Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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Compact Wire Wound Chip Ferrite Inductor CENKER CKCW0603H-10uH K for Bluetooth and WLAN Applications

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Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Product Description

Product Overview

The CKCW Series Wire Wound Chip Ferrite Inductor is designed for high-frequency applications, offering high Q values and high self-resonant frequencies due to its ferrite material. Its small chip size makes it ideal for surface mounting. This series provides tight inductance tolerance and high reliability, making it suitable for mobile phones (TD-LTE/5G communication), high-frequency circuits in communication equipment, and wireless technologies like Bluetooth and W-LAN.

Product Attributes

  • Material: Ferrite core, Polyurethane enameled copper wire, Ag/Ag-Pd with Ni and Sn plating electrodes, Ultraviolet epoxy resin coating.
  • Type: Wire Wound Chip Ferrite Inductor
  • Series: CKCW

Technical Specifications

Part Number Inductance (nH/uH) Tolerance Q Factor (Typ) L/Q Test Freq. (MHz) Max. DC Resistance () Max. Rated Current (mA) Self-resonant Frequency (MHz) (Min)
CKCW0402-22nH/ 22nH J,K,M 10 7.9 0.060 1400 2500
CKCW0402-33nH/ 33nH J,K,M 10 7.9 0.060 1400 2300
CKCW0402-100nH/ 100nH J,K,M 9 7.9 0.160 900 1400
CKCW0402-160nH/ 160nH J,K,M 11 7.9 0.280 560 1200
CKCW0402-220nH/ 220nH J,K,M 11 7.9 0.530 380 1150
CKCW0402-330nH/ 330nH J,K,M 11 7.9 0.560 350 820
CKCW0402-470nH/ 470nH J,K,M 11 7.9 0.730 310 650
CKCW0402-560nH/ 560nH J,K,M 11 7.9 0.920 200 600
CKCW0603-47nH/ 47nH K,M 12 7.9 0.060 1200 2350
CKCW0603-100nH/ 100nH K,M 12 7.9 0.110 1000 1370
CKCW0603-150nH/ 150nH J,K,M 12 7.9 0.120 1000 1260
CKCW0603-220nH/ 220nH J,K,M 12 7.9 0.300 700 850
CKCW0603-390nH/ 390nH J,K,M 12 7.9 0.510 500 620
CKCW0603-470nH/ 470nH K,M 12 7.9 0.370 470 670
CKCW0603-560nH/ 560nH J,K,M 12 7.9 0.460 450 760
CKCW0603-1uH/ 1uH J,K,M 18 7.9 0.940 280 410
CKCW0603-1.5uH/ 1.5uH J,K,M 17 7.9 1.300 240 340
CKCW0603-2.2uH/ 2.2uH J,K,M 12 7.9 1.500 280 180
CKCW0603-3.3uH/ 3.3uH J,K,M 17 7.9 1.800 200 60
CKCW0603-4.7uH/ 4.7uH J,K,M 12 7.9 2.700 200 100
CKCW0603-6.8uH/ 6.8uH J,K,M 12 7.9 3.900 200 40
CKCW0603-8.2uH/ 8.2uH J,K,M 12 7.9 3.800 190 40
CKCW0603-10uH/ 10uH J,K,M 10 2.5 4.800 180 30
CKCW0603-15uH/ 15uH J,K,M 17 7.9 9.500 90 20
CKCW0603-22uH/ 22uH J,K,M 17 7.9 11.400 70 20
CKCW0603H-1.0uH/ 1.0uH J,K,M 12 7.9 0.320 800 390
CKCW0603H-2.2uH/ 2.2uH J,K,M 12 7.9 0.500 600 50
CKCW0603H-4.7uH/ 4.7uH J,K,M 12 7.9 0.980 420 51
CKCW0603H-10uH/ 10uH J,K,M 13 2.5 2.400 300 36
CKCW0805-220nH/ 220nH J,K,M 10 7.9 0.150 1100 480
CKCW0805-330nH/ 330nH J,K,M 10 10.0 0.150 1100 500
CKCW0805-470nH/ 470nH J,K,M 12 7.9 0.310 720 500
CKCW0805-1uH/ 1uH J,K,M 12 7.9 0.410 800 400
CKCW0805-1.2uH/ 1.2uH J,K,M 20 7.9 0.830 700 330
CKCW0805-1.5uH/ 1.5uH J,K,M 10 7.9 1.200 400 300
CKCW0805-2.2uH/ 2.2uH J,K,M 12 7.9 0.310 400 170
CKCW0805-3.3uH/ 3.3uH J,K,M 15 7.9 1.800 300 90
CKCW0805-4.7uH/ 4.7uH J,K,M 12 7.9 2.050 250 85
CKCW0805-6.8uH/ 6.8uH J,K,M 12 7.9 2.600 230 55
CKCW0805-10uH/ 10uH J,K,M 10 2.5 3.200 150 30
CKCW0805-15uH/ 15uH J,K,M 10 2.5 4.200 100 16
CKCW0805-22uH/ 22uH J,K,M 10 2.5 6.000 80 14
CKCW0805-47uH/ 47uH J,K,M 10 2.5 13.800 55 14
CKCW0805H-2.2uH/ 2.2uH J,K,M 12 7.9 0.310 1040 80
CKCW0805H-10uH/ 10uH J,K,M 14 2.5 1.170 290 25
CKCW0805H-47uH/ 47uH J,K,M 10 2.5 4.420 160 14
Dimensions (Unit: mm) A B C D E H (ref) I (ref) J (ref)
CKCW0402 1.10.1 0.60.1 0.550.1 0.50.1 0.20.1 0.65 0.35 0.50
CKCW0603 1.8 Max 1.12 Max 1.02 Max 0.76 Typ 0.33 Typ 1.02 0.64 0.64
CKCW0805 2.29 Max 1.73 Max 1.55 Max 1.27 Typ 0.5 Typ 1.78 1.02 0.76
Packaging Specification Tape Dimension (mm) Reel Dimension (mm) Quantity (Pcs/Reel)
W A0 B0 K0 D P A B C
CKCW0402 8 0.66 1.2 0.67 1.5 4 178 58 13 10Kpcs
CKCW0603 8 1.1 1.75 1.1 1.5 4 178 58 13 4Kpcs
CKCW0805 8 1.55 2.45 1.5 1.5 4 178 58 13 2Kpcs

Temperature Rating:

  • Operating temperature range (individual chip without packing): -25 to +125
  • Storage temperature range (packaging conditions): -10~+40 and RH 70% (Max.)

Reflow Soldering Profile:

  • Preheat condition: 150~200 /60~120sec.
  • Allowed time above 217: 60~90sec.
  • Max temp: 260
  • Max time at max temp: 10sec
  • Solder paste: Sn/3.0Ag/0.5Cu
  • Allowed Reflow time: 2 times max

Packaging - Cover Tape: The force for tearing off cover tape is 10 to 100 grams in the arrow direction. Peel-off speed: 300mm/min.

Note: Please specify the inductance tolerance code (J=5%, K=10%, M=20%) for the part number.


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Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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