5.0x3.2 SEAM 4PIN Quartz Crystal Resonator CHANGXING ELECTRONICS 9DSC081G0020L for Wireless Communication Devices
Product Overview
The 5.0x3.2 SEAM 4PIN Quartz Crystal Resonator, model 9DSC081G0020L, is a high-precision and high-frequency stability component designed for demanding electronic applications. It offers excellent EMI reduction and is an ideal choice for Bluetooth devices, wireless communication sets, DSCs, PDAs, and mobile phone USB interface cards. This RoHS Compliant and Pb Free product ensures reliability and performance in various communication systems.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Type: Quartz Crystal Resonator
- Series: 9D Series
- Sealing Type: SEAM Sealing
- Compliance: RoHS Compliant / Pb Free
- Crystal Cutting Type: AT CUT (thickness shear mode)
Technical Specifications
| Parameter | Nominal Frequency | Load Capacitance | Frequency Tolerance (at 25 3) | Over Operating Temp. Range Tolerance | Aging (1st Year) | Operating Temperature | Storage Temperature Range | Drive Level | Shunt Capacitance (C0) | Motional Capacitance (C1) | Effective Resistance (Rr) | Pulling Sensitivity (TS RLD2) | Insulation Resistance | Spurious Response | Dimensions (L x W x H) | Reel Quantity |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Value | 8.192000 MHz | 20 pF | 30 ppm | 3 ppm | 3 ppm | -40+85 | -55+125 | 100 uW Max. | 5 pF Max. | 125 fF | 100 Max. | 1000+5000 ppm/pF | 500 M Min. (at DC 100V) | -3.0 dB Max. | 5.03.20.9 mm | 1,000 pcs per reel |
| Oscillation Mode | Fund | |||||||||||||||
| DLDH2 | 5 Max. | |||||||||||||||
| FDLDH | 5 Max. | |||||||||||||||
| DLD2 | 0.0130W/15 steps | |||||||||||||||
| DLDF | 30100W/10 steps | |||||||||||||||
| FDLD | 10030W/10 steps | |||||||||||||||
| DLD2 | 300.01W/15 steps | |||||||||||||||
| Others | - |
Dimensions (mm):
A: 5.400.1, B: 3.600.1, C: 1.450.1, D: 8.000.1, E: 12.00.2, F: 4.000.1, G: 1.550.05, H: 1.750.1, L: 1801.0, L1: 130.5, W: 16.50.2, W1: 12.0+1.0
Marking: LOGO, MHz, , ,
Reflow Condition: CX8.19
Material Composition:
- Base (1): Ceramics (Al2O3) - 41.84%
- Cover (2): 4J29 () - 18.68%
- Electrode (3): Metal (Cr, Ag) - 0.49%
- Adhesive (4): Polymer (Ag, SiO2, Petroleum Solvent, Silicone resin) - 1.22%
- Wafer (Blank): Quartz (SiO2) - 3.65%
- KV: Metal (Fe-Co-Ni, W, Ni, Au, Fe) - 15.69%
- (Metal): Metal (Ni, Co) - 18.44%
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