Johanson Dielectrics 201R18N5R1CV4T multilayer capacitors offering high Q microwave performance with NP0 temperature stability
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Product Description
Product Description
These multilayer capacitors are engineered for High-Q and microwave applications. The S-Series offers ultra-high Q performance with NP0 temperature characteristics. The L-Series provides mid-high Q performance, also with NP0 temperature characteristics. The E-Series delivers excellent high-Q performance from HF to microwave frequencies, suitable for high voltage and high current applications. The W-Series offers large capacitance values in an ultra-small 0201 package with X7R temperature characteristics. RoHS compliance is standard for all unleaded parts.
Product Attributes
- Brand: Johanson Technology
- Certifications: RoHS compliance (standard for unleaded parts)
Technical Specifications
| Series | Part Numbers | Key Features | Temperature Characteristic | Package Sizes | Termination Options |
| S-Series | R03S, R07S, R14S, R15S | Ultra-high Q performance | NP0 | R03 (01005), R07 (0402), R14 (0603), R15 (0805) | Ni barrier (Ni/Sn, Ni/Au), Non-Magnetic Pt.-Ag, Non-Magnetic Leaded |
| L-Series | R05L | Mid-high Q performance | NP0 | R05 (0201) | Ni barrier (Ni/Sn, Ni/Au), Non-Magnetic Pt.-Ag, Non-Magnetic Leaded |
| E-Series | S42E, S48E, S58E | Excellent high-Q performance (HF to Microwave), High voltage, High current | NP0 | S42 (1111), S48 (2525), S58 (3838) | Chip (Ni barrier or Non-Magnetic Pt.-Ag), Non-Magnetic Leaded |
| W-Series | R05W | Large capacitance in ultra-small 0201 package | X7R | R05 (0201) | Ni barrier (Ni/Sn, Ni/Au), Non-Magnetic Pt.-Ag, Non-Magnetic Leaded |
| How to Order - Part Number Breakdown | Description | Options |
| VOLTAGE (DC) | Voltage Rating | 6R3 (6.3V) to 502 (5000V) |
| CASE SIZE | Package Size | R03 (01005) to S58 (3838) |
| TOLERANCE | Capacitance Tolerance | A (0.05pF) to K (10%) |
| MARKING | Product Marking | 3 (Cap Code & Tolerance), 4 (No Marking), 6 (EIA Code) |
| TERMINATION | Termination Type | V (Ni/Sn), T (Ni/SnPb), G (Ni/Au), U (Cu/Sn), C (Cu/SnPb), Leaded (1-5) |
| CAPACITANCE (pF) | Capacitance Value | e.g., 470 (47pF), 101 (100pF), R = decimal |
| PACKAGING | Packaging Method | S (Bulk), W (Waffle Pack), Y (Paper 5 Reel), T (Paper 7 Reel), Z (Embossed 5 Reel), E (Embossed 7 Reel) |
| DIELECTRIC | Dielectric Material | S (Ultra High Q NPO), L (High Q NPO), E (Ultra High Q NPO, High Voltage, High Power), T (High Temp 175C Ultra High Q NPO), W (X7R) |
| Mechanical & Environmental Characteristics | Specification | Test Parameters |
| SOLDERABILITY | Solder coverage 90% of metalized areas | Preheat chip to 120-150C for 60 sec., dip terminals in rosin flux then dip in Sn62 solder @ 2405C for 51 sec. No termination degradation. |
| RESISTANCE TO SOLDERING HEAT | No mechanical damage | Preheat device to 80-100C for 60 sec., followed by 150-180C for 60 sec. Capacitance change: 2.5% or 0.25pF. Q>500, I.R. >10 G Ohms, Breakdown voltage: 2.5 x WVDC. Dip in 2605C solder for 101 sec. Measure after 242 hour cooling period. |
| TERMINAL ADHESION | Termination should not pull off. Ceramic should remain undamaged. | Linear pull force* exerted on axial leads soldered to each terminal. *0402 2.0lbs, 0603 2.0lbs (min.) |
| PCB DEFLECTION | No mechanical damage. | Glass epoxy PCB: 0.5 mm deflection. Capacitance change: 2% or 0.5pF Max. |
| LIFE TEST | No mechanical damage | MIL-STD-202, Method 108l. Applied voltage: 120% of WDVC for capacitors rated at 500 volts DC or less. 100% of WDVC for capacitors rated at 1250 volts DC or less. Temperature: 1253C. Test time: 1000+48-0 hours. Capacitance change: 3.0% or 0.3 pF. Q>500, I.R. >1 G Ohms, Breakdown voltage: 2.5 x WVDC. |
| THERMAL CYCLE | No mechanical damage | (Details not fully provided in source text) |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
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Contact Person
Sellina