• High-voltage reliability
• Surface mount technology (SMT) compatible
• Suitable for various DC high-voltage circuits
• Monolithic laminated structure
• Excellent soldering and resistance properties
• High and stable capacitance

• Analog & Digital Modems
• LAN/WAN Interface
• Lighting Ballast Circuits
• Voltage Multipliers
• DC-DC Converters
• Back-lighting Inverters

• Size Code: 0402 to 2225
• Nominal Capacitance: e.g., 0R5 (0.5pF), 1R0 (1.0pF), 102 (1000pF)
• Dielectric Code: C0G (Class I), X7R (Class II)
• Capacitance Tolerance: 0.05pF (A), 0.10pF (B), 0.25pF (C), 0.50pF (D), 1% (F), 2% (G), 5% (J), 10% (K), 20% (M)
• Rated Voltage: e.g., 6R3 (6.3V), 500 (500V), 201 (2000V)
• Termination Material: Nickel Barrier Termination (N), MLCC with Flexible Solderable Termination (A)
• Package Style: Braided 7 inch disc packing (T), Braided 13 inch disc packing (D)

1. Ceramic dielectric
2. Inner electrode
3. Outer electrode
4. Nickel Layer
5. Tin Layer

Note: Specific thickness 'T' can be found in the 'Capacitance Range and Voltage' section. Custom designs are available.

Detailed tables are provided for Class I (C0G) and Class II (X7R) capacitors, listing specific voltage ratings, capacitance values, and corresponding dimensions (thickness 'T' codes). These tables cover sizes from 0402 to 2225.

Includes tests for Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Solderability, Resistance to Soldering Heat, Resistance to Flexure, Temperature Cycle, Termination Adhesion, Humidity Load, and Life Test. Specific parameters and conditions are detailed for Class I and Class II capacitors.

• Paper Taping (7" and 13" reels)
• Embossed Taping (Plastic reel)
• Detailed dimensions for taping and reel specifications are provided.
• Packing quantities vary by size and tape type.
• Outer packing includes labels with Part No., Quantity, and Date.

• Guaranteed solderability period: 12 months (in delivered package).
• Storage Conditions: Temperature 5~40, Relative Humidity 20~70%.

• MLCCs may fail in short or open circuits. Severe conditions can lead to fire, burning, or explosion. Follow specifications and contact technical support for clarification.
• Soldering Conditions: Adhere to recommended temperature profile charts to prevent cracking or explosion due to sudden temperature changes.
• Manual Soldering: Handle with care to avoid thermal shock and damage. Control soldering iron tip selection and temperature.
• Recommended solder fillet amounts for reflow, wave, and rework soldering are detailed.
• Recommended soldering methods: Reflow Soldering (R), Wave Soldering (W).
• Recommended Soldering Temperature Profile charts for Reflow and Wave soldering are provided.