High voltage ceramic capacitor for power supply and energy saving lamps AIDE CAPACITOR 1808C0G4R7B302NT multi layer MLCC
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and lighting circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in a range of standard sizes and offer different temperature characteristics (C0G, X7R, X5R) with precise capacitance tolerances and rated voltages.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description | Specification | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | ||||||||||
| Coupling, Wave Filtering, Resonant | High voltage circuits, Switch power supplier, AC-DC power charger, DC-DC power charger, Networking/Communication interface, LCD backlight unit power supplier, Amperite of energy saving lamps (Medium and High voltage MLCC) | |||||||||
| Testing Conditions | ||||||||||
| Normal Condition | Temperature | 15~35 | ||||||||
| Humidity | 45~75%RH | |||||||||
| Atmosphere | 86~106kPa | |||||||||
| Relative Condition | Temperature | 252 | ||||||||
| Humidity | 60~70%RH | |||||||||
| Atmosphere | 86~106kPa | |||||||||
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||||||||||
| 1. Dimension Code | Size (inch) | 0201 (0.02*0.01), 0402 (0.04*0.02), 0603 (0.06*0.03), 0805 (0.08*0.05), 1206 (0.12*0.06), 1210 (0.12*0.10), 1808 (0.18*0.08), 1812 (0.18*0.12), 1825 (0.18*0.25), 2211 (0.22*0.11), 2225 (0.22*0.25) | ||||||||
| 2. Temperature Characteristic | Code | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||||||
| 3. Nominal Electrostatic Capacity | Format | 8R08.0pF, 10010pF, 101100pF | ||||||||
| 4. Tolerance of Electrostatic Capacity | Code | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||||||
| 5. Rated Voltage (DC) | Code | 25025V, 251250V, 2522500V | ||||||||
| 6. Terminal Composition | Material | Au/Ag-Ni-Sn | ||||||||
| 7. Packing | Code | T (Tape/Reel), P (Bag packing) | ||||||||
| Construction | ||||||||||
| Item | Description | Material | ||||||||
| 1 | Ceramic dielectric | |||||||||
| 2 | Inner electrode | |||||||||
| 3 | Outer electrode | |||||||||
| 4 | Nickle layer | |||||||||
| 5 | Tin layer | |||||||||
| Dimension (mm) | ||||||||||
| Part Number | L | W | T | WB | ||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | ||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | ||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | ||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | ||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | ||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | ||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | ||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | ||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | ||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | ||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | ||||||
| Specification and Testing Method | ||||||||||
| Item | Specification/Requirement | Testing Method | ||||||||
| 1. Temperature | -55~+125 | |||||||||
| 2. Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||||||||
| 3. Static Capacity | Meet standard specification and tolerance | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF). X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF). | ||||||||
| 4. Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF); DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15% (50pFCr). X7R/X7T/X7P: See Note 1. | NPO: 1MHz10%, 1V0.2rms (Cr1000pF); 1KHz10%, 1V0.2rms (Cr1000pF). X7R/X7T/X7P: 1KHz10%, 1V0.1rms (Cr10uF); 120Hz24, 0.5V0.1rms (Cr10uF). | ||||||||
| 5. IR Insulation Resistance | NPO: IR50000M (C10nF); IR*Cr500S (C10nF). X7R/X7T/X7P: IR10000M (C25nF); IR*Cr100S (C25nF). | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA. | ||||||||
| 6. Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S. | ||||||||
| 7. Solderability | Soldering area90% | Pre-heating 80-120 (10-30s), lead free solder, flux. Soldering temp 2455 (20.5s). | ||||||||
| 8. Resistance to the heat of soldering | No damage, soldering area90% | Pre-heating 100-200 (102s), soldering temp 2655 (51s). Cleaning with solvent. Room temp, 242 hours. | ||||||||
| 9. Flexural Strength | No damage. Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | ||||||||
| 10. Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S. | ||||||||
| 11. Thermal Shock | NPO: C/C2.5% or 0.25pF. X7R/X7P: C/C0.5%. X7T: C/C10%. | 5 cycles. Test after 242 hours at normal temp & humidity. | ||||||||
| 12. Temperature Moisture Exposure | Visual: No damage. Capacity change rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S. X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, Time 50024 hours. Test after 242 hours at normal temp & humidity. | ||||||||
| 13. High Temperature Exposure | Visual: No damage. Capacity change rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S. X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). | ||||||||
| 14. PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB, then pressing. | ||||||||
| Embossed Plastic Taping Dimensions (mm) | ||||||||||
| Code | Tape size A | B | C | D | E | F | G | H | J | T |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max |
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max |
| Paper Tape Reel Packing Dimensions (mm) | ||||||||||
| Code | Paper size W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below |
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below |
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| Reel Dimensions (mm) | ||||||||||
| Reel Type | A | B | C | D | E | F | G | |||
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| Packing Quantity (Pcs) | ||||||||||
| Size | Paper T/R | Plastic T/R | ||||||||
| 0603 | 4000 | - | ||||||||
| 0805 | 4000 | 3000 (T1.35mm) | ||||||||
| 1206 | - | 3000 (T1.60mm), 2000 (T1.60mm) | ||||||||
| 1210 | - | 3000 (T1.85mm), 1000 (T1.85mm) | ||||||||
| 1808 | - | 800 | ||||||||
| 1812 | - | 500 | ||||||||
| Precautions For Use | ||||||||||
| 1. Soldering Profile | Follow the temperature profile in the adjacent graph to avoid cracks due to sudden temperature change. | |||||||||
| 2. Manual Soldering | Handle soldering iron carefully to avoid thermal cracks. Pay attention to tip selection and temperature. | |||||||||
| 3. Optimum Solder Amount for Reflow Soldering | Recommended soldering amounts are provided. | |||||||||
| 4. Recommended Soldering Method | Details provided for different sizes, temperature characteristics, rated voltage, and capacitance. Methods include Reflow Soldering (R) and Wave Soldering (W). | |||||||||
| 5. Temperature Profile for Soldering | Keep the temperature difference between soldering temperature and surface temperature of chips as T150 during preheating. | |||||||||
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina