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Conductive Polymer Aluminum Electrolytic Capacitor AISHI SPZ1AM221E05O00R for Small Chargers and TVs

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Product Description

AISHi PZ Series Conductive Polymer Aluminum Electrolytic Capacitors

The AISHi PZ series offers conductive polymer aluminum electrolytic capacitors designed for demanding applications. These capacitors feature low ESR and are RoHS compliant and lead-free. They are suitable for use in system boards, display cards, small chargers, and intelligent TVs.

Product Attributes

  • Brand: AISHi
  • Series: PZ
  • Type: Conductive Polymer Aluminum Electrolytic Capacitor
  • Compliance: RoHS Compliant, Lead-free

Technical Specifications

Item Specification
Category Code E (Electrolytic Capacitor)
Type Code PZ (Conductive Polymer)
Temperature Range -55 to +105C
Rated Voltage Range 6.3 to 100Vdc
Nominal Capacitance Range 4.7 to 5600F
Capacitance Tolerance 20% (M)
DC Leakage Current 0.2CV or 500A, whichever is greater (at 20C, 120Hz)
Dissipation Factor (tan) See table for values (at 20C, 120Hz)
ESR See table for values (100~300kHz, 20C)
Temperature Characteristics (Impedance Ratio at 100kHz) Z(+105C)/Z(+20C) 1.25; Z(-55C)/Z(+20C) 1.25
Endurance 2,000 hours at +105C
Humidity Test Subject to 90%-95% RH for 2,000 hours at 60C without voltage applied
Surge Test Subject to 1,000 cycles of charge/discharge
Recommended Applications System Board, Display Card, Small Charger, Intelligent TV

Standard Ratings Table (Partial)

VDC (V) Cap (F) Size DxL(mm) ESR (m, 20C, 100kHz)(max.) Rated ripple current (mArms/105C, 100kHz) Leakage Current (A)(max.)
6.3 (7.2) 220 6.3x7.2 110 300 72
6.3 (7.2) 270 6.3x9.5 90 360 82
6.3 (7.2) 330 6.3x11.5 75 420 94
6.3 (7.2) 390 8x9.5 75 420 94
6.3 (7.2) 470 8x11.5 60 500 104
6.3 (7.2) 560 8x13 55 540 110
6.3 (7.2) 680 10x12.5 45 600 120
6.3 (7.2) 820 10x15 40 650 130
10 (11.5) 220 6.3x7.2 110 300 46
10 (11.5) 470 8x11.5 60 500 70
10 (11.5) 820 10x12.5 45 600 90
16 (18.4) 100 6.3x7.2 110 300 29
16 (18.4) 220 8x9.5 75 420 46
16 (18.4) 470 10x12.5 45 600 70
20 (23) 100 6.3x7.2 110 300 25
20 (23) 220 8x9.5 75 420 40
20 (23) 330 8x11.5 60 500 50
20 (23) 470 10x12.5 45 600 60
25 (29) 100 6.3x7.2 110 300 22
25 (29) 220 8x9.5 75 420 35
25 (29) 330 8x11.5 60 500 44
25 (29) 470 10x12.5 45 600 54
35 (41) 47 6.3x7.2 110 300 15
35 (41) 100 8x9.5 75 420 25
35 (41) 150 8x11.5 60 500 31
35 (41) 220 10x12.5 45 600 37
35 (41) 330 10x15 40 650 45
35 (41) 470 12.5x13 35 700 54
35 (41) 680 12.5x16 30 750 65
50 (58) 47 6.3x7.2 110 300 12
50 (58) 100 8x9.5 75 420 20
50 (58) 150 8x11.5 60 500 25
50 (58) 220 10x12.5 45 600 30
50 (58) 330 10x15 40 650 35
50 (58) 470 12.5x13 35 700 42
50 (58) 680 12.5x16 30 750 50
63 (73) 33 6.3x7.2 110 300 10
63 (73) 68 8x9.5 75 420 17
63 (73) 100 8x11.5 60 500 21
63 (73) 150 10x12.5 45 600 25
63 (73) 220 10x15 40 650 30
63 (73) 330 12.5x13 35 700 35
63 (73) 470 12.5x16 30 750 42
80 (92) 33 6.3x7.2 110 300 8
80 (92) 68 8x9.5 75 420 14
80 (92) 100 8x11.5 60 500 17
80 (92) 150 10x12.5 45 600 20
80 (92) 220 10x15 40 650 24
80 (92) 330 12.5x13 35 700 28
100 (115) 22 6.3x7.2 110 300 7
100 (115) 47 8x9.5 75 420 12
100 (115) 68 8x11.5 60 500 14
100 (115) 100 10x12.5 45 600 17
100 (115) 150 10x15 40 650 20
100 (115) 220 12.5x13 35 700 24

Part Numbering System

The part numbering system follows the structure: Category Code - Series Code - Size Code - Capacitance Code - Capacitance Tolerance Code - Voltage Code - Terminal Code - Sleeve Marking Code.

Example: CD11GE G E (This is a partial example and requires full code definitions for a complete part number).

Soldering Recommendations

Flow Soldering (Radial Lead Type)

  • Preheating: 13020C, 30-90 sec.
  • Cooling: (1-3C)/sec. (Note 1)
  • Soldering Temperature: Approx. 260C max.
  • Soldering Time:
  • Note 1: Cooling rate.

Reflow Soldering (Polymer SMD Type)

  • Recommended Reflow Profile: See diagram in source document.
  • Preheating: 150C to 180C, Within 90 sec.
  • Peak Temperature (T1): 230C (max. 5 sec.)
  • Time above 200C (t): 40 sec. (max.) for C6.3 case size.
  • Time above T.C (t1): 90 sec. (max.) for C6.3 case size.
  • T.C: 230C for C6.3 case size.

Reflow Soldering (Liquid SMD Type)

  • Case size: 6.3 - 10mm
    • Preheat: 100C to 200C, Maximum 180 seconds.
    • Peak temperature (T.C): 230C (max. 5 sec.)
    • Time above 200C (t): 90 sec. (max.) for C6.3 case size.
    • Time above T.C (t1): 40 sec. (max.) for C6.3 case size.
  • Case size: 12.5 - 18mm
    • Preheat: 100C to 180C, Maximum 150 seconds.
    • Peak temperature (T.C): 230C (max. 5 sec.)
    • Time above 200C (t): 60 sec. (max.) for C12.5 case size.
    • Time above T.C (t1): 30 sec. (max.) for C12.5 case size.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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