multi layer ceramic capacitor AIDE CAPACITOR 0603C0G240J500NT for LCD backlight units energy saving lamps and power supply circuits
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Negotiable
MOQ:
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Delivery Time:
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Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. The MLCCs are available in a range of dimensions and temperature characteristics, with options for different tolerances, rated voltages, and terminal compositions. They are offered in tape/reel or bag packing.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- RoHS Compliance: Meets the standard
- REACH Compliance: Meets the standard
Technical Specifications
| Item | Description/Specification | Details |
|---|---|---|
| 1. Application Field | ||
| Primary Applications | Coupling, wave filtering, resonant in high voltage circuits | |
| Specific Devices | Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | |
| 2. Testing Conditions | ||
| Normal Condition | Temperature | 15~35 |
| Humidity | 45~75%RH | |
| Atmosphere | 86~106kPa | |
| Relative Condition | Temperature | 252 |
| Humidity | 60~70%RH | |
| Atmosphere | 86~106kPa | |
| 3. Part Number Description | ||
| Item 1 | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 |
| Dimensions (inch) | 0.02*0.01 to 0.22*0.25 | |
| Dimensions (mm) | 0.50*0.25 to 5.70*6.30 | |
| Item 2 | Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) |
| Item 3 | Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) |
| Item 4 | Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% |
| Item 5 | Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) |
| Item 6 | Terminal Composition | Au/Ag-Ni-Sn (From the inside out) |
| Item 7 | Packing | T (Tape/Reel), P (Bag packing) |
| 4. Construction and Dimension | ||
| Construction Items | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickle layer, 5. Tin layer | |
| Dimension (mm) | Part number | L W T WB |
| 0201 (0603) | 0.600.10 0.300.05 0.300.05 0.100.05 | |
| 0402 (1005) | 1.000.15 0.500.15 0.500.10 0.200.10 | |
| 0603 (1608) | 1.600.20 0.800.15 0.800.15 0.300.10 | |
| 0805 (2012) | 2.000.20 1.250.20 0.800.20 1.000.20 | |
| 1206 (3216) | 3.200.30 1.600.30 1.000.20 1.250.20 | |
| 1210 (3225) | 3.200.30 2.500.30 2.70 0.800.30 | |
| 1808 (4520) | 4.500.40 2.000.20 2.70 0.800.30 | |
| 1812 (4532) | 4.500.40 3.200.30 3.50 0.800.30 | |
| 1825 (4563) | 4.500.40 6.300.50 3.50 0.800.30 | |
| 2220 (5750) | 5.700.50 5.000.50 3.50 1.000.40 | |
| 2225 (5763) | 5.700.50 6.300.50 6.20 1.000.40 | |
| 5. Specification and Testing Method | ||
| Temperature | -55~+125 | |
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper |
| Static Capacity | Meet standard specification and tolerance | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) |
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) X7R/X7T/X7P: See Note 1 | NPO: 110%MHz, 1V0.2rms (Cr1000pF); 110%KHz, 1V0.2rms (Cr1000pF) X7R/X7T/X7P: 110%KHz, 1V0.1rms (Cr10uF); 12024Hz, 0.5V0.1rms (Cr10uF) |
| IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | Rated voltage, Time:605s, Humidity:75%, Temperature:255, Current :50mA |
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time2S |
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. |
| Resistance to the heat of soldering | No visual damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time :242 hours. |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | |
| Flexural Strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm, Bend speed: 0.5mm/sec. Electro static capacity change rate: C/C10% |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal Shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | Run 5 cycles. Test after placing 242 hours at normal temp & humidity. |
| Temperature Moisture Exposure | Visual: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after placing 242 hours at normal temp & humidity. |
| High Temperature Exposure | Visual: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after placing 48 hours under normal pressure & temperature. |
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB. Pressing direction based on diagram. |
| 6. Embossed Plastic Taping | ||
| Type | Tape size (mm) A B C D E F G H J T | |
| 0805 | 1.550.20 2.350.20 8.000.20 3.500.05 1.750.10 4.000.10 2.000.10 4.000.10 1.50 -0/+0.10 1.50 Max | |
| 1206 | 1.950.20 3.600.20 8.000.20 3.500.05 1.750.10 4.000.10 2.000.10 4.000.10 1.50 -0/+0.10 1.85 Max | |
| 1210 | 2.700.10 3.420.10 8.000.10 3.500.05 1.750.10 4.000.10 2.000.05 4.000.10 1.55 -0/+0.10 3.2 Max | |
| 1808 | 2.200.10 4.950.10 12.000.10 5.500.05 1.750.10 4.000.10 2.000.05 4.000.10 1.50 -0/+0.10 3.0 Max | |
| 1812 | 3.660.10 4.950.10 12.000.10 5.500.05 1.750.10 8.000.10 2.000.05 4.000.10 1.55 -0/+0.10 4.0 Max | |
| 6. Paper Tape Reel Packing | ||
| Code | Paper size (mm) W1 L1 D C B P1 P2 P0 d t | |
| 1005 | 0.240.02 0.450.02 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 0.30 Below | |
| 0201 | 0.370.10 0.670.10 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 0.80 Below | |
| 0402 | 0.650.10 1.150.10 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 0.80 Below | |
| 0603 | 1.100.10 1.900.10 8.000.10 3.500.05 1.750.10 4.000.10 2.000.10 4.000.10 1.50 -0/+0.10 1.10 Max | |
| 0805 | 1.450.15 2.300.15 8.00.15 3.500.05 1.750.10 4.000.10 2.000.10 4.000.10 1.50 -0/+0.10 1.10 Max | |
| 1206 | 1.800.20 3.400.20 8.000.20 3.500.05 1.750.10 4.000.10 2.000.10 4.000.10 1.50 -0/+0.10 1.10 Max | |
| 7. Reel Dimensions | ||
| Unit: mm | 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max |
| 8. Taping Specification | ||
| Top tape peeling strength | Standard: 0.1N < peeling strength < 0.7N | No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. |
| 9. Packing Quantity | ||
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) |
| 0603 | 4000 | - |
| 0805 | 4000 | 3000 (T1.35mm) |
| 1206 | - | 3000 (T1.60mm), 2000 (T1.60mm) |
| 1210 | - | 1000 (T1.85mm), 800 (T1.85mm) |
| 1812 | - | 500 |
| 10. Precautions For Use | ||
| Soldering Profile | To avoid crack problem by sudden temperature change, follow the temperature profile in the adjacent graph. | |
| Manual Soldering | Handle soldering iron carefully, pay attention to the selection of soldering iron tip and temperature contact. | |
| Recommended Soldering Method | RReflow Soldering, WWave Soldering | |
| Soldering Temperature Profile | Preheating: Keep temperature difference between soldering temperature and surface temperature of chips as T150. | |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina