Multi Layer Ceramic Capacitor AIDE CAPACITOR 0603X7R391K500NT designed for coupling wave filtering and resonant functions
Product Overview
These Multi-Layer Ceramic Capacitors (MLCC) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. Available in various sizes and temperature characteristics like C0G, X7R, and X5R, these MLCCs offer reliable performance across a range of operating conditions.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification |
|---|---|---|
| Dimension Code | 0201 (0.50x0.25 mm) | L*W (inch): 0.02*0.01 |
| 0402 (1.00x0.50 mm) | L*W (inch): 0.04*0.02 | |
| 0603 (1.60x0.80 mm) | L*W (inch): 0.06*0.03 | |
| 0805 (2.00x1.25 mm) | L*W (inch): 0.08*0.05 | |
| 1206 (3.20x1.60 mm) | L*W (inch): 0.12*0.06 | |
| 1210 (3.20x2.50 mm) | L*W (inch): 0.12*0.10 | |
| 1808 (4.50x2.00 mm) | L*W (inch): 0.18*0.08 | |
| 1812 (4.50x3.20 mm) | L*W (inch): 0.18*0.12 | |
| 1825 (4.50x6.30 mm) | L*W (inch): 0.18*0.25 | |
| 2225 (5.70x6.30 mm) | L*W (inch): 0.22*0.25 | |
| Temperature Characteristic | C0G | (030 PPM/) |
| X7R | (15%) | |
| X5R | (15%) | |
| Nominal Electrostatic Capacity | Examples: 8R0=8.0pF, 100=10pF, 101=100pF | |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| Rated Voltage (DC) | Examples: 250=25V, 251=250V, 252=2500V | |
| Testing Condition (Normal) | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |
| Testing Condition (Relative) | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Operating Temperature Range | -55~+125 | |
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | |
| Dimensions (mm) | Part Number | L Tol | W Tol | T Tol | WB Tol |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 1.000.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 1.250.20 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Static Capacity Change Rate (NPO) | C/C 0.5% or 0.5pF (larger reading) | |
| Static Capacity Change Rate (X7R) | C/C 15% | |
| Static Capacity Change Rate (X7T) | -33% C/C 22% | |
| Static Capacity Change Rate (X7P) | C/C 10% | |
| Dissipation Factor (DF) | Refer to specification table on page 3 and 4. | |
| Insulation Resistance (IR) | Refer to specification table on page 3 and 6. | |
| Hi-pot (DC) | 2.5 x rated voltage (Ur=100V), 2.0 x rated voltage (Ur=200V/250V), 1.5 x rated voltage (Ur=450/500/630V), 1.2 x rated voltage (1KVUr2KV), 1.1 x rated voltage (2KVUr) | |
| Solderability | Soldering area 90%, Visual-No damage. Pre-heating: 80-120 (10-30s), Soldering: 2455 (20.5s) | |
| Resistance to the heat of soldering | Visual-No damage, soldering area 90%. Pre-heating: 100-200 (102s), Soldering: 2655 (51s). | |
| Flexural Strength | No damage. Electro static capacity change rate C/C 10%. | |
| Terminal Bonding Strength | No visual damage. Applied Force: 5N (101S). | |
| Thermal Shock | NPO: C/C 2.5% or 0.25pF. X7R/X7P: C/C 0.5%. X7T: C/C 10%. | |
| Temperature Moisture Exposure | Capacity change rate: NPO: C/C 2% or 1pF. X7R/X7T/X7P: C/C 10%. DF 2 times initial standard. IR: NPO 2500M or IR*Cr 25S. X7R/X7T/X7P: IR 1000M or IR*Cr 25S. | |
| High Temperature Exposure | Capacity change rate: NPO: C/C 2% or 1pF. X7R/X7T/X7P: C/C 20%. DF 2 X initial standard. IR: NPO 4000M or IR*Cr 40S. X7R/X7T/X7P: IR 2000M or IR*Cr 50S. | |
| PCB Flexural Strength | No crack and other defect. | |
| Packing | T: Tape/Reel, P: Bag packing (PE) | |
Note on Soldering: Follow recommended soldering profiles and methods for different sizes and characteristics to avoid thermal cracks and ensure optimal performance.
Precautions for Use: MLCCs may fail in short or open circuit modes under severe conditions beyond rated specifications. Adhere to safety precautions and application notes.
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