Multilayer Ceramic Capacitors Chinocera HGC0402G04R3C500NTEJ Designed for High Density and Circuits
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The Hongming Huaci Technology Multilayer Ceramic Capacitors (MLCC) are designed for high-density and high-efficiency SMT applications. These general-purpose series capacitors are available in sizes from 0201 to 1210 and offer excellent electrical performance and high reliability. They are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectrics. Key features include a wide range of available sizes and high capacitance for their size. Applications span general digital circuits, power supply bypass, consumer electronics, and the telecommunication industry.
Product Attributes
- Brand: Hongming Huaci Technology ()
- Series: General Purpose Series (4V~63V)
- Origin: Suining, China
- Model Series Prefix: HGC
Technical Specifications
| Category | Specification | Details | ||
|---|---|---|---|---|
| Product Name | Multilayer Ceramic Capacitors | |||
| Series | General Purpose Series | (4V~63V) | ||
| Available Sizes | 0201 ~ 1210 | (0603 to 3225 in mm) | ||
| Dielectric Materials | NP0 (C0G/C0H), X7R, X5R, X7S, X6S | |||
| Key Features | Wide size selection, high capacity in small size | |||
| Applications | General digital circuits, power supply bypass, consumer electronics, telecommunication | |||
| Model Naming Convention | HGC (Series) + Size (e.g., 0805) + Dielectric (e.g., R7 for X7R) + Capacitance (e.g., 104 for 100nF) + Tolerance (e.g., K for 10%) + Rated Voltage (e.g., 500 for 50V) + Termination (e.g., N) + Packaging (e.g., T) + Thickness Code (e.g., H) + Reel Size (e.g., J) | |||
| Dielectric Characteristics | Material | Temp. Coefficient | Operating Temp. Range | |
| C0G | 0 30 ppm/ | -55125 | ||
| C0H | 0 60 ppm/ | -55125 | ||
| X7R | 15% | -55125 | ||
| X5R | 15% | -5585 | ||
| X7S | 22% | -55125 | ||
| X6S | 22% | -55105 | ||
| External Dimensions | Size (Inch/mm) | Length L (mm) | Width W (mm) | Thickness T (mm) |
| 0201 (0603) | 0.600.03 | 0.300.03 | 0.300.03 | |
| 0402 (1005) | 1.000.05 | 0.500.05 | 0.500.05 | |
| 0603 (1608) | 1.600.20 | 0.800.20 | 0.800.20 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.700.10 | |
| 1206 (3216) | 3.200.20 | 1.600.20 | 0.700.10 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 1.250.20 | |
| Packaging Standard Quantity | Size | Thickness (mm) | Paper Tape (7" reel) | Plastic Tape (7" reel) |
| 0201 (0603) | 0.300.03 | 15,000 | - | |
| 0402 (1005) | 0.500.05 | 10,000 | - | |
| 0603 (1608) | 0.800.20 | 4000 | - | |
| 0805 (2012) | 0.700.10 | 4000 | - | |
| 0805 (2012) | 0.800.20 | 4000 | - | |
| 1206 (3216) | 0.700.10 | 4000 | - | |
| 1206 (3216) | 0.800.20 | 4000 | - | |
| 1210 (3225) | 1.250.20 | - | 2000 | |
| 1210 (3225) | 1.600.20 | - | 2000 | |
| Reliability Test - Appearance & Electrical Performance | Item | Technical Requirements | Test Method | |
| Appearance | No remarkable defects or abnormalities | Microscope (10) | ||
| Size | Within specified range | Vernier caliper | ||
| Capacitance (Class I: C0G, C0H) | Within specified tolerance | 253; C1000pF: 1MHz10%, 1.00.2Vrms; C>1000pF: 1KHz10%, 1.00.2Vrms | ||
| Capacitance (Class II: X7R/X5R, X7S/X6S) | Within specified tolerance | 253; C10F: 1KHz10%, 1.00.2Vrms; C>10F: 12024 Hz, 0.50.1Vrms | ||
| Dissipation Factor (DF, tan) (Class I) | Specific values based on capacitance | 253; C1000pF: 1MHz10%, 1.00.2Vrms; C>1000pF: 1KHz10%, 1.00.2Vrms | ||
| Dissipation Factor (DF) (Class II) | Specific values based on voltage and capacitance | 253; C10F: 1KHz10%, 1.00.2Vrms; C>10F: 12024 Hz, 0.50.1Vrms | ||
| Insulation Resistance (IR) (Class I) | Specific values based on capacitance | Rated voltage; 605s; 50mA; 253; 75% RH | ||
| Insulation Resistance (IR) (Class II) | Specific values based on capacitance | Rated voltage; 605s; 50mA; 253; 75% RH | ||
| Dielectric Withstanding Voltage (DWV) | No breakdown or damage | Class I: 300% Rated voltage; Class II: 250% Rated voltage; 1-5s; 50mA max | ||
| Solderability | 95% tin coverage, no visible damage | Preheating 80-120 (10-30s); 2355 (20.5s) for Sn/Pb; 2455 (20.5s) for lead-free | ||
| Termination Adhesion | No visible damage | Specific force and time based on size (e.g., 2N for 0201, 10N for 1206) | ||
| Resistance to Soldering Heat | Electrical performance within limits, 95% tin coverage, no visible damage | Preheating 100-200 (20.5min); 2655 (101s); Recovery 242h | ||
| Resistance to Flexure of Substrate | C/C 10%, no visible damage | PCB Thickness 1.60.2mm; Flexure 1mm; Holding time 51s | ||
| Moisture Resistance (Steady State) | C/C: Class I 2% or 1pF; Class II 10%; DF 2x initial; IR within limits; No damage | 402, 90%-95%RH for 500h; Recovery 242h | ||
| Temperature Cycle | C/C: Class I 1% or 1pF; Class II 10% | 5 cycles: -55 (30min) -> +20 (2-3min) -> Upper Temp (30min) -> +20 (2-3min); Recovery 242h | ||
| Durability | C/C: Class I 2% or 1pF; Class II 20%; DF 2x initial; IR within limits; No damage | 1.5x Rated Voltage at specified temp (125/85/105) for 1000h; Recovery 242h | ||
| Storage Conditions | Temperature | Relative Humidity | Guaranteed Solderability Period | |
| 5~40 | 20%~70% | 6 months (under delivered package condition) | ||
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