Multilayer Ceramic Capacitors Chinocera HGC0805R5476M100NSLJ Designed for High Density SMT Applications
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Negotiable
MOQ:
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Delivery Time:
Negotiable
Product Description
Product Overview
The Suining Hongming Huaci Technology Co., Ltd. Multilayer Ceramic Capacitors (MLCC) are designed for high-density and high-efficiency SMT applications. These general-purpose series capacitors are available in sizes from 0201 to 1210 and offer excellent electrical performance and high reliability. They are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials. Key features include a wide range of selectable sizes and high capacitance in small dimensions. Applications include general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.
Product Attributes
- Brand: HGC
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Category | Specification | Details | |||||
|---|---|---|---|---|---|---|---|
| General Information | Version | HC202002 | |||||
| Issue Date | 20201116 | ||||||
| Product Type | Multilayer Ceramic Capacitors | ||||||
| Series | General Purpose Series | 4V~63V | |||||
| Available Sizes | 0201 ~ 1210 | ||||||
| Features | Wide size selection (0201 to 1210) | ||||||
| High capacity in small size | |||||||
| Applications | General digital circuits | ||||||
| Power supply bypass | |||||||
| Consumer electronics | |||||||
| Telecommunication industry | |||||||
| Model Designation | HGC [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size] | See detailed breakdown in document | |||||
| Dielectric Characteristics | Material | Reference Temp. | Temp. Coefficient | Operating Temp. Range | |||
| C0G | 20C | 30 ppm/ | -55C ~ 125C | ||||
| C0H | 20C | 60 ppm/ | -55C ~ 125C | ||||
| X7R | 20C | 15% | -55C ~ 125C | ||||
| X5R | 20C | 15% | -55C ~ 85C | ||||
| X7S | 20C | 22% | -55C ~ 125C | ||||
| X6S | 20C | 22% | -55C ~ 105C | ||||
| External Dimensions | Size (Inch/mm) | Length L (mm) | Width W (mm) | Thickness T (mm) / Code | Termination Width MB (mm) | ||
| 0201 (0603) | 0.600.03 | 0.300.03 | 0.300.03 C | 0.150.05 | |||
| 0402 (1005) | 1.000.05 | 0.500.05 | 0.500.05 E | 0.250.10 | |||
| 0603 (1608) | 1.600.20 | 0.800.20 | 0.800.20 H | 0.400.15 | |||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.700.10 G, 0.800.20 H, 1.250.20 L | 0.500.20 | |||
| 1206 (3216) | 3.200.20 | 1.600.20 | 0.700.10 G, 0.800.20 H, 1.000.10 J, 1.250.20 L, 1.600.20 P | 0.600.20 | |||
| 1210 (3225) | 3.200.30 | 2.500.30 | 1.250.20 L, 1.600.20 P, 2.000.20 U, 2.500.30 V | 0.750.25 | |||
| Soldering Method | R=Reflow Soldering | W=Wave Soldering | |||||
| Packaging Quantity | Size | Thickness (mm) / Symbol | Paper Tape (7" reel) | Plastic Tape (7" reel) | |||
| 0201 (0603) | 0.300.03 C | 15,000 | - | ||||
| 0402 (1005) | 0.500.05 E (C105) | 10,000 | - | ||||
| 0.500.20 E (C105) | 10,000 | - | |||||
| 0603 (1608) | 0.800.20 H | 4000 | - | ||||
| 0805 (2012) | 0.700.10 G | 4000 | - | ||||
| 0.800.20 H | 4000 | - | |||||
| 1.250.20 L | - | 2000/3000 | |||||
| 1206 (3216) | 0.700.10 G | 4000 | - | ||||
| 0.800.20 H | 4000 | - | |||||
| 1.000.10 J | - | 3000 | |||||
| 1.250.20 L | - | 3000 | |||||
| 1.600.20 P | - | 2000 | |||||
| 1210 (3225) | 1.250.20 L | - | 2000 | ||||
| 1.600.20 P | - | 2000 | |||||
| 2.000.20 U | - | 2000 | |||||
| 2.500.30 V | - | 1000 | |||||
| Capacitance Range & Voltage | Dielectric | Size | Rated Voltage (VDC) | ||||
| C0G, C0H | 0201 | 16, 25, 50 | |||||
| 0402 | 25, 50 | ||||||
| 0603 | 25, 50, 10, 16, 25, 50 | ||||||
| 0805 | 10, 16, 25, 50, 10, 16, 25, 50 | ||||||
| 1206 | 10, 16, 25, 50, 10, 16, 25, 50 | ||||||
| 1210 | 10, 16, 25, 50, 10, 16, 25, 50 | ||||||
| X7R | 0201 | 6.3, 10, 16, 25, 50 | |||||
| 0402 | 6.3, 10, 16, 25, 50 | ||||||
| 0603 | 6.3, 10, 16, 25, 50 | ||||||
| 0805 | 6.3, 10, 16, 25, 50 | ||||||
| 1206 | 6.3, 10, 16, 25, 50 | ||||||
| 1210 | 10, 16, 25, 50 | ||||||
| X7S | 0402 | 6.3, 10, 16, 25 | |||||
| 0603 | 6.3, 10, 16, 25 | ||||||
| 0805 | 10, 16, 25, 50, 100 | ||||||
| 1206 | 6.3, 10, 16, 25, 50 | ||||||
| 1210 | 6.3, 10, 16, 25, 50 | ||||||
| X5R | 0201 | 6.3, 10, 16, 25, 50 | |||||
| 0402 | 6.3, 10, 16, 25, 50 | ||||||
| 0603 | 6.3, 10, 16, 25, 35, 50 | ||||||
| 0805 | 6.3, 10, 16, 25, 35, 50 | ||||||
| 1206 | 6.3, 10, 16, 25, 35, 50 | ||||||
| 1210 | 4, 6.3, 10, 16, 25, 35, 50 | ||||||
