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Multilayer Ceramic Capacitors Chinocera HGC1206R7333K500NTHJ General Purpose Series for Digital Circuits

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Price: Negotiable
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Product Description

Product Overview

The HGC General Purpose Series Multilayer Ceramic Capacitors (MLCCs) are designed for high-density, high-efficiency SMT applications. Available in sizes from 0201 to 1210, these capacitors are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, offering excellent electrical performance and high reliability. They are suitable for general digital circuits, power supply bypass capacitors, consumer electronics, and telecommunication applications.

Product Attributes

  • Brand: HGC
  • Supplier: (Suining Hongming Huaci Technology Co., Ltd.)
  • Series: General Purpose Series (4V~63V)
  • Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S

Technical Specifications

Specification Details
Part Name Multilayer Ceramic Capacitors
Series General Purpose Series (4V~63V)
Specification (Size) 0201 ~ 1210
Supplier Suining Hongming Huaci Technology Co., Ltd.
Issue Date 20201116
Product Features Wide selection of sizes (0201 to 1210), High capacity in small size.
Applications General digital circuits, Power supply bypass capacitors, Consumer electronics, Telecommunication.
How to Order (Example Structure) HGC [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size]
Temperature Coefficient/Characteristics
  • C0G: 0 30 ppm/, -55125
  • C0H: 0 60 ppm/, -55125
  • X7R: 15%, -55125
  • X5R: 15%, -5585
  • X7S: 22%, -55125
  • X6S: 22%, -55105
Product Peripheral Dimensions
Size (Inch/mm) Length L (mm) Width W (mm) Thickness T (mm)/Symbol Termination Width MB (mm) Soldering Method
0201 (0603) 0.600.03 0.300.03 0.300.03 C 0.150.05 R
0402 (1005) 1.000.05 0.500.05 0.500.05 E 0.250.10 R
0603 (1608) 1.600.20 0.800.20 0.800.20 H 0.400.15 R / W
0805 (2012) 2.000.20 1.250.20 0.700.10 G, 0.800.20 H, 1.250.20 L 0.500.20 R / W
1206 (3216) 3.200.20 1.600.20 0.700.10 G, 0.800.20 H, 1.000.10 J, 1.250.20 L, 1.600.20 P 0.600.20 R / W
1210 (3225) 3.200.30 2.500.30 1.250.20 L, 1.600.20 P, 2.000.20 U, 2.500.30 V 0.750.25 R
Packaging Standard Quantity
Size (mm) Thickness (mm)/Symbol Paper Tape (7" reel) Plastic Tape (7" reel)
0201 (0603)0.300.03 C15,000-
0402 (1005)0.500.05 E (C105), 0.500.20 E (C105)10,000-
0603 (1608)0.800.20 H4000-
0805 (2012)0.700.10 G, 0.800.20 H4000-
1206 (3216)0.700.10 G, 0.800.20 H4000-
1210 (3225)1.250.20 L, 1.600.20 P, 2.000.20 U, 2.500.30 V-2000-1000
Reliability Test - Appearance and Electrical Performance
ItemTechnical RequirementsTest Method
AppearanceNo remarkable defects or abnormalities.Microscope (10)
SizeWithin specified size range.Vernier caliper
CapacitanceShould be within specified tolerance.See detailed conditions in source.
Dissipation Factor (DF, tan)Refer to detailed specifications.See detailed conditions in source.
Insulation Resistance (IR)Refer to detailed specifications.See detailed conditions in source.
Dielectric Withstanding Voltage (DWV)No breakdown or damage.300% Rated Voltage (Class I), 250% Rated Voltage (Class II) for 1-5s.
Solderability95% tinning rate, no visible damage.Preheating 80-120 (10-30s), Sn/Pb 2355 (20.5s) or Lead-free 2455 (20.5s).
Termination AdhesionNo visible damage.2N (0201), 5N (0402-0805), 10N (1206) for 101s.
Resistance to Soldering HeatC/C, DF, IR within limits. Appearance: no visible damage, 95% tinning.Preheating 100-200 (20.5min), Solder 2655 (101s), Recovery 24h.
Resistance to Flexure of SubstrateC/C 10%, no visible damage.PCB 1.60.2mm, Flexure 1mm, Hold 51s.
Moisture Resistance (Steady State)C/C within limits, DF 2x initial, IR within limits, no visible damage.402, 90%-95%RH for 500h, Recovery 24h.
Temperature CycleC/C within limits.5 cycles of -55 to +125 (or other specified temps), Recovery 24h.
DurabilityC/C within limits, DF 2x initial, IR within limits, no visible damage.1.5x Rated Voltage at specified temperatures for 1000h, Recovery 24h.
Storage Methods Guaranteed solderability for 6 months. Storage Conditions: Temperature 5~40, Relative Humidity 20%~70%.
Precautions for Use MLCCs may fail in short or open circuits. Avoid severe conditions beyond ratings. Follow safety precautions and application notes. Refer to technical department for any uncertainties.
Soldering Profile Follow recommended temperature curves to avoid cracking or explosion. Refer to enclosure for graphs.
Manual Soldering Handle carefully to avoid thermal shock. Pay attention to soldering iron tip selection and temperature control. Avoid direct contact with ceramic body.
Optimum Solder Amount Ensure appropriate solder amount for reflow and wave soldering to prevent damage or poor connection.
Recommended Soldering Temperature Profile Includes Reflow Soldering (SnPb and Lead-free) and Wave Soldering profiles. Minimize temperature differential (T) during preheating (T150 for most sizes, T130 for HGC1210). Hand soldering: Max 350, Max 20W, Max 3s, avoid direct contact with ceramic.
Typical Characteristic Data Graph Includes |Z|-Frequency Characteristics, Temperature Characteristics, and DC Bias Characteristics. (Note: These are for reference only.)

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Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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