Compact Wire Wound Chip Common Mode Choke Coil CENKER ACMC3225S-222-2P-T for Automotive Applications
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The ACMC-S Series Wire Wound Chip Common Mode Choke Coil is designed for effective noise suppression in high-frequency applications. Featuring a compact, low-profile winding type, these coils offer excellent common mode impedance and superior solderability. They are built for high reliability, with tests complying with AEC-Q200 standards. Ideal for automotive USB 2.0/HDMI 2.0 signal transmission and general signal lines, this series ensures robust performance in demanding environments. The operating temperature range is -55 to +150.
Product Attributes
- Product Type: Wire Wound Chip Common Mode Choke Coil
- Series: ACMC-S
- Operating Temperature: -55 to +150
- Reliability Compliance: AEC-Q200
- Core Material: Ferrite
- Wire Material: Polyurethane enameled copper wire
- Coating Material: Epoxy resin
Technical Specifications
| Part Number | Dimensions (A*C) (mm) | Common Mode Impedance () | Test Frequency (MHz) | DCR () Max | Max. Rated Current (mA) | Rated Voltage (Vdc) | Insulation Resistance (M) Min. | Withstanding Voltage (Vdc) |
|---|---|---|---|---|---|---|---|---|
| ACMC2012S | 2.0 x 1.2 | 67 25% | 100 | 0.25 | 400 | 50 | 10 | 125 |
| ACMC2012S-900-2P-T | 2.0 x 1.2 | 90 25% | 100 | 0.30 | 400 | 50 | 10 | 125 |
| ACMC2012S-121-2P-T | 2.0 x 1.2 | 120 25% | 100 | 0.30 | 400 | 50 | 10 | 125 |
| ACMC2012S-181-2P-T | 2.0 x 1.2 | 180 25% | 100 | 0.35 | 350 | 50 | 10 | 125 |
| ACMC2012S-201-2P-T | 2.0 x 1.2 | 200 25% | 100 | 0.35 | 300 | 50 | 10 | 125 |
| ACMC2012S-361-2P-T | 2.0 x 1.2 | 360 25% | 100 | 0.40 | 300 | 50 | 10 | 125 |
| ACMC3216S | 3.2 x 1.6 | 90 25% | 100 | 0.3 | 400 | 50 | 10 | 125 |
| ACMC3216S-121-2P-T | 3.2 x 1.6 | 120 25% | 100 | 0.3 | 350 | 50 | 10 | 125 |
| ACMC3216S-161-2P-T | 3.2 x 1.6 | 160 25% | 100 | 0.4 | 350 | 50 | 10 | 125 |
| ACMC3216S-221-2P-T | 3.2 x 1.6 | 220 25% | 100 | 0.4 | 300 | 50 | 10 | 125 |
| ACMC3216S-261-2P-T | 3.2 x 1.6 | 260 25% | 100 | 0.5 | 300 | 50 | 10 | 125 |
| ACMC3216S-361-2P-T | 3.2 x 1.6 | 360 25% | 100 | 0.6 | 300 | 50 | 10 | 125 |
| ACMC3216S-601-2P-T | 3.2 x 1.6 | 600 25% | 100 | 0.8 | 300 | 50 | 10 | 125 |
| ACMC3216S-102-2P-T | 3.2 x 1.6 | 1000 25% | 100 | 1.0 | 230 | 50 | 10 | 125 |
| ACMC3216S-222-2P-T | 3.2 x 1.6 | 2200 25% | 100 | 1.2 | 200 | 50 | 10 | 125 |
| ACMC3225S | 3.2 x 2.5 | 90 25% | 100 | 0.05 | 1000 | 50 | 10 | 125 |
| ACMC3225S-601-2P-T | 3.2 x 2.5 | 600 25% | 100 | 0.2 | 1000 | 50 | 10 | 125 |
| ACMC3225S-102-2P-T | 3.2 x 2.5 | 1000 25% | 100 | 0.3 | 750 | 50 | 10 | 125 |
| ACMC3225S-222-2P-T | 3.2 x 2.5 | 2200 25% | 100 | 0.3 | 640 | 50 | 10 | 125 |
| ACMC3225S-242-2P-T | 3.2 x 2.5 | 2400 25% | 100 | 0.4 | 1000 | 50 | 10 | 125 |
| ACMC3225H-501-2P-T | 3.2 x 2.5 | 500 25% | 100 | 0.1 | 2000 | 50 | 10 | 125 |
| ACMC3225H-102-2P-T | 3.2 x 2.5 | 1000 25% | 100 | 0.1 | 1500 | 50 | 10 | 125 |
| ACMC4532S-701-2P-T | 4.5 x 3.2 | 700 25% | 100 | 0.15 | 1000 | 50 | 10 | 125 |
Dimensions (Unit:mm)
| TYPE() | A | B | C | D1 | D2 | E | F | G | H | K |
|---|---|---|---|---|---|---|---|---|---|---|
| ACMC2012S | 2.00.2 | 1.20.2 | 1.20.2 | 0.5 Ref | 0.45 Ref | 0.17 Max | 1.2 Ref | 0.4 Ref | 0.8 Ref | 2.6 Ref |
| ACMC3216S | 3.20.2 | 2.00.2 | 1.60.2 | 0.7 Ref | 0.6 Ref | 0.22 Max | 1.6 Ref | 0.4 Ref | 1.6 Ref | 3.7 Ref |
| ACMC3225S/H | 3.20.2 | 2.5Max | 2.50.2 | 0.8 Ref | 0.8Ref | 0.25Max | 3.5Ref | 0.6Ref | 1.6 Ref | 4.1Ref |
| ACML4532S | 4.50.2 | 2.60.2 | 3.20.2 | 1.0 Ref | 1.0Ref | 0.5 Max | 3.4Ref | 1.6 Ref | 2.9 Ref | 5.5 Ref |
Test and Measurement Procedures
- Inductance: Test equipment: Keysight E4991B / Agilent 4787A or equivalent
- DC Resistance (DCR): Test equipment: Agilent34420A / Agilent 4338B or equivalent
- Rated Current (Irms): Irms is direct electric current as chip surface temperature rose just 20 or 40 against chip initial surface temperature (Ta).
- Temperature rise: Rated Current < 1A T 20 Max
- Temperature rise: Rated Current 1A T 40 Max - Insulation Resistance: Test equipment: Chroma TH2683A / ZX6583 or equivalent
Recommended Soldering Technologies (Re-flowing Profile)
- Preheat condition: 150~200 / 60~120sec.
- Allowed time above 217: 60~90sec.
- Max temp: 260
- Max time at max temp: 10sec
- Solder paste: Sn/3.0Ag/0.5Cu
- Allowed Reflow time: 2 times max
Packaging Specification
- Cover Tape: The force for tearing off cover tape is 10 to 100 grams in the arrow direction. Peel-off speed: 300mm/min.
- Tape & Reel Dimensions:
- ACMC2012S/ACMC3216S/ACMC4532S: Tape Width: 8mm, Reel Diameter: 178mm, Quantity: 2000 pcs/reel
- ACMC3225S/H: Tape Width: 12mm, Reel Diameter: 330mm, Quantity: 3000 pcs/reel
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina