multi layer ceramic capacitor AIDE CAPACITOR 0402C0G221J500NT designed for coupling wave filtering and resonant circuit
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and energy-saving lamp circuits. Key applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description/Specification | Details | ||
|---|---|---|---|---|
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | ||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |||
| Nominal Electrostatic Capacity | 8R08.0pF, 10010pF, 101100pF | |||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |||
| Rated Voltage (DC) | 25025V, 251250V, 2522500V | |||
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |||
| Packing | T (Tape/Reel), P (Bag packing) | |||
| Testing Condition (Normal) | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||
| Testing Condition (Relative) | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps. | |||
| Construction and Dimension | Construction Items | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | ||
| Dimension (mm) - British System | Metric System | |||
| Part Number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 |
| Specification and Testing Method | Item | Specification/Requirement | Testing method | |
| Temperature | -55~+125 | N/A | ||
| Visual/ Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||
| Static capacity | Meet standard specification and tolerance (NPO, X7R/X7T/X7P characteristics) | See detailed specifications in source | ||
| Dissipation factor (DF) | See detailed specifications in source (NPO, X7R/X7T/X7P characteristics) | See detailed specifications in source | ||
| IR Insulation Resistance | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C>10nF. X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C>25nF. Testing condition: Rated voltage, Time:605s, Humidity:75%, Temperature:255, Current :50mA | N/A | ||
| Hi-pot (DC) | No dielectric breakdown or damage. Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time2S | N/A | ||
| Solderability | Soldering area 90%, Visual-No damage | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||
| Resistance to the heat of soldering | Visual-No damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||
| Electrostatic capacity change rate | NPO Characteristic: C/C0.5% or 0.5pF (larger reading). X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10% | N/A | ||
| Flexural strength | No damage. Electro static capacity change rate C/C10%. Flexural depth 452 mm | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | ||
| Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | ||
| Thermal shock | NPO Characteristic: C/C2.5% or 0.25pF (larger reading). X7R/X7P characteristic: C/C0.5%. X7T characteristic: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. | ||
| Taping Specification | Embossed Plastic Taping Dimensions | See detailed dimensions in source for 0805 to 1812 types. | ||
| Paper Tape Reel Packing Dimensions | See detailed dimensions in source for 1005, 0201, 0402, 0603, 0805, 1206 types. | |||
| Reel Dimensions | 7REEL: 1782.0mm, 13REEL: 3302.0mm | |||
| Top tape peeling strength | (a) Paper Taping: Standard: 0.1N < peeling strength < 0.7N. (b) Embossed Taping: Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | |||
| Packing Quantity | See detailed quantities in source for Paper T/R and Plastic T/R by size. | N/A | ||
| Soldering Method Recommendation | RReflow Soldering, WWave Soldering. See detailed recommendations by size, temperature characteristic, rated voltage, and capacitance in source. | N/A |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina