High voltage multi layer ceramic capacitors FH 1206B475K500NT compatible with reflow and wave soldering processes
Product Overview
High-Voltage Multi-layer Ceramic Capacitors (MLCCs) are designed for surface mounting and offer excellent high-voltage reliability. Built on advanced MLCC technology, these capacitors are suitable for various DC high-voltage circuits, effectively enhancing electronic circuit performance. They feature a monolithic structure of laminated layers for high reliability, superior soldering and resistance capabilities compatible with reflow and wave soldering, and provide high and stable capacitance. These capacitors comply with GB/T 21041-2007 and GB/T 21042-2007 standards.
Key Applications: Analog & Digital Modems, LAN/WAN Interface, Lighting Ballast Circuits, Voltage Multipliers, DC-DC Converters, Back-lighting Inverters.
Product Attributes
- Manufacturer: FENGHUA ()
- Product Type: High-Voltage Multi-layer Ceramic Capacitors (HIGH VOLTAGE MLCC)
- Dielectric Materials: C0G (Class I), X7R (Class II)
- Termination Styles: Nickel Barrier Termination (N), MLCC with Flexible Solderable Termination (A)
- Package Styles: Braided 7 inch disc packing (T), Braided 13 inch disc packing (D)
Technical Specifications
| Specification | Details |
|---|---|
| Product Name | High-Voltage Multi-layer Ceramic Capacitors |
| Series | High Voltage Series Of Ceramic Chip Capacitors |
| Available Sizes (EIA) | 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2220, 2225 |
| Temperature Coefficient/Characteristics | C0G: 030ppm/ (-55125) X7R: 15% (-55125) |
| Capacitance Range & Voltage | Refer to detailed tables in the specification document for specific capacitance values, voltage ratings, and corresponding dimensions/thicknesses for both Class I (C0G) and Class II (X7R) dielectrics. |
| Dielectric Withstanding Voltage Test Method | Varies based on rated voltage (Vr), typically 120% to 250% of Vr for 5 seconds, with maximum current limits (e.g., 50mA, 10mA). |
| Reliability Tests | Includes Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Solderability, Resistance to Soldering Heat, Resistance to Flexure, Temperature Cycle, Termination Adhesion, Humidity Load, and Life Test. Specific parameters and conditions are detailed in the document. |
| Packaging Options | Paper Taping (7" and 13" reels), Embossed Taping (7" and 13" reels). Specific dimensions for taping and reel sizes are provided. |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20~70%. Guaranteed solderability period: 12 months. |
| Soldering Methods Recommended | Reflow Soldering (R), Wave Soldering (W), Manual Soldering. Specific temperature profiles and conditions are provided for each method. |
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.