high voltage multi layer ceramic capacitor AIDE CAPACITOR 0603C0G103J500NT for switch power supplies and energy saving lamps
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications, including coupling, wave filtering, and resonant functions. It is suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance in demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer
- Certifications: ROHS/REACH compliance
Technical Specifications
| Item | Description/Specification | Testing Method | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | |||||||||||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | |||||||||||
| Testing Conditions | |||||||||||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | ||||||||||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||||||||
| Part Number Description Example: 1812 X7R 684 M 251 N T | |||||||||||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | ||||||||||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||||||||
| 3. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | ||||||||||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||||||||
| 5. Rated Voltage (DC) | 250 25, 251 250, 252 2500 (V) | ||||||||||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||||||||||
| 7. Packing | T Tape/Reel, P Bag packing (PE) | ||||||||||
| Construction | |||||||||||
| 1. Ceramic dielectric | |||||||||||
| 2. Inner electrode | |||||||||||
| 3. Outer electrode | |||||||||||
| 4. Nickle layer | |||||||||||
| 5. Tin layer | |||||||||||
| Dimension (mm) | |||||||||||
| Part number | L | W | T | WB | |||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |||||||
| Specification and Testing Method | |||||||||||
| 1. Temperature | -55~+125 | ||||||||||
| 2. Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |||||||||
| 3. Static Capacity | Meet standard specification and tolerance | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF). X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | |||||||||
| 4. Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Cr1000pF, 1MHz10%, 1V0.2rms. Cr1000pF, 1KHz10%, 1V0.2rms. X7R/X7T/X7P: Cr10uF, 1KHz10%, 1V0.1rms. Cr10uF, 12024Hz, 0.5V0.1rms. See Note 1 for exceptions. | ||||||||||
| 5. IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF. | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |||||||||
| 6. Hi-pot (DC) | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage | Voltage Raising time: 110S, Voltage maintaining time: 2S | |||||||||
| 7. Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |||||||||
| 8. Resistance to the heat of soldering | No visual damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |||||||||
| 9. Flexural strength | No damage. Electrostatic capacity change rate: C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | |||||||||
| 10. Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | |||||||||
| 11. Thermal shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | |||||||||
| 12. Temperature moisture exposure | Visual: No visual damage. Capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | |||||||||
| 13. High temperature exposure | Visual: No visual damage. Capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature. | |||||||||
| 14. PCB flexural strength | No crack and other defect. IR | Soldering the MLCC on the PCB, then pressing direction based on photo. | |||||||||
| Embossed Plastic Taping Dimensions (mm) | |||||||||||
| Code | A | B | C | D | E | F | G | H | J | T | |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max | |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max | |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max | |
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max | |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max | |
| Paper Tape Reel Packing Dimensions (mm) | |||||||||||
| Code | Papersize | W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below | |
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | |
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | |
| Code | Papersize | A | B | C | D | E | F | G | H | J | T |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| Reel Dimensions (unit: mm) | |||||||||||
| Type | A | B | C | D | E | F | G | ||||
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | ||||
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | ||||
| Taping Specification | |||||||||||
| Top tape peeling strength | 0.1N < peeling strength < 0.7N | No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | |||||||||
| Packing Quantity | |||||||||||
| Size | Paper T/R (Pcs) | Plastic T/R (Pcs) | |||||||||
| 0603 | 4000 | - | |||||||||
| 0805 | 4000 | 3000 (T1.35mm) | |||||||||
| 1206 | - | 3000 (T>1.35mm), 2000 (T1.60mm) | |||||||||
| 1210 | - | 3000 (T>1.60mm), 2000 | |||||||||
| 1808 | - | 1000 (T1.85mm) | |||||||||
| 1812 | - | 1000 (T>1.85mm), 800 | |||||||||
| 1812 | - | 500 | |||||||||
| Precautions For Use | |||||||||||
| Soldering Profile | To avoid crack problem by sudden temperature change, follow the temperature profile in the adjacent graph. | ||||||||||
| Manual Soldering | Risk of thermal cracks. Handle soldering iron carefully, pay attention to tip selection and temperature contact. | ||||||||||
| Optimum Solder Amount for Reflow Soldering | |||||||||||
| Recommended Soldering Method | Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method | ||||||
| 1005 | NPO | / | / | R | |||||||
| X7R/X5R/X7S/X6S | / | / | R | ||||||||
| 0201 | NPO | / | / | R | |||||||
| X7R/X5R/X7S/X6S | / | / | R | ||||||||
| Y5V | / | / | R | ||||||||
| 0402 | NPO | / | / | R | |||||||
| X7R/X5R/X7S/X6S | / | / | R | ||||||||
| Y5V | / | / | R | ||||||||
| 0603 | NPO | / | / | R/W | |||||||
| X7R/X5R/X7S/X6S | C1uf | R | C1uf | R/W | |||||||
| Y5V | C1uf | R | C1uf | R/W | |||||||
| 0805 | NPO | / | / | R/W | |||||||
| X7R/X5R/X7S/X6S | C4.7uf | R | C4.7uf | R/W | |||||||
| Y5V | C1uf | R | C1uf | R/W | |||||||
| 1206 | NPO | / | / | R/W | |||||||
| X7R/X5R/X7S/X6S | C10uf | R | C10uf | R/W | |||||||
| Y5V | C10uf | R | C10uf | R/W | |||||||
| 1210 | NPO | / | / | R | |||||||
| X7R/X5R/X7S/X6S | / | / | R | ||||||||
| Y5V | / | / | R | ||||||||
| Soldering method | RReflow Soldering, WWave Soldering | ||||||||||
| The temperature profile for soldering | While in preheating, please keep the temperature difference between soldering temperature and surface temperature of chips as: T150. | ||||||||||
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina