Ceramic Capacitor for AC DC and DC DC Power Chargers AIDE CAPACITOR 1206X7R681K102NT Multi Layer Design
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various high-voltage circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance in demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode
- Terminal Composition: Au/Ag-Ni-Sn
- Compliance: RoHS/REACH compliant
Technical Specifications
| Item | Description/Specification | Testing Method | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | ||||||||||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | ||||||||||
| Testing Conditions | ||||||||||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||||||||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||||||||
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||||||||||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||||||||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |||||||||
| 3. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |||||||||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |||||||||
| 5. Rated Voltage (DC) | 250 25, 251 250, 252 2500 (V) | |||||||||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |||||||||
| 7. Packing | T Tape/Reel, P Bag packing (PE) | |||||||||
| Construction | ||||||||||
| 1 | Ceramic dielectric | |||||||||
| 2 | Inner electrode | |||||||||
| 3 | Outer electrode | |||||||||
| 4 | Nickle layer | |||||||||
| 5 | Tin layer | |||||||||
| Dimension (mm) | ||||||||||
| Part Number | L | W | T | WB | ||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | ||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | ||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | ||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | ||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | ||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | ||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | ||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | ||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | ||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | ||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | ||||||
| Specification and Testing Method | ||||||||||
| Temperature | -55~+125 | |||||||||
| Visual/ Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||||||||
| Static Capacity | Meet standard specification and tolerance | See details in original document | ||||||||
| Dissipation factor (DF) | NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) | See details in original document | ||||||||
| IR Insulation Resistance | NPO Characteristic: IR50000M,C10nF; IR*Cr500S,C10nF | Rated voltage, Time:605s, Humidity:75%, Temperature:255, Current :50mA | ||||||||
| Hi-pot (DC) | No dielectric breakdown or damage | See details in original document (based on Ur) | ||||||||
| Solderability | soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux; Soldering temperature 2455; Solder time 20.5s | ||||||||
| Resistance to the heat of soldering | No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time :242 hours. | ||||||||
| Electrostatic capacity change rate | NPO Characteristic: C/C0.5% or 0.5pF larger reading; X7R :C/C15%; X7T -33% C/C22%; X7PC/C10% | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. | ||||||||
| Flexural strength | No damage; Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB; PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm; Flexural depth: 1mm; Bend speed: 0.5mm/sec. | ||||||||
| Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | ||||||||
| Thermal shock | NPO Characteristic; C/C2.5% or 0.25pF (larger reading); X7R/X7P- characteristic: C/C0.5%; X7T characteristic C/C10% | Pre-condition(X7R h characteristic):Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity | ||||||||
| Temperature moisture exposure | Visual No visual damage; Electrostatic capacitance change rate NPO characteristic: C/C2% or 1pF (larger reading); X7R/X7T/X7P characteristic: C/C10%; DF 2 times initial standard; IR NPO characteristic: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P : IR1000M or IR*Cr25S (Lower reading) | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity | ||||||||
| High temperature exposure | Visual No visual damage; Electrostatic capacitance change rate NPO : C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%; DF 2 X initial standard; IR NPO : IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P : IR2000M or IR*Cr50S (Lower reading) | Temperature 1253, Time 100048 hours, Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test it after place 48 hours under normal pressure & temperature. | ||||||||
| PCB flexural strength | No crack and other defect | Soldering the MLCC on the PCB, Then pressing direction base on the photo. | ||||||||
| Embossed Plastic Taping Dimensions (mm) | ||||||||||
| Code | Tape size A | B | C | D | E | F | G | H | J | T |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max |
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max |
| Paper Tape Reel Packing Dimensions (mm) | ||||||||||
| Code | Paper size W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below |
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below |
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| Reel Dimensions (unit: mm) | ||||||||||
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| Taping specification | ||||||||||
| Top tape peeling strength | (a) Paper Taping: 0.1N < peeling strength < 0.7N | No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | ||||||||
| Packing Quantity | ||||||||||
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) | ||||||||
| 0603 | 4000 | - | ||||||||
| 0805 | 4000 | 3000 (T1.35mm) | ||||||||
| 1206 | - | 3000 (T1.60mm), 2000 (T1.60mm) | ||||||||
| 1210 | - | 3000 (T1.85mm), 1000 (T1.85mm) | ||||||||
| 1808 | - | 800 | ||||||||
| 1812 | - | 500 | ||||||||
| Precautions For Use | ||||||||||
| Soldering Profile | To avoid crack problem by sudden temperature change, follow the temperature profile in the adjacent graph. | Refer to the graph in the enclosure page. | ||||||||
| Manual Soldering | Risk of thermal cracks due to direct contact with soldering iron tip. Handle carefully, pay attention to tip selection and temperature. | |||||||||
| Optimum Solder Amount for Reflow Soldering | ||||||||||
| Recommended Soldering Method | See details in original document (Size, Temperature Characteristics, Rated Voltage, Capacitance vs. Soldering Method) | RReflow Soldering, WWave Soldering | ||||||||
| Soldering Temperature Profile | Keep temperature difference between soldering temperature and surface temperature of chips 150 during preheating. | |||||||||
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina