High voltage multilayer ceramic capacitors FH 1206B104K101NT suitable for dc circuits and surface mounting
Product Overview
High-Voltage Multi-layer Ceramic Capacitors (MLCCs) are designed for surface mounting and offer excellent high-voltage reliability. Based on advanced MLCC technology, these capacitors are suitable for various DC high-voltage circuits, effectively enhancing electronic circuit performance. They feature a monolithic structure for high reliability, superior soldering and resistance to soldering heat, making them compatible with reflow and wave soldering processes. These MLCCs provide high and stable capacitance values, adhering to GB/T 21041-2007 and GB/T 21042-2007 standards.
Key Applications: Analog & Digital Modems, LAN/WAN Interface, Lighting Ballast Circuits, Voltage Multipliers, DC-DC Converters, Back-lighting Inverters.
Product Attributes
- Manufacturer: FENGHUA (Implied from context)
- Dielectric Materials: C0G (Class I), X7R (Class II)
- Standards: GB/T 21041-2007, GB/T 21042-2007
Technical Specifications
| Feature | Description |
|---|---|
| Product Name | High-Voltage Multi-layer Ceramic Capacitors |
| Series | High Voltage Series Of Ceramic Chip Capacitors |
| Type/Size Codes | 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2220, 2225 |
| Dimensions (mm) | Refer to Product Dimensions table (e.g., 0402: 1.000.05 L x 0.500.05 W) |
| Capacitance Range | Refer to Capacitance Range and Voltage tables (e.g., 0.5pF to 10F) |
| Rated Voltage (V) | 6R3 (6.3V) up to 5KV (e.g., 100V, 200V, 250V, 500V, 630V, 1KV, 2KV, 3KV, 4KV, 5KV) |
| Capacitance Tolerance Codes | A (0.05pF), B (0.10pF), C (0.25pF), D (0.50pF), F (1%), G (2%), J (5%), K (10%), M (20%) |
| Temperature Coefficient/Characteristics | C0G: 030ppm/ (-55125) X7R: 15% (-55125) |
| Termination Material | Nickel Barrier Termination (N), MLCC with Flexible Solderable Termination (A) |
| Package Styles | Braided 7 inch disc packing (T), Braided 13 inch disc packing (D) |
| Product Structure Components | Ceramic dielectric, Inner electrode, Substrate electrode, Nickel Layer, Tin Layer |
| Dielectric Withstanding Voltage Test Method | Varies based on rated voltage range (e.g., 200% of rated voltage for 5 seconds for Vr |
| Reliability Tests | Solderability, Resistance to Soldering Heat, Resistance to Flexure, Temperature Cycle, Termination Adhesion, Humidity Load, Life Test |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20~70% |
| Shelf Life (for Solderability) | 12 months (under delivered package condition) |
| Soldering Methods Recommended | Reflow Soldering (R), Wave Soldering (W), Manual Soldering |
| Packaging | Paper Taping, Embossed Taping (7-inch and 13-inch reels) |
| Packing Quantity | Varies by size code and thickness (e.g., 0402: 10000 pcs/7" reel) |
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