Surface mount high voltage MLCC capacitors FH 0603X105K100NT ideal for analog digital modems and dc dc converters
Product Overview
The High-Voltage Multi-layer Ceramic Capacitors (MLCC) are designed for surface mounting and are suitable for various DC high-voltage circuits, offering improved electronic circuit performance. Built on the foundation of general MLCC technology, these capacitors feature a special design for enhanced high-voltage reliability. They possess a monolithic structure of laminated layers, ensuring high reliability, excellent soldering and resistance properties, and stable, high capacitance. These MLCCs comply with GB/T 21041-2007 and GB/T 21042-2007 standards.
Key Applications: Analog & Digital Modems, LAN/WAN Interface, Lighting Ballast Circuits, Voltage Multipliers, DC-DC Converters, Back-lighting Inverters.
Product Attributes
- Manufacturer: FENGHUA
- Dielectric Materials: C0G (Class I), X7R (Class II)
- Termination Styles: Nickel Barrier Termination (N), MLCC with Flexible Solderable Termination (A)
- Package Styles: Braided 7 inch disc packing (T), Braided 13 inch disc packing (D)
Technical Specifications
| Feature | Details |
|---|---|
| Product Name | High-Voltage Multi-layer Ceramic Capacitors |
| Available Sizes (EIA) | 0402 to 2225 |
| Size Codes & Dimensions |
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| Temperature Coefficient/Characteristics |
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| Capacitance Range & Voltage | Refer to detailed tables in the specification document for specific combinations of capacitance, voltage, and dimensions for C0G and X7R dielectrics. |
| Rated Voltage (Examples) | 6R3 (6.3V), 500V, 1000V, 2000V, 3000V, 5000V |
| Capacitance Tolerance | 0.05pF (A), 0.10pF (B), 0.25pF (C), 0.50pF (D), 1% (F), 2% (G), 5% (J), 10% (K), 20% (M) |
| Dielectric Withstanding Voltage Test Method | Varies based on rated voltage (e.g., 200% for Vr |
| Reliability Tests | Includes Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Solderability, Resistance to Soldering Heat, Resistance to Flexure, Temperature Cycle, Termination Adhesion, Humidity Load, and Life Test. Specific parameters and conditions are detailed in the document. |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20~70%. Guaranteed solderability period: 12 months. |
| Soldering Methods Recommended | Reflow Soldering (R), Wave Soldering (W). Manual soldering requires careful operation. |
| Packaging | Paper Taping (PT) and Embossed Taping (ET) available in 7-inch and 13-inch reels. Specific quantities per reel vary by size and thickness. |
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