Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
Verified Supplier
17 Years
Since 2009
Menu

Ceramic capacitor FH 0805X226M160NT designed for high voltage dc circuits and back lighting inverter applications

Price Negotiable
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Product Description

Product Overview

High-Voltage Multi-layer Ceramic Capacitors (MLCCs) are designed for surface mounting, offering excellent high-voltage reliability. Built upon advanced MLCC technology, these capacitors are ideal for various DC high-voltage circuits, enhancing overall electronic circuit performance. They feature a monolithic structure for high reliability, superior soldering capabilities suitable for reflow and wave soldering, and provide high, stable capacitance. These products comply with GB/T 21041-2007 and GB/T 21042-2007 standards.

Key Applications: Analog & Digital Modems, LAN/WAN Interface, Lighting Ballast Circuits, Voltage Multipliers, DC-DC Converters, Back-lighting Inverters.

Product Attributes

  • Manufacturer: FENGHUA (implied from context)
  • Compliance Standards: GB/T 21041-2007, GB/T 21042-2007
  • Dielectric Materials: C0G (Class I), X7R (Class II)
  • Termination Styles: Nickel Barrier Termination (N), MLCC with Flexible Solderable Termination (A)
  • Package Styles: Braided 7 inch disc packing (T), Braided 13 inch disc packing (D)

Technical Specifications

Category Specification Details
Product Structure Ceramic dielectric
Inner electrode
Substrate electrode
Nickel Layer
Tin Layer
Size Code EIA Length x Width (mm)
0402 1.000.50
0603 1.600.80
0805 2.001.25
1206 3.201.60
1210 3.202.50
Ordering Code Breakdown Size Code EIA (e.g., 0402, 0603, etc.)
Nominal Capacitance Express Method (e.g., 0R5 for 0.5pF, 102 for 1000pF)
Dielectric Code B (X7R), CG (C0G)
Capacitance Tolerance Code (A, B, C, D, F, G, J, K, M)
Rated Voltage Express Method (e.g., 6R3 for 6.3V, 500 for 500V)
Termination Material N (Nickel Barrier), A (Flexible)
Package Style T (7" Tape), D (13" Tape)
Temperature Coefficient/Characteristics Dielectric Reference Temp. Point Nominal Temp. Coefficient Operation Temp. Range
C0G 25C 030ppm/ -55125
X7R 25C 15% -55125
Capacitance Range and Voltage Class I (C0G) Capacitors
Dimension 0402 (1.0mm*0.5mm) 0603 (1.6mm*0.8mm) 0805 (2.0mm*1.2mm) 1206 (3.2mm*1.6mm)
Capacitance/Voltage 100V, 200V, 250V 100V, 200V, 250V, 500V, 1KV 100V, 200V, 250V, 500V, 1KV, 2KV, 3KV 100V, 200V, 250V, 500V, 630V, 1KV, 2KV, 3KV
(Example: 3.3pF) CA (100V) CA (100V) DA (200V), EA (250V) FA (100V), FB (200V)
(Example: 10nF) CA (100V) CA (100V) EA (250V) FA (100V)
Dimension 1210 (3.2mm*2.5mm) 1808 (4.6mm*2.0mm) 1812 (4.6mm*3.2mm) 1825 (4.6mm*6.3mm)
Capacitance/Voltage 100V, 200V/250V, 500V, 1KV, 2KV, 5KV 500V, 1KV, 2KV, 3KV, 5KV 100V, 200V, 500V, 630V, 1KV, 2KV, 3KV, 5KV 1KV, 3KV
(Example: 10pF) GA (100V) HA (500V) IB (100V) JA (1KV)
(Example: 1uF) GA (1KV) HA (5KV) IA (1KV) JB (3KV)
Dimension 2211 (5.7mm*2.8mm) 2220 (5.7mm*5.0mm) 2225 (5.7mm*6.3mm)
Capacitance/Voltage 250V, 3KV, 5KV 250V, 500V, 1KV, 2KV, 3KV, 5KV 1KV, 1.5KV, 2KV, 2.5KV, 3KV, 4KV, 5KV
(Example: 10nF) KA (250V) LA (100V) MA (1KV)
(Example: 1uF) LA (1KV) LA (5KV) MA (5KV)
Class II (X7R) Capacitors
Dimension 0402 (1.0mm*0.5mm) 0603 (1.6mm*0.8mm) 0805 (2.0mm*1.2mm) 1206 (3.2mm*1.6mm)
Capacitance/Voltage 100V 100V, 200V, 250V 100V, 200V, 250V, 500V, 630V, 1000V, 2000V, 2500V 100V, 200V, 250V, 500V, 630V, 1KV, 2KV, 2.5KV
(Example: 100pF) EA (100V) DA (100V) EA (100V) FA (100V)
(Example: 1uF) EB (220V) EB (330V) EB (470V) FC (680V)
Dimension 1210 (3.2mm*2.5mm) 1808 (4.6mm*2.0mm) 1812 (4.6mm*3.2mm) 1825 (4.6mm*6.3mm)
Capacitance/Voltage 100V, 200V, 250V, 500V, 1KV, 2KV, 3KV, 4KV, 5KV 250V, 500V, 1KV, 2KV, 3KV, 4KV, 5KV 100V, 200V, 250V, 500V, 630V, 1KV, 2KV, 3KV, 4KV, 5KV 200V, 250V, 500V, 630V, 1KV, 2KV, 3KV, 4KV, 5KV
(Example: 100pF) HA (100V) HA (250V) IB (100V) JA (100V)
(Example: 1uF) LB (2.2KV) HB (4KV) ID (5KV) JB (1KV)
Dimension 2211 (5.7mm*2.8mm) 2220 (5.7mm*5.0mm) 2225 (5.7mm*6.3mm)
Capacitance/Voltage 250V, 3KV, 5KV 100V, 200V, 250V, 500V, 630V, 1KV, 2KV, 2.5KV, 3KV, 4KV, 5KV 100V, 200V, 250V, 500V, 630V, 1KV, 1.5KV, 2KV, 3KV, 4KV, 5KV
(Example: 100pF) KA (250V) LA (100V) MA (100V)
(Example: 1uF) LA (5KV) LA (5KV) MA (1KV)
Dielectric Withstanding Voltage Test Method
  • Vr=100V: Force 250% Rated voltage for 5 sec. (Max current 50mA)
  • 100VVr500V: Force 200% Rated voltage for 5 sec. (Max current 50mA)
  • 500VVr1000V: Force 150% Rated voltage for 5 sec. (Max current 50mA)
  • 1000VVr2000V: Force 120% Rated voltage for 5 sec. (Max current 50mA)
  • 2000VVr5000V: Force 120% Rated voltage for 5 sec. (Max current 10mA)
Reliability Test
  • Capacitance: Class I within specified tolerance; Class II within specified tolerance.
  • DF (tan): Class I 1/(400+20C) (C
  • Insulation Resistance (IR): Class I C10 nF, Ri50000M; C>10 nF, RiCR500S. Class II C25nF, Ri10000M; C>25nF, RiCR100S.
  • Solderability: 95% coverage.
  • Resistance to Soldering Heat: C/C: Class I 2.5% or 0.25pF; Class II 15%. DF same as initial. IR same as initial.
  • Resistance to Flexure: C/C: Class I 5% or 0.5pF; Class II 10%.
  • Temperature Cycle: C/C: C0G 1% or 1pF; X7R -15% ~ +15%.
  • Termination Adhesion: Force: 0402 2N, 0603 5N.
  • Humidity Load: C/C: Class I 7.5% or 0.75pF; Class II -12.5% ~ +12.5%. DF 2x initial. IR: Class I Ri5000M or RiCR50S; Class II Ri1000M or RiCR10S.
  • Life Test: C/C: Class I 3% or 0.3pF; Class II -20% ~ +20%. DF 2x initial. IR: Class I Ri4000M or RiCR40S; Class II Ri2000M or RiCR50S.
Package Paper Taping Structure
Embossed Taping Structure
Reel Dimensions: 7" REEL (1782.0), 13" REEL (3302.0)
Storage Methods Storage Temperature: 5~40, Relative Humidity: 20~70%. Guaranteed solderability period: 12 months.
Precautions Before Use Handle with care to avoid short/open circuits, fire, explosion. Follow soldering profiles and manual soldering guidelines.
Recommended Soldering Method Reflow Soldering (R), Wave Soldering (W), Manual Soldering.
Recommended Soldering Temperature Profile Refer to graphs for Reflow Soldering and Wave Soldering. Temperature difference during preheating should be T150.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

Request A Quote

Please check your email address.
Your message must be at least 20 characters.