High voltage multi layer ceramic capacitor AIDE CAPACITOR 0603C0G8R0C500NT designed for power supply applications and resonant functions
Price:
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MOQ:
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Delivery Time:
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Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Category | Specification | Details | |||
|---|---|---|---|---|---|
| Application Field | High voltage circuits | ||||
| Function | Coupling, Wave filtering, Resonant | ||||
| Applications | Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | ||||
| Type | Medium and High voltage MLCC | ||||
| Testing Conditions (Normal) | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | ||||
| Part Number Description | Item 1: Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||
| Item 2: Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| Item 3: Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | ||||
| Item 4: Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| Item 5: Rated Voltage (DC) | 250 25V, 251 250V, 252 2500V | ||||
| Item 6: Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||||
| Item 7: Packing | T Tape/Reel, P Bag packing (PE) | ||||
| Construction | Item 1: Ceramic dielectric | ||||
| Item 2: Inner electrode | |||||
| Item 3: Outer electrode | |||||
| Item 4: Nickle layer | |||||
| Item 5: Tin layer | |||||
| Dimensions (mm) | Part Number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Specifications and Testing Methods | Temperature Range | -55~+125 | |||
| Static Capacity | NPO: 1000pF @ 1MHz10%, 1.00.2Vrms; >1000pF @ 1KHz10%, 1.00.2Vrms X7R/X7T/X7P: 10uF @ 1KHz10%, 1.00.2Vrms; >10uF @ 120Hz24, 0.50.1Vrms | ||||
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5 pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr) X7R/X7T/X7P: See Note 1 | ||||
| Insulation Resistance (IR) | NPO: IR50000M (C10nF), IR*Cr500S (C>10nF) X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C>25nF) | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |||
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage | Voltage Raising time: 110S, Voltage maintaining time: 2S | |||
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |||
| Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |||
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | Pre-heating 150 1hour, then place 48hours under normal pressure & temperature. | |||
| Flexural Strength | Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | |||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |||
| Thermal Shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. | |||
| Temperature Moisture Exposure | Capacitance Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity. | |||
| High Temperature Exposure | Capacitance Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V: 2x Rated voltage; 250VV1KV: 1.5x rated voltage; 1KVV: 1.2x rated voltage. Test it after place 48 hours under normal pressure & temperature. | |||
| PCB Flexural Strength | No crack and other defect. IR | Soldering the MLCC on the PCB. Pressing direction based on the photo. | |||
| Packing Details | Embossed Plastic Taping | For 0805(2012) to 1812(4532) type | |||
| Paper Tape Reel Packing | For 1005 (0402) to 1206 (3216) | ||||
| Leader/End Part Structure | Refer to structure diagram | ||||
| Reel Dimensions | 7REEL: 1782.0, 13REEL: 3302.0 | ||||
| Packing Quantity | Paper T/R (Pcs) | 0201: 10000, 0402: 10000, 0603: 5000, 0805: 4000, 1206: 2000 | |||
| Plastic T/R (Pcs) | 0805: 3000, 1206: 3000, 1210: 2000, 1808: 1000, 1812: 800 | ||||
| Soldering Method Recommendation | RReflow Soldering, WWave Soldering (Refer to Page 13 for detailed size and capacitance recommendations) | ||||
Precautions For Use
MLCCs may fail in a short circuit or open circuit mode when subjected to conditions beyond specified ratings. To prevent burnout, flaming, or glowing, adhere to the following precautions:
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure careful handling of the soldering iron tip and temperature.
- Optimum Solder Amount: Use the recommended solder amounts for reflow soldering.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina