Multilayer ceramic capacitor AIDE CAPACITOR 0603X7S104K101NT designed for coupling filtering and resonance in circuits
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Product Description
Product Overview
High-voltage multilayer ceramic capacitors (MLCCs) designed for coupling, filtering, and resonant applications in high-voltage electronic circuits. These capacitors are suitable for use in switching power supplies, AC-DC and DC-DC converters, network/communication interfaces, LCD module backlight power supplies, and energy-saving lamp ballasts. They offer a wide operating temperature range and are available in various sizes and packaging options.
Product Attributes
- Temperature Characteristics: X7S (22%)
- Terminal Material: Copper/Silver-Nickel-Tin (from inside to outside)
- Packaging Options: Tape & Reel (T), Bulk (P)
- Environmental Compliance: RoHS Directive, REACH Regulation
Technical Specifications
| Item | Specification | Test Method |
|---|---|---|
| Application Range | High-voltage electronic circuits (coupling, filtering, resonance) | - |
| Standard Conditions | Temperature: 15~35, Humidity: 45~75%RH, Pressure: 86~106kPa | - |
| Relative Standard Conditions | Temperature: 252, Humidity: 60~70%RH, Pressure: 86~106kPa | - |
| Product Name Composition | Example: 0603 X7S 225 K 100 N T | |
| Product Size Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X7S (22%) | |
| Nominal Capacitance | Three-digit method (unit: F) | |
| Capacitance Tolerance | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G:2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| Rated Voltage (DC) | Three-digit method (unit: V) | |
| Terminal Material | Copper/Silver-Nickel-Tin | |
| Packaging Method | T: Tape & Reel, P: Bulk (PE bag) | |
| Product Structure and Dimensions | Structure | 1. Ceramic Dielectric, 2. Internal Electrode, 3. External Electrode, 4. Nickel Layer, 5. Tin Layer |
| Dimensions (0603 model) | L: 1.600.15mm, W: 0.800.15mm, T: 0.800.15mm, WB: 0.300.10mm | |
| Operating Temperature Range | -55~+125 | - |
| Appearance and Dimensions | No visible damage, dimensions meet specifications | Visual inspection, caliper measurement |
| Capacitance | Within specified tolerance | See NPO/X7R/X7T/X7S/X5R characteristics in source |
| Dissipation Factor (DF Value) | See NPO/X7R/X5R/X6S/X7S/Y5V characteristics in source | See source for detailed frequency and voltage conditions |
| Insulation Resistance (IR) | See NPO/X7R/X6S/X5R characteristics in source | Test voltage, time, humidity, and temperature specified in source |
| Withstand Voltage (DC) | 1.1 to 2.5 times rated voltage (depending on rated voltage) | Ramp time: 1-10s, Hold time: 2s |
| Solderability | Tinning rate > 90%, no visible damage | Preheating 80-120 (10-30s), Lead-free solder, Flux, Soldering temp 2455 (20.5s) |
| Soldering Heat Resistance | No visible damage, tinning rate 90% | Preheating 100-200 (102s), Immersion temp 2605 (51s), Cool down, Clean, 242h at room temp |
| Capacitance Change Rate (after Soldering Heat Resistance) | NPO: 0.5% or 0.5pF (whichever is larger), X7R: 15%, X7T: -33% to 22%, X7S: 22% | - |
| Bending Strength | No visible damage | Test substrate: Al2O3 or PCB, Bending depth: 1mm, Pressing speed: 0.5mm/sec |
| Capacitance Change Rate (after Bending) | 10% | - |
| Terminal Combination Strength | No visible damage | - |
| Temperature Cycling | NPO: 2.5% or 0.25pF (whichever is larger), X7R/X5R: 7.5%, X6S: 10% | 5 cycles, specified temperature and time steps |
| Damp Heat Test | No visible damage | 402, 90~95%RH, 50024 hours |
| Capacitance Change Rate (after Damp Heat) | NPO: 2% or 1pF (whichever is larger), X7R/X6S/X5R: 10% | - |
| DF Value (after Damp Heat) | 2 times initial standard | - |
| IR (after Damp Heat) | NPO: 2500M or IR*Cr25S (whichever is smaller), X7R/X6S/X5R: 1000M or IR*Cr25S (whichever is smaller) | - |
| High Temperature Load Test | No visible damage | 853, 100048 hours, specified voltages |
| Capacitance Change Rate (after High Temp Load) | NPO: 2% or 1pF (whichever is larger), X7R/X6S/X5R: 20% | - |
| DF Value (after High Temp Load) | 2 times initial standard | - |
| IR (after High Temp Load) | NPO: 4000M or IR*Cr40S (whichever is smaller), X7R/X6S/X5R: 2000M or IR*Cr50S (whichever is smaller) | - |
| Circuit Board Bending Strength | No cracks or other defects | Specified test fixture and procedure |
| Packaging Quantities (Pieces) | 0603: 4000 (Paper Tape), 3000 (Reel Tape); 0805: 4000 (Paper Tape), 3000 (Reel Tape); 1206: 3000 (Reel Tape); 1210: 2000 (Reel Tape); 1808: 2000 (Reel Tape); 1812: 1000 (Reel Tape); 1812+: 800 (Reel Tape) | - |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina