surface mount AIDE CAPACITOR 1206X7S226M160NT capacitor designed for network communication interfaces and DC DC converters
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The 1206(X7S) Surface Mount Ceramic Capacitor (MLCC) is designed for high-voltage electronic circuits, serving crucial roles in coupling, filtering, and resonance applications. Its robust construction and reliable performance make it suitable for demanding environments within switching power supplies, AC-DC and DC-DC converters, network/communication interfaces, LCD module backlight power supplies, and energy-saving lamp ballasts.
Product Attributes
- Temperature Characteristic: X7S (22%)
- Termination Material: Copper/Silver-Nickel-Tin (inner to outer)
- Environmental Compliance: RoHS Directive, REACH Regulation
Technical Specifications
| Item | Specification | Test Method |
|---|---|---|
| Application Range | High-voltage electronic circuits for coupling, filtering, resonance. Applications include switching power supplies, AC-DC power converters, DC-DC power converters, network/communication interfaces, LCD module backlight power supplies, energy-saving lamp ballasts. | - |
| Standard State (Testing) | Normal Temperature: 15~35 Normal Humidity: 45~75%RH Normal Pressure: 86~106kPa | - |
| Standard Relative State (Testing) | Normal Temperature: 252 Normal Humidity: 60~70%RH Normal Pressure: 86~106kPa | - |
| Product Code Structure | Example: 1206 X7S 225 K 101 N T Product Size Code Temperature Characteristic Nominal Capacitance Capacitance Tolerance Rated Voltage (DC) Termination Material Packaging Method | - |
| Product Size Codes (Inch/mm) | 0201 (0.02*0.01 / 0.50*0.25) 0402 (0.04*0.02 / 1.00*0.50) 0603 (0.06*0.03 / 1.60*0.80) 0805 (0.08*0.05 / 2.00*1.25) 1206 (0.12*0.06 / 3.20*1.60) 1210 (0.12*0.10 / 3.20*2.50) 1808 (0.18*0.08 / 4.50*2.00) 1812 (0.18*0.12 / 4.50*3.20) 1825 (0.18*0.25 / 4.50*6.30) 2211 (0.22*0.11 / 5.70*2.8) 2225 (0.22*0.25 / 5.70*6.30) | - |
| Nominal Capacitance (Example) | 225 = 2.2F (Three-digit method) | - |
| Capacitance Tolerance Codes | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | - |
| Rated Voltage (DC) Codes (Example) | 100 = 10V, 101 = 100V, 102 = 1000V (Three-digit method) | - |
| Packaging Method Codes | T: Tape & Reel, P: Bulk (PE bag) | - |
| Product Structure | Ceramic Dielectric Inner Electrode Outer Electrode Nickel Layer Tin Layer | - |
| Product Dimensions (1206) | L: 3.200.30 mm (0.120.02 inch) W: 1.600.30 mm (0.060.02 inch) T: 1.000.20 mm (0.040.01 inch) WB: 0.800.20 mm (0.030.01 inch) | - |
| Operating Temperature Range | -55 ~ +125 | Visual inspection; Vernier caliper measurement |
| Appearance & Dimensions | 1. No visible damage 2. Dimensions meet specifications | Visual inspection; Vernier caliper measurement |
| Capacitance | Within specified tolerance | NPO Characteristic: 1000pF: 1MHz10%, 1.00.2Vrms >1000pF: 1KHz10%, 1.00.2Vrms X7R/X7T/X7S/X5R Characteristic: 10uF: 1KHz10%, 1.00.2Vrms >10uF: 120Hz24, 0.50.1Vrms |
| Dissipation Factor (DF Value) | NPO: DF0.56% (Cr5 pF) DF1.5[(150/Cr)+7]10-4 (5pFCr50pF) DF0.15% (50pFCr) X7R/X5R/X6S/X7S/Y5V: 10uF: 1KHz10%, 1V0.1rms >10uF: 120Hz24, 0.5V0.1rms | NPO: Cr1000pF: 110%MHz, 1V0.2rms Cr1000pF: 110%KHz, 1V0.2rms X7R/X5R/X6S/X7S/Y5V: Cr10uF: 1KHz10%, 1V0.1rms Cr10uF: 120Hz24, 0.5V0.1rms |
