High Voltage MLCC FH 0603B225K160NT Designed for Surface Mounting in Analog Digital Modem Applications
Product Overview
High-Voltage Multi-layer Ceramic Capacitors (MLCCs) are designed for surface mounting and offer excellent high-voltage reliability. Built upon advanced MLCC technology, these capacitors are suitable for various DC high-voltage circuits, effectively enhancing electronic circuit performance. They feature a monolithic structure of laminated layers for high reliability, superior soldering and resistance capabilities for reflow and peak soldering, and high, stable capacitance. These products adhere to GB/T 21041-2007 and GB/T 21042-2007 standards.
Applications: Analog & Digital Modems, LAN/WAN Interface, Lighting Ballast Circuits, Voltage Multipliers, DC-DC Converters, Back-lighting Inverters.
Product Attributes
- Manufacturer: FENGHUA (Implied from context)
- Product Type: High-Voltage Multi-layer Ceramic Capacitors (MLCC)
- Dielectric Materials: C0G (Class I), X7R (Class II)
- Executive Standards: GB/T 21041-2007, GB/T 21042-2007
Technical Specifications
| Feature | Description |
|---|---|
| Product Name | High-Voltage Multi-layer Ceramic Capacitors |
| Series | High Voltage MLCC |
| Available Sizes (EIA) | 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2220, 2225 |
| Temperature Coefficient / Characteristics | C0G: 030ppm/ (-55125) X7R: 15% (-55125) |
| Termination Material Styles | Nickel Barrier Termination (N), MLCC with Flexible Solderable Termination (A) |
| Package Styles | Braided 7 inch disc packing (T), Braided 13 inch disc packing (D) |
| Product Structure Components | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel Layer, 5. Tin Layer |
| Dielectric Withstanding Voltage Test Method | Varies by rated voltage (e.g., 250% of rated voltage for 5 seconds for Vr=100V, with max current of 50mA; 120% of rated voltage for 5 seconds with max current of 10mA for 2000V |
| Reliability Tests | Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Solderability, Resistance to Soldering Heat, Resistance to Flexure of Substrate, Temperature Cycle, Termination Adhesion, Humidity Load, Life Test |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20~70% |
| Guaranteed Solderability Period | 12 months (in delivered package condition) |
| Soldering Methods Recommended | Reflow Soldering (R), Wave Soldering (W) |
Note: The specific thickness 'T' for each product can be found in the 'Capacity Range and Voltage' section. Custom designs are available upon request.
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