multi layer ceramic capacitor AIDE CAPACITOR 0603X7R101K101NT designed for coupling wave filtering and resonant functions
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
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Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance under specified conditions.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description/Specification |
|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits (switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc.) (Medium and High voltage MLCC) |
| Testing Conditions (Normal) | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa |
| Testing Conditions (Relative) | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa |
| Part Number Description Example | 1812 X7R 684 M 251 N T |
| Dimension Code (L*W) | 0201: 0.02*0.01 inch (0.50*0.25 mm) |
| 0402: 0.04*0.02 inch (1.00*0.50 mm) | |
| 0603: 0.06*0.03 inch (1.60*0.80 mm) | |
| 0805: 0.08*0.05 inch (2.00*1.25 mm) | |
| 1206: 0.12*0.06 inch (3.20*1.60 mm) | |
| 1210: 0.12*0.10 inch (3.20*2.50 mm) | |
| 1808: 0.18*0.08 inch (4.50*2.00 mm) | |
| 1812: 0.18*0.12 inch (4.50*3.20 mm) | |
| 1825: 0.18*0.25 inch (4.50*6.30 mm) | |
| 2211: 0.22*0.11 inch (5.70*2.8 mm) | |
| 2225: 0.22*0.25 inch (5.70*6.30 mm) | |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) |
| Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% |
| Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V |
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer |
| Dimension (mm) | 0603 (0201): L 0.600.10, W 0.300.05, T 0.300.05, WB 0.100.05 |
| 1005 (0402): L 1.000.15, W 0.500.15, T 0.500.10, WB 0.200.10 | |
| 1608 (0603): L 1.600.20, W 0.800.15, T 0.800.15, WB 0.300.10 | |
| 2012 (0805): L 2.000.20, W 1.250.20, T 0.800.20, WB 0.500.20 | |
| 3216 (1206): L 3.200.30, W 1.600.30, T 1.000.20, WB 0.600.30 | |
| 3225 (1210): L 3.200.30, W 2.500.30, T 2.70, WB 0.800.30 | |
| 4520 (1808): L 4.500.40, W 2.000.20, T 2.70, WB 0.800.30 | |
| 4532 (1812): L 4.500.40, W 3.200.30, T 3.50, WB 0.800.30 | |
| 4563 (1825): L 4.500.40, W 6.300.50, T 3.50, WB 0.800.30 | |
| 5750 (2220): L 5.700.50, W 5.000.50, T 3.50, WB 1.000.40 | |
| 5763 (2225): L 5.700.50, W 6.300.50, T 6.20, WB 1.000.40 | |
| Operating Temperature Range | -55~+125 |
| Dissipation Factor (DF) | Refer to Specification Table on Page 3 and Note 1 on Page 4. |
| Insulation Resistance (IR) | NPO: IR50000M (C10nF), IR*Cr500S (C>10nF). X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C>25nF). Testing condition: Rated voltage, 605s, Humidity: 75%, Temperature: 255, Current: 50mA. |
| Hi-pot (DC) | Dielectric breakdown or damage: Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S. |
| Solderability | Soldering area 90%. Visual-No damage. Pre-heating: 80-120, 10-30s. Lead free solder, flux. Soldering temperature: 2455. Solder time: 20.5s. |
| Resistance to the heat of soldering | Visual-No damage, soldering area 90%. Pre-heating: 100-200, 102s. Soldering temperature: 2655. Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| Electrostatic Capacity Change Rate | NPO: |C/C|0.5% or 0.5pF. X7R: |C/C|15%. X7T: -33% C/C22%. X7P: |C/C|10%. |
| Flexural Strength | No damage. Electro static capacity change rate |C/C|10%. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. |
| Terminal Bonding Strength | No visual damage. Applied Force: 5N. Duration: 101S. |
| Thermal Shock | NPO: |C/C|2.5% or 0.25pF. X7R/X7P: |C/C|0.5%. X7T: |C/C|10%. 5 cycles. |
| Temperature Moisture Exposure | Visual: No visual damage. Capacity change rate: NPO: |C/C|2% or 1pF. X7R/X7T/X7P: |C/C|10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S. X7R/X7T/X7P: IR1000M or IR*Cr25S. Test condition: 402, 90~95%RH, 50024 hours. |
| High Temperature Exposure | Visual: No visual damage. Capacity change rate: NPO: |C/C|2% or 1pF. X7R/X7T/X7P: |C/C|20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S. X7R/X7T/X7P: IR2000M or IR*Cr50S. Test condition: 1253, 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). |
| PCB Flexural Strength | No crack and other defect. IR test. |
| Embossed Plastic Taping Dimensions | Details provided for 0805, 1206, 1210, 1808, 1812 sizes (Tape size, A, B, C, D, E, F, G, H, J, T). |
| Paper Tape Reel Packing Dimensions | Details provided for 1005, 0201, 0402, 0603, 0805, 1206 sizes (Paper size, W1, L1, D, C, B, P1, P2, P0, d, t). |
| Reel Dimensions | 7' REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. 13' REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. |
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling. |
| Packing Quantity | Paper T/R (Pcs): 0805 (4000), 1206 (4000). Plastic T/R (Pcs): 0805 (3000), 1206 (T1.35mm 3000, T>1.35mm 2000), 1210 (T1.60mm 3000, T>1.60mm 2000), 1808 (1000), 1812 (T1.85mm 1000, T>1.85mm 800), 1812+ (500). |
| Soldering Method Recommendation | RReflow Soldering, WWave Soldering. Specific recommendations based on size, characteristics, voltage, and capacitance. |
| Soldering Temperature Profile | Preheating: T150 temperature difference between soldering temperature and surface temperature of chips. |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina