General Series Multi layer Ceramic Capacitors Featuring FH 1812B104K631NT for High Stability Circuits
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Product Description
General Series Multi-layer Ceramic Capacitors (MLCC)
Product Overview
This series of General Type MLCCs features a monolithic structure of laminated layers, offering high reliability and excellent soldering and solder resistance capabilities suitable for reflow and wave soldering. They provide high and stable capacitance. Class I capacitors (C0G, C0H) offer the most stable electrical performance, ideal for low-loss, high-stability high-frequency circuits. Class II capacitors (X7R, X5R, X7S, X7T, X6S, X6T) utilize materials with higher dielectric constants for increased capacitance and stable temperature characteristics, suitable for DC-blocking, coupling, bypassing, and frequency discriminating circuits.
Product Attributes
- Brand: Fenghua (implied by revision history notes)
- Type: General Series Multi-layer Ceramic Capacitors (MLCC)
- Dielectric Types: C0G, C0H, X7R, X7S, X7T, X6S, X6T, X5R
- Termination Styles: Nickel Barrier Termination, Flexible Solderable Termination
- Executive Standards: GB/T 21041-2007, GB/T 21042-2007
Technical Specifications
| Category | Specification | Details | ||
|---|---|---|---|---|
| Product Structure | Ceramic dielectric | N/A | ||
| Inner electrode | N/A | |||
| Substrate electrode | N/A | |||
| Nickel Layer | N/A | |||
| Tin Layer | N/A | |||
| Product Dimensions (EIA) | Size Code | L x W (mm) | ||
| 01005 | 0.40 x 0.20 | |||
| 0201 | 0.60 x 0.30 | |||
| 0402 | 1.00 x 0.50 | |||
| 0603 | 1.60 x 0.80 | |||
| 0805 | 2.00 x 1.25 | |||
| 1206 | 3.20 x 1.60 | |||
| 1210 | 3.20 x 2.50 | |||
| 1808 | 4.50 x 2.00 | |||
| 1812 | 4.50 x 3.20 | |||
| Temperature Coefficient/Characteristics | Dielectric | Reference Temp. | Temp. Coefficient | Operating Temp. Range |
| C0G | 25 | 0 30ppm/ | -55125 | |
| X7R | 25 | 15% | -55125 | |
| X7S | 25 | 22% | -55125 | |
| X7T | 25 | -33%~+22% | -55125 | |
| X5R | 25 | 15% | -5585 | |
| Capacitance Range & Voltage | Class I (C0G) - Conventional Voltage (Ur 50V) | See detailed tables on pages 4-5. | ||
| Class II (X7R, X7S, X7T, X6S/X6T, X5R) - Conventional Voltage (Ur 50V) | See detailed tables on pages 6-13. | |||
| Reliability Test Methods | Aging (Class II) | Heat treatment at 150 for 1 hour, measure after 24h. | ||
| Solderability | >95% tin coverage, no visible damage. Lead-free: 2455, 20.5s. | |||
| Resistance to Soldering Heat | C/C 2.5% or 0.25pF (whichever is larger) for Class I; 15% for Class II. DF and IR within initial standards. Appearance: No visible damage, >95% tin coverage. | |||
| Packaging | Embossed Plastic Taping | Dimensions for 1005, 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 2220, 2225. | ||
| Paper Taping | Dimensions for 1005, 0201, 0402, 0603, 0805, 1206. | |||
| Reel Dimensions | 7' REEL (1782.0), 13' REEL (3302.0). | |||
| Packing Quantity | Varies by size code, thickness, and reel type (e.g., 7' PT, 7' ET, 13' PT, 13' ET). See page 22 for details. | |||
| Storage Precautions | Relative humidity: 20-70%, Temperature: 5-40 (recommended | |||
| Precautions Before Use | Do not reuse removed capacitors. Confirm electrical characteristics, applied voltage, mechanical stress, and solderability of long-stored capacitors. Perform heat treatment before measurement if stored long-term. | |||
| Application Restrictions | Intended for general consumer electronics. Not recommended for high-reliability applications (aerospace, medical, , etc.) without prior written consent. | |||
| Soldering Methods | Recommended for Reflow Soldering (R) and Wave Soldering (W). Manual soldering requires careful operation. See page 25 for specific recommendations by size and temperature characteristics. | |||
| Recommended Reflow Pad Size | Dimensions (L, W, A, B, C) provided for various capacitor sizes (1005 to 1812) on page 26. | |||
| Soldering Temperature Profile | Refer to graphs on page 27 for Reflow and Wave soldering. Maintain temperature difference T 150 during preheating. Manual soldering: Max 350 tip temp, max 20W, max 3s, avoid direct contact with ceramic. | |||
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina