High voltage ceramic capacitor AIDE CAPACITOR 1206X7R471K102NT for in switch power supplies and energy saving lamps
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are engineered for medium and high voltage environments.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Category | Specification | Details | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | |||||||||||
| Switch power supplier | ||||||||||||
| AC-DC power charger | ||||||||||||
| DC-DC power charger | ||||||||||||
| Networking/Communication interface | ||||||||||||
| LCD backlight unit power supplier, amperite of energy saving lamps | ||||||||||||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | ||||||||||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||||||||||
| Part Number Description | Example: 1812 X7R 684 M 251 N T | |||||||||||
| Dimension Codes | Code | L*W (inch) | L*W (mm) | |||||||||
| 0201 | 0.02*0.01 | 0.50*0.25 | ||||||||||
| 0402 | 0.04*0.02 | 1.00*0.50 | ||||||||||
| 0603 | 0.06*0.03 | 1.60*0.80 | ||||||||||
| 0805 | 0.08*0.05 | 2.00*1.25 | ||||||||||
| 1206 | 0.12*0.06 | 3.20*1.60 | ||||||||||
| 1210 | 0.12*0.10 | 3.20*2.50 | ||||||||||
| 1808 | 0.18*0.08 | 4.50*2.00 | ||||||||||
| 1812 | 0.18*0.12 | 4.50*3.20 | ||||||||||
| 1825 | 0.18*0.25 | 4.50*6.30 | ||||||||||
| 2211 | 0.22*0.11 | 5.70*2.8 | ||||||||||
| 2225 | 0.22*0.25 | 5.70*6.30 | ||||||||||
| Temperature Characteristic | C0G | (030 PPM/) | ||||||||||
| X7R | (15%) | |||||||||||
| X5R | (15%) | |||||||||||
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |||||||||||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |||||||||||
| Rated Voltage (DC) | 250 25, 251 250, 252 2500 (V) | |||||||||||
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |||||||||||
| Packing | T Tape/Reel, P Bag packing (PE) | |||||||||||
| Construction | 1. Ceramic dielectric | |||||||||||
| 2. Inner electrode | ||||||||||||
| 3. Outer electrode | ||||||||||||
| 4. Nickle layer | ||||||||||||
| 5. Tin layer | ||||||||||||
| Dimensions (mm) | Part number | L | W | T | WB | |||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | ||||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | ||||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | ||||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | ||||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | ||||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | ||||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | ||||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | ||||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | ||||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | ||||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | ||||||||
| Specifications and Testing Methods | Temperature Range | -55~+125 | ||||||||||
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||||||||||
| Static Capacity | Meet standard specification and tolerance | |||||||||||
| Dissipation Factor (DF) | Refer to Note 1 | |||||||||||
| Insulation Resistance (IR) | NPO: IR50000M, C10nF; IR*Cr500S, C>10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C>25nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |||||||||||
| Hi-pot (DC) | No dielectric breakdown or damage. Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | |||||||||||
| Solderability | Soldering area 90%. Visual-No damage. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455. Solder time 20.5s. | |||||||||||
| Resistance to the heat of soldering | Visual-No damage, soldering area 90%. Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |||||||||||
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF (larger reading). X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%. | |||||||||||
| Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. Electro static capacity change rate: C/C10%. Flexural depth: 452. | |||||||||||
| Terminal Bonding Strength | No visual damage. Applied Force: 5N. Duration: 101S. | |||||||||||
| Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading). X7R/X7P: C/C0.5%. X7T: C/C10%. Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | |||||||||||
| Temperature Moisture Exposure | Visual: No visual damage. Test after place 242 hours normal temp & humidity. Temperature: 402, Humidity: 90~95%RH, Time: 50024 hours. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading). X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | |||||||||||
| High Temperature Exposure | Visual: No visual damage. Charging and discharging current 50mA Max. Test after place 48 hours under normal pressure & temperature. Temperature: 1253, Time: 100048 hours. Voltage: 100VV250V: 2x Rated voltage; 250VV1KV: 1.5x rated voltage; 1KVV: 1.2x rated voltage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading). X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | |||||||||||
| PCB Flexural Strength | No crack and other defect. IR. Soldering the MLCC on the PCB, then pressing direction based on the photo. SIZE: A, B, C. 0805(2012): 1.2, 4, 1.65. 1206(3216): 2.2, 5, 2. 1210(3225): 2.2, 5, 2.9. 1812(4532): 3.5, 7, 3.7. 2220(5750): 4.5, 8, 5.6. | |||||||||||
| Embossed Plastic Taping | Code | Tape size (mm) | A | B | C | D | E | F | G | H | J | T |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max | ||
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max | ||
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max | ||
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max | ||
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max | ||
| Paper Tape Reel Packing | Code | Paper size (mm) | W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below | ||
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | ||
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | ||
| Code | Paper size (mm) | A | B | C | D | E | F | G | H | J | T | |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | ||
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | ||
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | ||
| Reel Dimensions (unit: mm) | Type | A | B | C | D | E | F | G | ||||
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||||
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||||
| Taping Specification | Top tape peeling strength | Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | ||||||||||
| Packing Quantity | Size | Paper T/R (Pcs) | Plastic T/R (Pcs) | |||||||||
| 0603 | 4000 | |||||||||||
| 0805 | 4000 | 3000 (T1.35mm) | ||||||||||
| 1206 | 3000 (T>1.35mm) | |||||||||||
| 1210 | 2000 (T1.60mm) | |||||||||||
| 1808 | 3000 (T>1.60mm) | |||||||||||
| 1812 | 2000 | |||||||||||
| 1812 | 1000 (T1.85mm) | |||||||||||
| 1000 (T>1.85mm) | ||||||||||||
| 800 | ||||||||||||
| 500 | ||||||||||||
| Precautions For Use | MLCCs may fail in short or open circuit modes under severe electrical/mechanical stress. To prevent failure, adhere to specified ratings and conditions. Follow safety precautions and application notes. Contact engineering for handling questions. | |||||||||||
| Soldering Profile | Refer to the graph in the enclosure page to avoid cracks due to sudden temperature changes. | |||||||||||
| Manual Soldering | Risk of thermal cracks. Handle soldering iron carefully, paying attention to tip selection and temperature contact. | |||||||||||
| Optimum Solder Amount for Reflow Soldering | Recommended soldering amounts are provided. | |||||||||||
| Recommended Soldering Method | RReflow Soldering, WWave Soldering. Specific recommendations vary by size, temperature characteristics, rated voltage, and capacitance. | |||||||||||
| Soldering Temperature Profile | During preheating, keep the temperature difference between soldering temperature and chip surface temperature T150. | |||||||||||
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina