FH 0402CG120J500NT multilayer ceramic capacitor designed for performance in high voltage dc circuits

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Product Description

Product Overview

High-Voltage Multi-layer Ceramic Capacitors (MLCCs) are designed for surface mounting and are suitable for various DC high-voltage circuits, offering improved circuit performance. Built on advanced MLCC technology, these capacitors feature a monolithic structure for high reliability and excellent soldering performance, compatible with reflow and wave soldering processes. They provide high and stable capacitance values.

Product Attributes

Manufacturer: FENGHUA
Executive Standards: GB/T 21041-2007, GB/T 21042-2007

Application Scenarios

Analog & Digital Modems
LAN/WAN Interface
Lighting Ballast Circuits
Voltage Multipliers
DC-DC Converters
Back-lighting Inverters

Technical Specifications

Feature	Description
Product Type	High-Voltage Multi-layer Ceramic Capacitors (MLCC)
Available Sizes (EIA)	0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2220, 2225
Dielectric Materials	C0G (Class I), X7R (Class II)
Temperature Coefficient / Characteristics	C0G: 030ppm/ (-55125) X7R: 15% (-55125)
Capacitance Range & Voltage	Refer to detailed tables in the specification document for specific combinations of capacitance, voltage, and dimensions.
Ordering Code Structure	Size Code - Nominal Capacitance - Dielectric Code - Capacitance Tolerance - Rated Voltage - Termination Material - Package Style
Termination Material Styles	Nickel Barrier Termination (N), MLCC with Flexible Solderable Termination (A)
Package Styles	Braided 7 inch disc packing (T), Braided 13 inch disc packing (D)
Product Structure Components	1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode (Substrate electrode), 4. Nickel Layer, 5. Tin Layer
Measurement Method of Dielectric Withstanding Voltage	Varies based on rated voltage range (e.g., 200% Rated voltage for 5 seconds for Vr
Reliability Tests	Includes Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Solderability, Resistance to Soldering Heat, Resistance to Flexure, Temperature Cycle, Termination Adhesion, Humidity Load, and Life Test. Specific parameters and conditions are detailed in the document.
Storage Conditions	Temperature: 5~40, Relative Humidity: 20~70%
Guaranteed Solderability Period	12 months (in delivered package condition)