| Insulation Resistance (IR) | NPO: IR50000M (C10nF) IR*Cr500S (C10nF) X7R/X6S/X7S: IR10000M (C25nF) IR*Cr100S (C25nF) | Test Voltage: 500V (Rated voltage 500V), Rated voltage (Rated voltage 500V) Test Time: 605 sec Test Humidity: 75% Test Temperature: 255 Charge/Discharge Current: 50mA |
| Dielectric Strength (DC) | No dielectric breakdown or damage | Voltage multiplier: Ur=100V: 2.5x rated voltage Ur=200V/250V: 2.0x rated voltage Ur=450/500/630V: 1.5x rated voltage 1KVUr2KV: 1.2x rated voltage 2KVUr: 1.1x rated voltage Ramp-up time: 1-10S Hold time: 2S |
| Solderability | Tinning rate >90%, No visible damage | Preheat: 80-100 for 10-30 sec Solder Temperature: 2455 Soldering Time: 20.5 sec Use lead-free solder and flux |
| Solder Heat Resistance | No visible damage, Tinning rate 90% | Preheat: 100-200 for 102 sec Immersion Temperature: 260 5 Immersion Time: 51 sec Clean with solvent after immersion. Store at room temperature for 242 hours. |
| Capacitance Change Rate (after Solder Heat Resistance) | NPO: C/C0.5% or 0.5pF (whichever is greater) X7R: C/C15% X7T: -33% C/C22% X7S: C/C22% | - |
| DF Value (after Solder Heat Resistance) | See Item No.4 | - |
| IR (after Solder Heat Resistance) | See Item No.5 | - |
| Bending Strength | No visible damage Capacitance Change Rate: C/C10% | Test Substrate: Al2O3 or PCB (1.6mm thickness, 100mm length, 40mm width) Bending Depth: 1mm Pressing Speed: 0.5mm/sec. Measurements taken under bent condition. |
| Terminal Bond Strength | No visible damage | - |
| Temperature Cycling | NPO: C/C2.5% or 0.25pF (whichever is greater) X7R/X5R: C/C7.5% X6S: C/C10% | Pre-treatment (X7R): 1 hour at upper temp, 241 hours at RT/RH, initial measurement. 5 temperature cycles. Storage: 242 hours at RT/RH after cycling. Steps: Lower Temp (303 min) -> RT/RH (2-3 min) -> Upper Temp (303 min) -> RT/RH (2-3 min) |
| Damp Heat Resistance | Appearance: No visible damage Capacitance Change Rate: NPO: C/C2% or 1pF (whichever is greater) X7R/X6S/X5R: C/C10% DF Value: 2x initial standard IR: NPO: IR2500M or IR*Cr25S (whichever is smaller) X7R/X6S/X5R: IR1000M or IR*Cr25S (whichever is smaller) | Temperature: 402 Humidity: 90~95%RH Time: 500+24 hours Storage: 24 hours at RT/RH after test. |
| High Temperature Load Test | Appearance: No visible damage Capacitance Change Rate: NPO: C/C2% or 1pF (whichever is greater) X7R/X5R: C/C20% DF Value: 2x initial standard IR: NPO: IR4000M or IR*Cr40S (whichever is smaller) X7R/X5R: IR2000M or IR*Cr50S (whichever is smaller) | Temperature: 853 Time: 100048 hours Voltage: 2x rated voltage (100VV250V), 1.5x rated voltage (250VV1KV), 1.2x rated voltage (1KVV) Charge/Discharge Current: 50mA Storage: 484 hours at RT/RH after test. |
| Circuit Board Bending Performance | No cracks or other defects | Soldering on fixture (glass epoxy) using mixed solder, then applying force. Reflow soldering to avoid uneven soldering and thermal shock. Dimensions (A, B, C) vary by size (0805 to 2220). |
| Packaging - Plastic Reel Dimensions | Dimensions (A, B, C, D, E, F, G, H, J, T) vary by size (0805 to 1812). | - |
| Packaging - Paper Tape Dimensions | Dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) vary by size (1005/0201/0402). Dimensions (A, B, C, D, E, F, G, H, J, T) vary by size (0603, 0805, 1206). | - |
| Packaging Quantity | Paper Tape: 0603: 4000 pcs 0805: 4000 pcs 1005, 0201, 0402: Varies by size Tape Reel: 0805: 3000 pcs (T1.35mm) 1206: 3000 pcs (T1.60mm) 1210: 2000 pcs (T1.85mm) 1808: 1000 pcs 1812: 800 pcs 1812 above: 500 pcs | - |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina