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Surface mount multilayer ceramic capacitors FH 0603B104K500NT with nickel barrier termination and stable capacitance

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Product Description

Product Overview

High-Voltage Multi-layer Ceramic Capacitors (MLCC) are designed for surface mounting and are suitable for various DC high-voltage circuits. Built upon advanced MLCC technology, these capacitors offer enhanced high-voltage reliability through special design and manufacturing processes. They feature a monolithic structure of laminated layers for high reliability, excellent soldering and resistance properties suitable for reflow and peak soldering, and provide high and stable capacitance. These capacitors comply with GB/T 21041-2007 and GB/T 21042-2007 standards.

Product Attributes

  • Manufacturer: FENGHUA
  • Product Name: High-Voltage Multi-layer Ceramic Capacitors
  • Series: High Voltage Series Of Ceramic Chip Capacitors
  • Dielectric Materials: C0G (Class I), X7R (Class II)
  • Termination Styles: Nickel Barrier Termination (N), MLCC with Flexible Solderable Termination (A)
  • Executive Standards: GB/T 21041-2007, GB/T 21042-2007

Technical Specifications

Feature Description
Application Scenarios Analog & Digital Modems, LAN/WAN Interface, Lighting Ballast Circuits, Voltage Multipliers, DC-DC Converters, Back-lighting Inverters
Product Structure 1. Ceramic dielectric, 2. Inner electrode, 3. Substrate electrode, 4. Nickel Layer, 5. Tin Layer
Available Sizes (EIA) 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2220, 2225
Capacitance Range & Voltage Refer to detailed tables in the specification document. Capacitance values range from pF to F, with rated voltages including 6.3V, 100V, 200V, 250V, 500V, 630V, 1KV, 1.5KV, 2KV, 2.5KV, 3KV, 4KV, 5KV.
Temperature Coefficient / Characteristics
  • C0G: 030ppm/, Operating Temperature: -55125
  • X7R: 15%, Operating Temperature: -55125
Measurement Method of Dielectric Withstanding Voltage Varies based on rated voltage (Vr), typically 120% to 250% of rated voltage for 5 seconds, with maximum current limits of 10mA or 50mA.
Reliability Tests Includes Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Solderability, Resistance to Soldering Heat, Resistance to Flexure, Temperature Cycle, Termination Adhesion, Humidity Load, and Life Test. Specific parameters and conditions are detailed in the document.
Packaging Options Paper Taping (7-inch and 13-inch reels), Embossed Taping (7-inch and 13-inch reels). Specific dimensions for taping and reel sizes are provided.
Storage Conditions Temperature: 5~40, Relative Humidity: 20~70%. Guaranteed solderability period: 12 months.
Soldering Recommendations Reflow soldering, Wave soldering, and Manual soldering. Recommended temperature profiles and conditions are provided.

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Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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