High voltage MLCC AIDE CAPACITOR 1206X7R223K251NT optimized for resonant circuits and energy saving lamp applications
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MOQ:
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Delivery Time:
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Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, adhering to strict testing conditions for reliable performance.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: ROHS/REACH compliance
Technical Specifications
| Item | Description / Specification | Details | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| 1. Application Field | ||||||||||
| Primary Applications | Coupling, wave filtering, resonant in high voltage circuits | |||||||||
| Specific Applications | Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | |||||||||
| 2. Testing Conditions | ||||||||||
| Normal Condition | Temperature | 15~35 | ||||||||
| Humidity | 45~75%RH | |||||||||
| Atmosphere | 86~106kPa | |||||||||
| Relative Condition | Temperature | 252 | ||||||||
| Humidity | 60~70%RH | |||||||||
| Atmosphere | 86~106kPa | |||||||||
| 3. Part Number Description | ||||||||||
| Item 1: Dimension Code | Examples | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | ||||||||
| Dimensions (mm) | 0201: 0.50*0.25, 0402: 1.00*0.50, 0603: 1.60*0.80, 0805: 2.00*1.25, 1206: 3.20*1.60, 1210: 3.20*2.50, 1808: 4.50*2.00, 1812: 4.50*3.20, 1825: 4.50*6.30, 2211: 5.70*2.8, 2225: 5.70*6.30 | |||||||||
| Item 2: Temperature Characteristic | Codes | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||||||
| Item 3: Nominal Electrostatic Capacity | Format | 8R0=8.0pF, 100=10pF, 101=100pF | ||||||||
| Item 4: Tolerance of Electrostatic Capacity | Codes | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||||||
| Item 5: Rated Voltage (DC) | Format | 250=25V, 251=250V, 252=2500V | ||||||||
| Item 6: Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |||||||||
| Item 7: Packing | Codes | T (Tape/Reel), P (Bag packing) | ||||||||
| 4. Construction | ||||||||||
| Item | Description | |||||||||
| 1 | Ceramic dielectric | |||||||||
| 2 | Inner electrode | |||||||||
| 3 | Outer electrode | |||||||||
| 4 | Nickle layer | |||||||||
| 5 | Tin layer | |||||||||
| 5. Dimensions (mm) | ||||||||||
| Part Number | L | W | T | WB | ||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | ||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | ||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | ||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | ||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | ||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | ||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | ||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | ||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | ||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | ||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | ||||||
| 6. Specification and Testing Method | ||||||||||
| No | Item | Specification / Requirement | Testing Method | |||||||
| 1 | Temperature | -55~+125 | ||||||||
| 2 | Visual / Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection) Digital calliper | |||||||
| 3 | Static Capacity | Meet standard specification and tolerance | ||||||||
| NPO characteristic | 1000pF: 1MHz10%, 1.00.2Vrms 1000pF: 1KHz10%, 1.00.2Vrms | |||||||||
| X7R/X7T/X7P characteristic | 10uF: 1KHz10%, 1.00.2Vrms 10uF: 120Hz24, 0.50.1Vrms | |||||||||
| 4 | Dissipation Factor (DF) | |||||||||
| NPO Characteristic | DF0.56, Cr5 pF DF1.5[(150/Cr)+7]10-4 (5pFCr50pF) DF0.15%, (50pFCr) | Cr1000pF, 110%MHz, 1V0.2rms Cr1000pF, 110%KHz, 1V0.2rms | ||||||||
| X7R/X7T/X7P characteristic | See Note 1 | Cr10uF, 110%KHz, 1V0.1rms Cr10uF, 12024Hz, 0.5V0.1rms | ||||||||
| 5 | IR Insulation Resistance | |||||||||
| NPO Characteristic | IR50000M, C10nF IR*Cr500S, C10nF | Rated voltage, 605s, Humidity:75%, Temp:255, Current:50mA | ||||||||
| X7R/X7T/X7P Characteristic | IR10000M, C25nF IR*Cr100S, C25nF | |||||||||
| 6 | Hi-pot (DC) | No dielectric breakdown or damage | ||||||||
| Voltage | Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage | Voltage Raising time: 110S, Voltage maintaining time2S | ||||||||
| 7 | Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |||||||
| 8 | Resistance to the heat of soldering | No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |||||||
| Electrostatic capacity change rate | NPO: C/C0.5% or 0.5pF (larger reading) X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | |||||||||
| DF | Refer to NO#4 | |||||||||
| IR | Refer to NO#5 | |||||||||
| 9 | Flexural Strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | |||||||
| Electrostatic capacity change rate | C/C10% | Test it under the flexural status. Flexural depth 452 | ||||||||
| 10 | Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |||||||
| 11 | Thermal Shock | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. | ||||||||
| NPO Characteristic | C/C2.5% or 0.25pF (larger reading) | |||||||||
| X7R/X7P characteristic | C/C0.5% | |||||||||
| X7T characteristic | C/C10% | |||||||||
| 12 | Temperature Moisture Exposure | Visual: No visual damage | Test it after place 242 hours normal temp & humidity. Temperature 402, Humidity 90~95%RH, time 500+24 hours. | |||||||
| Electrostatic capacitance change rate | NPO: C/C2% or 1pF (larger reading) X7R/X7T/X7P: C/C10% | |||||||||
| DF | 2 times initial standard | |||||||||
| IR | NPO: IR2500M or IR*Cr25S (Lower reading) X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | |||||||||
| 13 | High Temperature Exposure | Visual: No visual damage | Test it after place 48hours under normal pressure & temperature. Temperature 1253, Time 100048 hours. | |||||||
| Charging and discharging current | 50mA Max. | |||||||||
| Voltage | 100VV250V: 2x Rated voltage 250VV1KV: 1.5x rated voltage 1KVV: 1.2x rated voltage | |||||||||
| Electrostatic capacitance change rate | NPO: C/C2% or 1pF (larger reading) X7R/X7T/X7P: C/C20% | |||||||||
| DF | 2 X initial standard | |||||||||
| IR | NPO: IR4000M or IR*Cr40S (Lower reading) X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | |||||||||
| 14 | PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB. Then pressing direction base on the photo. SIZE A B C 0805(2012) 1.2 4 1.65, 1206(3216) 2.2 5 2, 1210(3225) 2.2 5 2.9, 1812(4532) 3.5 7 3.7, 2220(5750) 4.5 8 5.6 | |||||||
| 7. Embossed Plastic Taping | ||||||||||
| Code | Tape size A | B | C | D | E | F | G | H | J | |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | |
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | |
| 8. Paper Tape Reel Packing | ||||||||||
| Code | Paper size W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.240.02 | 0.450.02 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.30 Below |
| 0201 | 0.370.10 | 0.670.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below |
| 0402 | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below |
| Code | Paper size A | B | C | D | E | F | G | H | J | T |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 9. Reel Dimensions (unit: mm) | ||||||||||
| Unit | A | B | C | D | E | F | G | |||
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| 10. Taping Specification | ||||||||||
| Top tape peeling strength | (a) Paper Taping Reel type: 0.1N | (b) Embossed Taping Standard: 0.1N | ||||||||
| 11. Packing Quantity | ||||||||||
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) | ||||||||
| 0603 | 4000 | - | ||||||||
| 0805 | 4000 | 3000 (T1.35mm) | ||||||||
| 1206 | - | 3000 (T1.60mm), 2000 (T1.60mm) | ||||||||
| 1210 | - | 1000 (T1.85mm), 800 (T1.85mm) | ||||||||
| 1808 | - | 500 | ||||||||
| 1812 | - | 500 | ||||||||
| 12. Precautions For Use | ||||||||||
| Soldering Profile | To avoid crack problems from sudden temperature changes, follow the recommended soldering profile. | |||||||||
| Manual Soldering | Exercise caution to prevent thermal cracks. Ensure proper soldering iron tip selection and temperature contact. | |||||||||
| Optimum Solder Amount for Reflow Soldering | Refer to recommended soldering amounts. | |||||||||
| Recommended Soldering Method | RReflow Soldering, WWave Soldering | |||||||||
| Soldering Temperature Profile | Keep temperature difference between soldering temperature and surface temperature of chips T150 during preheating. | |||||||||
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina