multilayer capacitors Johanson Dielectrics 102R18W102KV4E designed for high current microwave circuits

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Product Description

Johanson Technology Multi-Layer High-Q Capacitors

These multilayer capacitors are engineered for high-Q and microwave applications, offering superior performance in demanding electronic circuits. They are available in various series, each tailored for specific performance characteristics and applications, including high voltage and high current scenarios. Options include chip or non-magnetic leaded forms, with RoHS compliance standard for unleaded parts.

Product Attributes

Brand: Johanson Technology
Certifications: RoHS compliance (standard for unleaded parts)

Technical Specifications

Series	Part Numbers	Description	Temperature Characteristic	Key Features
S-Series	R03S, R07S, R14S, R15S	Ultra-high Q performance	NP0	High-Q, Microwave applications
L-Series	R05L	Mid-high Q performance	NP0	High-Q applications
E-Series	S42E, S48E, S58E	Excellent high-Q performance	NP0	HF to Microwave frequencies, High voltage, High current applications
W-Series	R05W	Large capacitance value in ultra-small 0201 package	X7R	Miniature size, Portable electronics

How to Order

Part Number Example: 252S48E470KV4E

Component	Options	Description
Voltage (DC)	6R3, 101, 160, 250, 500, 201, 251, 301, 501, 102, 152, 202, 252, 362, 502, 722	6.3 V to 7200 V
Case Size	R03 (01005), R05 (0201), R07 (0402), R14 (0603), R15 (0805), S42 (1111), S48 (2525), S58 (3838)	Various EIA sizes
Capacitance (pF)	0R1 to 1000 (e.g., 470 = 47 pF, 101 = 100 pF, R = decimal)	Capacitance values
Tolerance	A (0.05 pF), B (0.10 pF), C (0.25 pF), D (0.50 pF), F (1%), G (2%), J (5%), K (10%)	Tolerance options
Marking	3 (Cap Code & Tolerance), 4 (No Marking), 6 (EIA Code)	Marking options
Termination	Nickel Barrier (V, G), Non-Magnetic (U, C), Leaded (1, 2, 3, 4, 5)	Ni/Sn, Ni/Au, Cu/Sn, Cu/SnPb, Microstrip, Axial/Radial Leads
Dielectric	S (Ultra High Q NPO), L (High Q NPO), E (Ultra High Q NPO, High Voltage), W (X7R)	Dielectric types
Packaging	S (Bulk), W (Waffle Pack), Y/T/R/J/N/L/V (Paper Reel), E/U/M/Q/G/P (Embossed Reel)	Packaging options

Mechanical & Environmental Characteristics

Characteristic	Specification	Test Parameters
Solderability	Solder coverage 90% of metalized areas	Preheat 120-150C for 60s, dip in Sn62 solder @ 2405C for 51s
Resistance to Soldering Heat	No mechanical damage, Capacitance change: 2.5% or 0.25pF, Q>500, I.R. >10 G Ohms, Breakdown voltage: 2.5 x WVDC	Preheat 80-100C for 60s, followed by 150-180C for 60s, Dip in 2605C solder for 101s
Terminal Adhesion	Termination should not pull off, Ceramic should remain undamaged	Linear pull force* exerted on axial leads soldered to each terminal (*0402 2.0lbs, 0603 2.0lbs)
PCB Deflection	No mechanical damage, Capacitance change: 2% or 0.5pF Max	Glass epoxy PCB: 0.5 mm deflection
Life Test	No mechanical damage, Capacitance change: 3.0% or 0.3 pF, Q>500, I.R. >1 G Ohms, Breakdown voltage: 2.5 x WVDC	MIL-STD-202, Method 108l, Applied voltage: 120% of WDVC (500VDC) or 100% of WDVC (>500VDC), Temperature: 1253C, Test time: 1000+48-0 hours
Thermal Cycle	No mechanical damage	(Details not fully specified in provided text)