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General Purpose Multilayer Ceramic Capacitors Chinocera HGC1206R5106K350NSPJ for Electronic Circuits

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Price: Negotiable
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Product Description

Product Overview

The HGC General Purpose Series Multilayer Ceramic Capacitors (MLCCs) are designed for high-density, high-efficiency SMT applications. These capacitors are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, offering excellent electrical performance and high reliability. They are available in a wide range of sizes from 0201 to 1210, providing high capacitance in small sizes. Ideal for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.

Product Attributes

  • Brand: HGC (Hongming Huaci)
  • Supplier: Suining Hongming Huaci Technology Co., Ltd.
  • Series: General Purpose Series (4V~63V)
  • Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S

Technical Specifications

Specification Details
Part Name Multilayer Ceramic Capacitors
Series General Purpose Series (4V~63V)
Available Sizes 0201 ~ 1210
Applications General digital circuits, Power supply bypass, Consumer electronics, Telecommunication
How to Order (Example: HGC0805R7104K500NT)
  • Series: HGC
  • Size: 0201 (0603) to 1210 (3225)
  • Dielectric: R5=X5R, R7=X7R, G0=C0G
  • Capacitance: e.g., 104=100nF, 105=1F
  • Tolerance: A=0.05pF, B=0.1pF, C=0.25pF, D=0.5pF, F=1%, G=2%, J=5%, K=10%, L=15%, M=20%, S=-20%~+50%
  • Rated Voltage: 4R0=4Vdc, 6R3=6.3Vdc, 100=10Vdc, 160=16Vdc, 250=25Vdc, 500=50Vdc, 101=100Vdc, etc.
  • Termination: N=Cu/Ni/Sn, C=Cu/Resin/Ni/Sn
  • Packaging: T=Paper taping, B=Bulk, S=Embossed taping
  • Thickness Code: A=0.1mm to W=3.0mm
  • Reel Size: J=7Inch, D=13Inch, K=7Inch (12mm width tape)
Temperature Coefficient / Characteristics
Dielectric Reference Temperature Point Temperature Coefficient Operation Temperature Range
C0G 20C 0 30 ppm/ -55125
C0H 20C 0 60 ppm/ -55125
X7R 20C 15% -55125
X5R 20C 15% -5585
X7S 20C 22% -55125
X6S 20C 22% -55105
Product Peripheral Dimensions
Size (Inch/mm) Length L (mm) Width W (mm) Thickness T (mm)/Symbol End Width MB (mm)
0201 (0603) 0.600.03 0.300.03 0.300.03 C 0.150.05
0402 (1005) 1.000.05 0.500.05 0.500.05 E 0.250.10
0603 (1608) 1.600.20 0.800.20 0.800.20 H 0.400.15
0805 (2012) 2.000.20 1.250.20 0.700.10 G 0.500.20
1206 (3216) 3.200.20 1.600.20 0.700.10 G 0.600.20
1210 (3225) 3.200.30 2.500.30 1.250.20 L 0.750.25
Packaging Standard Quantity
Size Thickness (mm)/Symbol Paper Tape (7" reel) Plastic Tape (7" reel)
0201 (0603) 0.300.03 C 15,000 -
0402 (1005) 0.500.05 E 10,000 -
0603 (1608) 0.800.20 H 4000 -
0805 (2012) 0.700.10 G 4000 -
1206 (3216) 0.700.10 G 4000 -
1210 (3225) 1.250.20 L - 2000
Capacitance Range and Rated Voltage (Detailed tables for C0G/C0H, X7R, X5R, X7S, X6S are extensive and can be provided upon request or viewed in the full datasheet.)
Reliability Test
No. Item Technical Requirements Test Method
1 Appearance No remarkable defects or abnormalities. Microscope (10)
2 Size Within specified size range. Vernier caliper
3 Capacitance Within specified tolerance. Refer to datasheet for test conditions (frequency, voltage, temperature).
4 Dissipation Factor (DF, tan) Refer to datasheet for specifications by dielectric type, size, and voltage. Refer to datasheet for test conditions.
5 Insulation Resistance (IR) Class I: Ri50000M (C10nF), RiCR500S (C>10nF). Class II: Ri10000M (C25nF), RiCR>100S (C>25nF). Refer to datasheet for measuring voltage, duration, temperature, and humidity.
6 Dielectric Withstanding Voltage (DWV) No breakdown or damage. Class I: 300% Rated Voltage; Class II: 250% Rated Voltage (1-5s).
7 Solderability 95% terminal electrode coverage. Refer to datasheet for leaded/lead-free solder conditions.
8 Termination Adhesion No visible damage. Refer to datasheet for applied force and time by size.
9 Resistance to Soldering Heat Electrical performance and appearance within limits. Refer to datasheet for preheating, solder temperature, duration, and recovery time.
10 Resistance to Flexure of Substrate C/C 10%; No visible damage. Refer to datasheet for test board, flexure, speed, and holding time.
11 Moisture Resistance (Steady State) C/C: Class I 2% or 1pF; Class II 10%. DF 2x initial. IR within limits. 402, 90%~95%RH for 500h. Recovery 242h.
12 Temperature Cycle C/C: Class I 1% or 1pF; Class II 10%. 5 cycles from -55 to +125 (or other specified limits). Recovery 242h.
13 Durability C/C: Class I 2% or 1pF; Class II 20%. DF 2x initial. IR within limits. 1.5x Rated Voltage at specified temperature for 1000h. Recovery 242h.
Storage Methods
  • Guaranteed Period: 6 months (under deliver package condition).
  • Storage Conditions: Temperature 5~40, Relative Humidity 20%~70%.
Precautions For Use
  • MLCCs may fail in short or open circuit.
  • Failure modes such as burn out, flaming, or glowing can occur under severe electrical or mechanical stress beyond ratings.
  • Follow specified precautions for safety and application notes.
  • Soldering Conditions: Refer to temperature profile charts to avoid chip cracking or local explosion due to sudden temperature changes.
  • Manual Soldering: Handle carefully to avoid thermal shock and damage.
  • Solder Amount: Use optimum solder amount to avoid chip damage or poor connection.
  • Soldering Temperature Profiles: Refer to provided graphs for Reflow, Wave, and Hand soldering.
  • Temperature Differential (T): Keep T within specified limits during preheating (e.g., 150 for HGC0201 to HGC1206).
  • Hand Soldering Restrictions: Avoid direct contact of soldering iron tip with ceramic component.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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