Sandwich Structure Multilayer Chip Ceramic Capacitor CCTC TCC0805X7R104K500DTS Designed for Home Appliances and LED Lighting
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Product Description
MLCC Product Approval Sheet - S Series
This document details the specifications for the "S" Series Multilayer Chip Ceramic Capacitors (MLCC). These capacitors feature a "sandwich-structure" design, offering enhanced durability and reliability compared to traditional MLCCs. They are designed for applications requiring superior flexural strength, making them suitable for energy-saving lamps, LED lighting, general power supplies, industrial control, and home appliances.
Product Attributes
- Brand: CCTC ()
- Origin: Chaozhou, Guangdong, China
- Product Name: Multilayer Chip Ceramic Capacitor
- Part Number Series: "S" Series
- Document Number: DRAAW108E/0-2015
Technical Specifications
| Specification | Description | Test Conditions |
| Appearance | No defects or abnormalities | Visual inspection |
| Dimensions | Within specified dimensions | Using calipers on micrometer |
| Capacitance | Within specified tolerance (J: 5%; K: 10%; M: 20%) | 1.00.2Vrms, 1KHz10% (Temp: 253, Humidity: <70%RH) |
| Dissipation Factor | DF2.5% | 1.00.2Vrms, 1KHz10% (Temp: 253, Humidity: <70%RH) |
| Insulation Resistance | UR 50V: > 10 G or 500F (whichever is smaller) UR >50V: > 4 G or 100s (whichever is smaller) | UR 50V: Utest=UR, Charge Time: 605sec, Temp: 25 UR >50V: Utest=UR or 400V, Charge Time: 605sec, Temp: 25 (Temp: 253, Humidity: <70%RH) |
| Dielectric Strength | UR50V: 300%Rated voltage for 5sec. 100VUR<500V: 200%Rated voltage for 5sec. 500VUR<1000V: (150%+100V) Rated voltage for 5sec. 1000VUR<2000V: 150%Rated voltage for 5sec. UR2000V: 120%Rated voltage for 5sec. | Max. current 50mA (30mA for UR2000V) |
| Temperature Coefficient of Capacitance (X7R) | Capacitance change within 15% | Measure capacitance at -55, 25, and 125. Compare with capacitance at 25. |
| Adhesion | No removal of terminations or other defects | 6N pressure applied for 101 sec |
| Solderability of Termination | 95% min. coverage, <5% pin holes or rough spots | Solder temp: 2455, Dipping time: 21 sec. Both electrodes completely soaked. |
| Resistance to Leaching | 95% min. coverage, <5% pin holes or rough spots, no visual damage | Preheat: 120~150/60sec, Solder temp: 2705, Dipping time: 101 sec. Both electrodes completely soaked. |
| Bending Strength (End Electrode) | No visible damage; Capacitance change 10% | Capacitor soldered on test substrate, bent 1mm at 1.0mm/s. |
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