High Voltage MLCC AIDE CAPACITOR 0603C0G7R0C500NT for Energy Saving Lamps and LCD Backlight Unit Power Supplies
Price:
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MOQ:
Negotiable
Delivery Time:
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Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and energy-saving lamp circuits. Key applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description/Specification | Testing Method | |
|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps. (Medium and High voltage MLCC) | ||
| Testing Conditions | Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | N/A | |
| Part Number Description | Example: 1812 X7R 684 M 251 N T Dimension Code Temperature Characteristic (C0G, X7R, X5R) Nominal Electrostatic Capacity (pF) Tolerance of Electrostatic Capacity (B, C, D, F, G, J, K, M, Z) Rated Voltage (DC) Terminal Composition (Au/Ag-Ni-Sn) Packing (T: Tape/Reel, P: Bag) | ||
| Construction | 1. Ceramic dielectric 2. Inner electrode 3. Outer electrode 4. Nickel layer 5. Tin layer | ||
| Dimensions (mm) | Part Number | L | W | T | WB 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | Digital calliper | |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A | |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | N/A | |
| Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | N/A | |
| Temperature Range | -55~+125 | N/A | |
| Dissipation Factor (DF) | Refer to Note 1 for specific values based on type, voltage, and capacitance. | Refer to specification | |
| Insulation Resistance (IR) | NPO: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | Rated voltage, 605s, Humidity:75%, Temperature:255, Current:50mA | |
| Hi-pot (DC) | 1.2 x rated voltage (1KVUr2KV) 1.5 x rated voltage (450/500/630V) 2.0 x rated voltage (200V/250V) 2.5 x rated voltage (Ur=100V) 1.1 x rated voltage (2KVUr) | Voltage Raising time: 110S, Voltage maintaining time2S | |
| Solderability | Soldering area 90%, No Damage | Pre-heating: 80-120 (10-30s), Solder: 2455 (20.5s) | |
| Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating: 100-200 (102s), Soldering: 2655 (51s), Cleaning, Room temp (242 hours) | |
| Electrostatic Capacity Change Rate | NPO: 0.5% or 0.5pF X7R: 15% X7T: -33% to 22% X7P: 10% | Pre-heating 150 (1 hour), then 48 hours under normal conditions. | |
| Flexural Strength | No damage, Electro static capacity change rate 10% | Base board: Al2O3 /PCB, Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. | |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |
| Thermal Shock | NPO: 2.5% or 0.25pF X7R/X7P: 0.5% X7T: 10% | 5 cycles, tested after 242 hours at normal temp & humidity. | |
| Temperature Moisture Exposure | NPO: 2% or 1pF X7R/X7T/X7P: 10% DF: 2 times initial standard IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S | 402, 90~95%RH, 50024 hours. | |
| High Temperature Exposure | NPO: 2% or 1pF X7R/X7T/X7P: 20% DF: 2 X initial standard IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S | 1253, 100048 hours, Voltage: 100VV250V (2x Rated), 250VV1KV (1.5x Rated), 1KVV (1.2x Rated). | |
| PCB Flexural Strength | No crack and other defect | Soldering MLCC on PCB, pressing direction based on diagrams (SIZE A, B, C specified for different part numbers). | |
| Embossed Plastic Taping Dimensions (mm) | Code | Tape size A | B | C | D | E | F | G | H | J | T 0805 | 1.550.20 | 2.350.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.50 Max 1206 | 1.950.20 | 3.600.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.1 | 1.50 -0/+0.10 | 1.85 Max 1210 | 2.700.10 | 3.420.10 | 8.000.10 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.05 | 4.000.10 | 1.55 -0/+0.10 | 3.2 Max 1808 | 2.200.10 | 4.950.10 | 12.000.10 | 5.500.05 | 1.750.10 | 4.000.10 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 3.0 Max 1812 | 3.660.10 | 4.950.10 | 12.000.10 | 5.500.05 | 1.750.10 | 8.000.10 | 2.000.05 | 4.000.10 | 1.55 -0/+0.10 | 4.0 Max | ||
| Paper Tape Reel Packing Dimensions (mm) | Code | Paper size W1 | L1 | D | C | B | P1 | P2 | P0 | d | t 1005 | 0.240.02 | 0.450.02 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.30 Below 0201 | 0.370.10 | 0.670.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below 0402 | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below 0603 | 1.100.10 | 1.900.10 | 8.000.10 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max 0805 | 1.450.15 | 2.300.15 | 8.00.15 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max 1206 | 1.800.20 | 3.400.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max | ||
| Reel Dimensions (mm) | Type | A | B | C | D | E | F | G 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | ||
| Top Tape Peeling Strength | 0.1N | Standard | |
| Packing Quantity | Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) 0603 | 4000 | 0805 | 4000 | 3000 (T1.35mm) 1206 | | 3000 (T1.60mm) / 2000 (T>1.60mm) 1210 | | 3000 (T1.85mm) / 1000 (T>1.85mm) 1808 | | 800 1812 | | 500 | ||
| Soldering Method Recommendation | Refer to table for specific sizes and capacitance values (R: Reflow Soldering, W: Wave Soldering) | N/A | |
| Soldering Temperature Profile | Keep temperature difference between soldering temperature and surface temperature of chips as T150. | Refer to adjacent graph (enclosure page). | |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina