multilayer ceramic capacitor AIDE CAPACITOR 1206X7R475K250NT for AC DC power chargers and energy saving lamps applications
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonance in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. They are suitable for medium and high voltage requirements.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description/Specification | Details | |||
|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | ||||
| Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | |||||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||
| Part Number Description | Item 1: Dimension Code | 0201 (0.02*0.01 inch / 0.50*0.25 mm), 0402 (0.04*0.02 inch / 1.00*0.50 mm), 0603 (0.06*0.03 inch / 1.60*0.80 mm), 0805 (0.08*0.05 inch / 2.00*1.25 mm), 1206 (0.12*0.06 inch / 3.20*1.60 mm), 1210 (0.12*0.10 inch / 3.20*2.50 mm), 1808 (0.18*0.08 inch / 4.50*2.00 mm), 1812 (0.18*0.12 inch / 4.50*3.20 mm), 1825 (0.18*0.25 inch / 4.50*6.30 mm), 2211 (0.22*0.11 inch / 5.70*2.8 mm), 2225 (0.22*0.25 inch / 5.70*6.30 mm) | |||
| Item 2: Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| Item 3: Nominal Electrostatic Capacity | 8R0 = 8.0pF, 100 = 10pF, 101 = 100pF | ||||
| Item 4: Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | ||||
| Item 5: Rated Voltage (DC) | 250 = 25V, 251 = 250V, 252 = 2500V | ||||
| Item 6: Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||||
| Item 7: Packing | T: Tape/Reel, P: Bag packing (PE) | ||||
| Construction | Ceramic dielectric | - | |||
| Inner electrode | - | ||||
| Outer electrode | - | ||||
| Nickle layer | - | ||||
| Tin layer | - | ||||
| Dimensions (mm) | Part Number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Temperature Range | -55~+125 | ||||
| Dissipation Factor (DF) | Refer to Specification Table (Page 3 & 4) | ||||
| Insulation Resistance (IR) | Refer to Specification Table (Page 3 & 6) | ||||
| Hi-pot (DC) | Refer to Specification Table (Page 3) | ||||
| Solderability | Soldering area 90%, Visual-No damage. Pre-heating: 80-120, 10-30s. Solder temp: 2455, Time: 20.5s. | ||||
| Resistance to the heat of soldering | Visual-No damage, soldering area 90%. Pre-heating: 100-200, 102s. Solder temp: 2655, Time: 51s. Cleaning with solvent. Room temp, 242 hours. | ||||
| Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electrostatic capacity change rate: C/C10%. | ||||
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | ||||
| Thermal Shock | Capacity change rate: NPO 2.5% or 0.25pF, X7R/X7P 0.5%, X7T 10%. Test after 5 cycles. | ||||
| Temperature Moisture Exposure | Capacity change rate: NPO 2% or 1pF, X7R/X7T/X7P 10%. DF 2 times initial standard. IR: NPO 2500M or IR*Cr 25S, X7R/X7T/X7P 1000M or IR*Cr 25S. Test at 402, 90~95%RH for 50024 hours. | ||||
| High Temperature Exposure | Capacity change rate: NPO 2% or 1pF, X7R/X7T/X7P 20%. DF 2 X initial standard. IR: NPO 4000M or IR*Cr 40S, X7R/X7T/X7P 2000M or IR*Cr 50S. Test at 1253 for 100048 hours. | ||||
| PCB Flexural Strength | No crack and other defect. IR. | ||||
| Packing Quantity | Refer to Packing Quantity Table (Page 11) | ||||
Note: Initial capacitance testing requires pre-heating at 150 for 1 hour, then placing for 48 hours under normal pressure and temperature.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina