and other defect. IR | Soldering the MLCC on the PCB, then pressing direction base on the photo. Sizes: 0805(2012) A:1.2, B:4, C:1.65; 1206(3216) A:2.2, B:5, C:2; 1210(3225) A:2.2, B:5, C:2.9; 1812(4532) A:3.5, B:7, C:3.7; 2220(5750) A:4.5, B:8, C:5.6 |
| Embossed Plastic Taping | ||
| Embossed Tape Reel Packing (0805 to 1812) | Code | Tape size (A) | (B) | (C) | (D) | (E) | (F) | (G) | (H) | (J) | (T) 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max | |
| Paper Tape Reel Packing | ||
| Paper Tape Reel Packing (1005(0402) ~ 1206(3216)) | Code | Paper size (W1) | (L1) | (D) | (C) | (B) | (P1) | (P2) | (P0) | (d) | (t) 1005 | 0.240.02 | 0.450.02 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.30 Below 0201 | 0.370.10 | 0.670.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below 0402 | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below Code | Paper size (A) | (B) | (C) | (D) | (E) | (F) | (G) | (H) | (J) | (T) 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| Reel Dimensions | ||
| 7' REEL | 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | |
| 13' REEL | 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | |
| Taping Specification | ||
| Top tape peeling strength | 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | (a) Paper Taping, (b) Embossed Taping |
| Packing Quantity | ||
| Paper T/R (Pcs) | 0603: 4000, 0805: 4000 | |
| Plastic T/R (Pcs) | 0805: 3000, 1206 (T1.35mm): 3000, 1206 (T>1.35mm): 2000, 1210 (T1.60mm): 3000, 1210 (T>1.60mm): 2000, 1808: 1000, 1812 (T1.85mm): 1000, 1812 (T>1.85mm): 800, 1812+: 500 | |
| Precautions For Use | ||
| Soldering Profile | To avoid crack problem by sudden temperature change, follow the temperature profile in the adjacent graph. | |
| Manual Soldering | Risk of thermal cracks. Handle soldering iron carefully, pay attention to tip selection and temperature contact. | |
| Recommended Soldering Method | Size | Temp. Char. | Rated Voltage | Capacitance | Method 1005 | NPO / X7R/X5R/X7S/X6S / Y5V | / / / | / / / | R / R / R 0201 | NPO / X7R/X5R/X7S/X6S / Y5V | / / / | / / / | R / R / R 0402 | NPO / X7R/X5R/X7S/X6S / Y5V | / / / | / / / | R / R / R 0603 | NPO / X7R/X5R/X7S/X6S / Y5V | / / C1uf / C1uf | / C1uf / C1uf | R/W / R/W / R/W 0805 | NPO / X7R/X5R/X7S/X6S / Y5V | / / C4.7uf / C1uf | / C4.7uf / C1uf | R/W / R/W / R/W 1206 | NPO / X7R/X5R/X7S/X6S / Y5V | / / C10uf / C10uf | / C10uf / C10uf | R/W / R/W / R/W 1210 | NPO / X7R/X5R/X7S/X6S / Y5V | / / / | / / / | R / R / R Method: RReflow Soldering, WWave Soldering | |
| Soldering Temperature Profile | Keep temperature difference between soldering temperature and surface temperature of chips as T150 during preheating. | |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina