MLCC capacitor designed for medium and high voltage applications AIDE CAPACITOR 1206X7R221K202NT
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Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is utilized in coupling, wave filtering, and resonant functions within various high-voltage circuits. Key application areas include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are suitable for medium and high voltage requirements.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- RoHS Compliance: Meets the standard
- REACH Compliance: Meets the standard
Technical Specifications
| Item | Description/Specification | Details |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power suppliers, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power suppliers, amperites of energy saving lamps (Medium and High voltage MLCC). | |
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Part Number Description | Example: 1812 X7R 684 M 251 N T | |
| Dimension Codes | 0201 (0.02*0.01 inch / 0.50*0.25 mm) 0402 (0.04*0.02 inch / 1.00*0.50 mm) 0603 (0.06*0.03 inch / 1.60*0.80 mm) 0805 (0.08*0.05 inch / 2.00*1.25 mm) 1206 (0.12*0.06 inch / 3.20*1.60 mm) 1210 (0.12*0.10 inch / 3.20*2.50 mm) 1808 (0.18*0.08 inch / 4.50*2.00 mm) 1812 (0.18*0.12 inch / 4.50*3.20 mm) 1825 (0.18*0.25 inch / 4.50*6.30 mm) 2211 (0.22*0.11 inch / 5.70*2.8 mm) 2225 (0.22*0.25 inch / 5.70*6.30 mm) | |
| Temperature Characteristic | C0G (030 PPM/) X7R (15%) X5R (15%) | |
| Nominal Electrostatic Capacity | 8R0 = 8.0 pF, 100 = 10 pF, 101 = 100 pF | |
| Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | |
| Rated Voltage (DC) | 250 = 25V, 251 = 250V, 252 = 2500V | |
| Packing | T = Tape/Reel, P = Bag packing (PE) | |
| Construction | 1. Ceramic dielectric 2. Inner electrode 3. Outer electrode 4. Nickel layer 5. Tin layer | |
| Dimensions (mm) | (See detailed table in original document for each code: 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2220, 2225) | |
| Operating Temperature Range | -55~+125 | |
| Dissipation Factor (DF) | (See detailed specifications for NPO and X7R/X7T/X7P characteristics in original document) | |
| Insulation Resistance (IR) | (See detailed specifications for NPO and X7R/X7T/X7P characteristics in original document) | |
| Hi-pot (DC) | (See detailed specifications based on rated voltage in original document) | |
| Solderability | Soldering area 90%, Visual-No damage | |
| Resistance to the heat of soldering | Visual-No damage, soldering area 90% | |
| Electrostatic Capacity Change Rate | (See detailed specifications for NPO, X7R, X7T, X7P characteristics in original document) | |
| Flexural Strength | No damage, Electrostatic capacity change rate C/C10% | |
| Terminal Bonding Strength | No visual damage, Applied Force: 5N, Duration: 101S | |
| Thermal Shock | (See detailed specifications for NPO, X7R/X7P, X7T characteristics in original document) | |
| Temperature Moisture Exposure | (See detailed specifications for NPO, X7R/X7T/X7P characteristics in original document) | |
| High Temperature Exposure | (See detailed specifications for NPO, X7R/X7T/X7P characteristics in original document) | |
| PCB Flexural Strength | No crack and other defect | |
| Embossed Plastic Taping Dimensions | (See detailed table in original document for codes 0805 to 1812) | |
| Paper Tape Reel Packing Dimensions | (See detailed table in original document for codes 1005, 0201, 0402, 0603, 0805, 1206) | |
| Reel Dimensions | 7' REEL: 1782.0, 13' REEL: 3302.0 | |
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N (Embossed Taping) | |
| Packing Quantity | (See detailed table in original document for various sizes and packing types) | |
| Soldering Profile | (Refer to graph in adjacent page in original document) | |
| Recommended Soldering Method | (See detailed table in original document for size, characteristics, voltage, capacitance) | |
| Soldering Temperature Profile | Preheating temperature difference T 150 | |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina