SMD Crystal Oscillators CHANGXING ELECTRONICS 3ESC240C0033L 24MHz CMOS Output RoHS Compliant for wireless communication
Product Overview
The CHANGXING ELECTRONICS CO.,LTD. 3E Series 2.0x1.6mm SMD Crystal Oscillators with CMOS Output are ultra-small, seam-sealed clock crystal oscillator units designed for applications in WLAN, Bluetooth, DSC, DSL, and other IT products. These oscillators offer a tri-state function and are RoHS Compliant / Pb Free.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Series: 3E Series
- Product Type: SMD Crystal Oscillators
- Output Type: CMOS Output
- Certifications: RoHS Compliant / Pb Free
- Origin: Fujian, China
Technical Specifications
| Specification | Value | Unit | Notes |
|---|---|---|---|
| Nominal Frequency | 24.000000 | MHz | |
| Model | 3ESC240C0033L | ||
| Dimensions | 2.0 x 1.6 x 0.75 | mm | SMD |
| Input Voltage (VDD) | 1.83.3 | Vdc | |
| Input Current (IDD) | 5 | A max | Standby current |
| Output Load | 15 | pF max | |
| Rise/Fall Time | 10 | ns max | 90%VDD |
| Output Voltage VOL | 10%VDD | ||
| Output Voltage VOH | 90%VDD | ||
| Start-up Time | 1.8 | ms max | |
| Jitter (rms) | 5 | ps max | |
| Aging | 3 | ppm/year | |
| Tolerance @ 25 Degree | 10 | ppm | |
| Stability over Operation Temp. | 20 | ppm | |
| Operating Temperature Range | -4085 | ||
| Storage Temperature Range | -55125 | ||
| Fundamental Oscillation mode | MSL Level 1 | IPC/JEDEC J-STD-033C | |
| Output State Control | Enable/disable | ||
| Output Waveform | CMOS | ||
| Output Symmetry | 5010% | ||
| Product Weight | 8.144 | mg | For OSC 2016 |
Marking
LOGO / MHz / / /
Example: CX24.0 .****
Reflow Condition
Temperature profile for reflow soldering:
- Pre-heating zone 1: 150180, 9030s
- Soldering zone: 230 or more, 3010s
- Peak: 250+50
Soldering iron method:
- Bit temperature: 35010
- Application time of soldering iron: 31 s
For other procedures, refer to IEC 60068-2-20.
Packing
EIA-481-2 TAPE (CARRIER) DIMENSIONS
Reliability Specifications
Standard test condition (TEMP.: 2015. Relative humidity: 6520%). For any discrepancy in GO/NG, test will be done at TEMP. 252. R.H. 655%.
- High Temperature Storage: 72 hrs at 125C3C. Frequency change 5ppm.
- Low Temperature Storage: 72 hrs at -55C3C. Frequency change 5ppm.
- Humidity: 96 hrs at 40 C 3 C, with 90 3% R.H. Frequency change 5ppm.
- Temperature Cycle: 10 cycles from -25C to 85C. Frequency change 5ppm.
- Shock: Peak 1000m/s, normal width 6ms half sine wave form, 3.7m/s, 3 perpendicular axis of samples, 3 cycles /direction, total 18 cycles. Frequency change 5ppm.
- Drop: Free drop from 1.0 m height to wooden plate for 3 times. Frequency change 5ppm.
- Vibration: Apply 0.75mm vibration at sweep frequency 10500 Hz, for 2h. 10 cycles in each direction of 3 axis. Frequency change 5ppm.
- Resistance to Soldering Heat: In 255 5 solder bath for 2 0.5 seconds. Frequency change 5ppm. No visible damage. Terminals shall be covered more than 95% with solder.
- Solderability: Terminals shall be covered more than 95% with solder. No visible damage.
- Terminal Strength: 0.5 kg pulling force for at least 60 seconds. No visible damages.
Material Composition Declaration
Base: Ceramics (Al2O3, SiO2, Cr2o3, Mo, Fe, Ni, Co, Ag, Cu)
Lid: Kovar (Fe, Co, Ni)
Pin: Solder (Ag, Ethyl alcohol, Bisphenol A-epichlorohydrin polymer, Xylenes, Ethylbenzene, Silicone resin, Silica, Petroleumsolvents)
Plate: Epoxy Conductive Resin
Wafer: Quartz (SiO2)
Wire: Gold (Au)
IC: Silicon (Si)
Electrode: Silver (Ag)
Metallization: Tungsten (W), Gold (Au), Nickel (Ni)
Adhesive Resin
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