SMD Power Inductor CENKER CKCSH3015F-1uH/M Ideal for LED Lighting and Power Modules Applications
Product Overview
The CKCSH3015F-1uH/M is a SMD Power Inductor from Shenzhen Cenker Technology Group Co., Ltd. Designed for general electronic equipment, this inductor offers reliable performance with a nominal inductance of 1uH and a tolerance of 20%. Its operating temperature range is -40 to +125. Applications include audio-visual entertainment, home appliances, computers, office automation, communication devices, power modules, LED lighting, measuring equipment, machine tools, and industrial control boards. It is also suitable for automotive, medical, , aerospace, and submarine equipment applications, with specific consultation required for these specialized uses.
Product Attributes
- Brand: Cenker
- Product Type: SMD Power Inductor
- Origin: Shenzhen, China (implied by company address)
- Materials: Ferrite Core, Copper Wire, Sn Solder, Epoxy Glue, Marking Ink
- MSL Rating: MSL, level 1
Technical Specifications
| Specification | Value | Test Condition | Test Equipment |
|---|---|---|---|
| Model Number | CKCSH3015F-1uH/M | - | - |
| Drawing Number | SP-CK112-GXA00051 | - | - |
| Nominal Inductance | 1uH 20% | 1MHz / 0.2V | ZX1378+ZX1378S |
| DCR (DC Resistance) | 54m 30% | at 25 | ZX5512B |
| Isat (Saturation Current) | 3.4A (Typ) / 3.06A (Max.) | Inductance drops approx 30% | ZX1378+ZX1378S |
| Irms (RMS Current) | 3.0A (Typ) / 2.7A (Max.) | T 40 | ZX1378+ZX1378S+TES1316 |
| Operating Temperature | -40 ~ +125 (Including self-temperature rise) | - | - |
| Storage Temperature | -40 ~ +125 | - | - |
| Dimensions (L x W x H) | 3.00.2 mm x 3.00.2 mm x 1.5 mm (Max.) | - | - |
| Terminal Width (D) | 0.950.3 mm | - | - |
| Packaging Quantity | 2000 Pcs/Reel, 10000 Pcs/Box, 50000 Pcs/Carton | - | - |
| Storage Time | Within 12 months | Temp: -10 ~ 40C, Humidity: 70%RH | - |
Reflow Soldering Profile
Pre-heating: 150~200, 60~180 Sec. Ramp-up: 3/sec max. Reflow: Peak 260, 20~40 Sec. Cooling: 6/sec max.
Iron Soldering
Power: Max. 30W. Pre-heating: 150, 1 Minute. Soldering Tip temperature: 350 Max. Soldering time: 3sec Max.
Matters Needing Attention
- Consider non-magnetic shielded component placement to avoid magnetic interference.
- Avoid placing near magnets or objects with magnetic force.
- Do not store in high temperature, high humidity, dusty, or corrosive environments.
- Allow for self-heating during operation in thermal design.
- Use anti-static wrist straps.
- Avoid direct contact with terminals due to potential solderability reduction from hand grease.
- Do not excessively bend terminals.
- Product is sensitive to direct impact, which can cause damage.
- Be cautious with potting or gluing materials, as shrinkage can affect electrical characteristics and mechanical properties. Ensure compatibility with enameled wire insulation, plastic skeleton, and glue. Potting materials can alter high-frequency characteristics.
- Surface rust may occur on alloy or non-coated products in humid environments but does not affect characteristics.
- Product is intended for general electronic equipment. For specialized applications (automotive, medical, , aerospace, submarine), contact the sales department.
- Exceeding storage time may lead to deteriorated solderability of terminal electrodes.
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