High Impedance Chip Ferrite Bead BOURNS MZ2029-401Y for Power Supply and Signal Line Noise Control
MG, MU, MZ Series High Impedance Chip Ferrite Beads
Product Overview
The MG, MU, and MZ Series High Impedance Chip Ferrite Beads are designed for effective noise suppression in power supply lines, IC power lines, and signal lines. These components offer high resistance to heat and humidity, as well as mechanical shock and pressure, ensuring reliable performance in demanding environments. Their accurate dimensions facilitate automatic surface mounting, and they are available across a wide impedance range. These ferrite beads are RoHS compliant.
Product Attributes
- Brand: Bourns
- Series: MG, MU, MZ
- Compliance: RoHS compliant
Technical Specifications
General Specifications
| Specification | Value |
|---|---|
| Core Material | Ferrite |
| Internal Conductor | Ag or Ag/Pd |
| Terminal | Ag/Ni/Sn |
| Operating Temperature | -55 C to +125 C |
| Storage Temperature | -55 C to +125 C |
Electrical Specifications
| Model Number | Impedance () at 100 MHz (25%) | RDC () Max. | IDC (mA) Max. |
|---|---|---|---|
| MG2029-100Y | 10 | 0.20 | 400 |
| MG3261-301Y | 300 | 0.15 | 700 |
| MU3261-101Y | 100 | 0.15 | 500 |
| MU3261-300Y | 30 | 0.20 | 500 |
| MU3261-600Y | 60 | 0.20 | 400 |
| MU3261-750Y | 75 | 0.20 | 400 |
| MU3261-121Y | 120 | 0.15 | 900 |
| MU3261-221Y | 220 | 0.35 | 700 |
| MU3261-301Y | 300 | 0.15 | 700 |
| MU3261-471Y | 470 | 0.35 | 400 |
| MU3261-601Y | 600 | 0.30 | 400 |
| MU3261-801Y | 800 | 0.60 | 300 |
| MU3261-102Y | 1000 | 0.60 | 300 |
| MG2029-300Y | 30 | 0.10 | 400 |
| MG2029-400Y | 40 | 0.20 | 300 |
| MU2029-600Y | 60 | 0.10 | 900 |
| MG2029-800Y | 80 | 0.20 | 300 |
| MG2029-101Y | 100 | 0.20 | 400 |
| MG3261-151Y | 150 | 0.15 | 700 |
| MG2029-121Y | 120 | 0.25 | 300 |
| MU2029-151Y | 150 | 0.20 | 800 |
| MU2029-221Y | 220 | 0.30 | 500 |
| MU2029-301Y | 300 | 0.30 | 500 |
| MU2029-471Y | 470 | 0.35 | 700 |
| MZ2029-601Y | 600 | 0.40 | 100 |
| MZ2029-601T | 600 | 0.40 | 200 |
| MG1608-300Y | 30 | 0.20 | 200 |
| MG1608-400Y | 40 | 0.30 | 300 |
| MU1608-600Y | 60 | 0.20 | 700 |
| MG1608-800Y | 80 | 0.30 | 300 |
| MG1608-101Y | 100 | 0.25 | 200 |
| MG1608-121Y | 120 | 0.30 | 200 |
| MU1608-151Y | 150 | 0.25 | 600 |
| MU1608-221Y | 220 | 0.30 | 200 |
| MU1608-301Y | 300 | 0.35 | 150 |
| MU1608-471Y | 470 | 0.45 | 350 |
| MZ1608-601Y | 600 | 0.45 | 100 |
| MZ1608-102Y | 1000 | 0.60 | 100 |
| MU1005-100Y | 10 | 0.10 | 500 |
| MU1005-300Y | 30 | 0.20 | 300 |
| MU1005-600Y | 60 | 0.25 | 300 |
| MU1005-121Y | 120 | 0.30 | 100 |
| MU1005-151Y | 150 | 0.30 | 100 |
| MU1005-221Y | 220 | 0.40 | 100 |
| MU1005-241Y | 240 | 0.60 | 100 |
| MU1005-301Y | 300 | 0.50 | 100 |
| MU1005-471Y | 470 | 0.65 | 100 |
| MU1005-601Y | 600 | 0.80 | 80 |
| MU1005-102Y | 1000 | 1.20 | 80 |
Applications
- Power supply lines
- IC power lines
- Signal lines
Product Dimensions
| Series | A (mm/in) | B (mm/in) | C (mm/in) | D (mm/in) | G (mm/in) | H (mm/in) | I (mm/in) |
|---|---|---|---|---|---|---|---|
| 3261 | 3.2 0.2 (.126 .008) | 1.6 0.2 (.063 .008) | 1.1 0.2 (.043 .008) | 0.5 0.2 (.020 .008) | 2.2 (.087) | 1.8 (.071) | 1.05 (.041) |
| 2029 | 2.0 0.2 (.079 .008) | 1.2 0.2 (.047 .008) | 0.9 0.2 (.035 .008) | 0.5 0.2 (.020 .008) | 1.0 (.040) | 1.0 (.040) | 1.0 (.040) |
| 1608 | 1.6 0.15 (.063 .006) | 0.8 0.2 (.031 .008) | 0.8 0.2 (.031 .008) | 0.3 0.2 (.012 .008) | 0.7 (.028) | 0.7 (.028) | 0.7 (.028) |
| 1005 | 1.0 0.10 (.039 .004) | 0.5 0.1 (.020 .004) | 0.5 0.1 (.020 .004) | 0.25 0.1 (.010 .004) | 0.5 (.020) | 0.55 (.022) | 0.7 (.028) |
Reel Dimensions
| Series | Pcs. per Reel | D (mm/in) | P (mm/in) | G (mm/in) | T (mm/in) |
|---|---|---|---|---|---|
| 3261 | 3,000 | 8.0 (.315) | 4.0 (.157) | 10.0 + 0 (.394 + 0) | 12.5 (.492) |
| 2029 | 4,000 | 4.0 (.157) | |||
| 1608 | 4,000 | 4.0 (.157) | |||
| 1005 | 10,000 | 2.0 (.079) |
Soldering Profile
| Profile Feature | Value |
|---|---|
| Pb Free Assembly Preheat - Temperature Min. (Tsmin) | 150 C |
| Preheat - Temperature Max. (Tsmax) | 200 C |
| Preheat - Time (ts) from Tsmin to Tsmax | 60-120 seconds |
| Ramp-up Rate (TL to Tp) | 3 C/second max. |
| Liquidous temperature (TL) | 217 C |
| Time (tL) maintained above TL | 60-150 seconds |
| Peak package body temperature (Tp) | 260 C |
| Time within 5 C of Actual Peak Temperature (tp) | < 30 seconds |
| Ramp-Down Rate (Tp to TL) | 6 C/second max. |
| Time 25 C to Peak Temperature | 8 minutes max. |
| Reflow Times | 3 TIMES MAX. |
Additional Information
Contact Information
- Asia-Pacific: Tel: +886-2 2562-4117 Email: asiacus@bourns.com
- Europe: Tel: +36 88 885 877 Email: eurocus@bourns.com
- The Americas: Tel: +1-951 781-5500 Email: americus@bourns.com
Website
Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
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