| X6S | 0402 | 6.3, 10, 16, 25 | |||||
| 0603 | 4, 6.3, 10, 16, 25 | ||||||
| 0805 | 4, 6.3, 10, 16, 25, 50 | ||||||
| 1206 | 4, 6.3, 10, 16, 25, 50 | ||||||
| 1210 | 4, 6.3, 10, 16, 25, 50 | ||||||
| Reliability Test | Item | Technical Requirements | Test Method and Remarks | ||||
| Appearance | No remarkable defects or abnormalities. | Through microscope (10) | |||||
| Size | Within the specified size range | Using a vernier caliper | |||||
| Capacitance | Should be within the specified tolerance. | Test Temp: 253. Conditions vary by Class and capacitance value. | |||||
| Dissipation Factor (DF, tan) | Class I: Specific DF standards based on capacitance. Class II: Specific DF standards based on rated voltage and capacitance. | Test Temp: 253. Conditions vary by Class and capacitance value. | |||||
| Insulation Resistance (IR) | Class I: Ri50000M (C10nF), RiCR500S (C>10nF). Class II: Ri10000M (C25nF), RiCR>100S (C>25nF). | Measuring Voltage: Rated voltage. Duration: 605 sec. Test Temp: 253. | |||||
| Dielectric Withstanding Voltage (DWV) | No breakdown or damage. | Measuring Voltage: 300% Rated voltage (Class I), 250% Rated voltage (Class II). Duration: 1~5s. | |||||
| Solderability | At least 95% of the terminal electrode is covered by new solder. Visual Appearance: No visible damage. | Preheating: 80~120; 10~30s. Soldering Temp: 2355 (Leaded) / 2455 (Lead-free). Duration: 20.5s. | |||||
| Termination Adhesion | No visible damage. | Applied Force: 2N (0201), 5N (0402-0805), 10N (1206). Time: 101s. | |||||
| Resistance to Soldering Heat | C/C: 0.5% (Class I), -5%~+10% (Class II). DF & IR: Same to initial standard. Appearance: No visible damage, solder coverage 95%. | Preheating (Class II): 100~200; 20.5min. Solder Temp: 2655. Duration: 101s. Recovery: 242h. (1210 and above: Reflow Soldering) | |||||
| Resistance to Flexure of Substrate | C/C: 10%. Appearance: No visible damage. | Test Board: PCB Thickness 1.60.2mm. Flexure: 1mm. Holding time: 51s. | |||||
| Moisture Resistance (Steady State) | C/C: 2% or 1pF (Class I), 10% (Class II). DF: 2x initial. IR: Class I: Ri2500M or RiCR25S. Class II: Ri1000M or RiCR25S. Appearance: No visible damage. | Temp: 402. Humidity: 90%~95%RH. Duration: 500h. Recovery: 242h. | |||||
| Temperature Cycle | C/C: 1% or 1pF (Class I), 10% (Class II). | 5 cycles. Temp range: -55C to +125C (or +85C/+105C for X5R/X6S). Recovery: 242h. | |||||
| Durability | C/C: 2% or 1pF (Class I), 20% (Class II). DF: 2x initial. IR: Class I: Ri4000M or RiCR40S. Class II: Ri2000M or RiCR50S. Appearance: No visible damage. | Applied Voltage: 1.5x Rated Voltage. Duration: 1000h. Temp: 125C (or 85C/105C). Recovery: 242h. | |||||
| Packaging | Taping Structure | Dimensions | Unit: mm | ||||
| Paper Taping (0201, 0402) | A0, B0, W, F*, E, P1, P2*, P0, D0, T | See detailed dimensions in document | |||||
| Paper Taping (0603, 0805, 1206) | A, B, C, D*, E, F, G*, H, J, T | See detailed dimensions in document | |||||
| Embossed Taping (0805~1812) | Tapesize, A, B, C, D*, E, F, G*, H, J, T | See detailed dimensions in document | |||||
| Reel Dimensions | 8mm/7REEL, 13REEL, 12mm/7REEL | A, B, C, D, E, F, G | See detailed dimensions in document | ||||
| Taping Specification | Top tape peeling strength: 0.1N | ||||||
| Storage Methods | Guaranteed solderability period | 6 months (Under deliver package condition) | Storage Temp: 5~40. Relative Humidity: 20%~70%. | ||||
| Precautions For Use | Soldering Profile | Follow recommended temperature profiles to avoid cracking or explosion. | Refer to graphs in enclosure. | ||||
| Manual Soldering | Handle carefully to avoid thermal shock. Use appropriate tip and temperature control. | Avoid direct contact of soldering iron tip with ceramic body. | |||||
| Optimum Solder Amount | Ensure adequate solder for proper connection without causing stress. | Refer to diagrams for reflow, wave, and rework soldering. | |||||
| Recommended Soldering Temperature Profile | Reflow Soldering (Leaded/Lead-free), Wave Soldering, Hand Soldering | Temperature differentials (T) should be minimized. See tables and conditions. | |||||
| Typical Characteristic Data | Graphs provided for: | |Z|-Frequency Characteristics | Temperature Characteristics | DC Bias Characteristics | |||
| Note | Product characteristics are for reference only. | ||||||
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina